HS-1825ARH Data Sheet Radiation Hardened High-Speed, Dual Output PWM The Radiation Hardened HS-1825ARH Pulse Width Modulator is designed to be used in high frequency switched-mode power supplies and can be used in either current-mode or voltage-mode. It is well suited for singleended boost converter applications. Device features include a precision voltage reference, low power start-up circuit, high frequency oscillator, wide-band error amplifier, and fast current-limit comparator. The use of proprietary process capabilities and unique design techniques results in fast propagation delay times and high output current over a wide range of output voltages. January 2000 File Number 4561.4 Features • Electrically Screened to DESC SMD # 5962-99558 • QML Qualified per MIL-PRF-38535 Requirements • Radiation Environment - Maximum Total Dose . . . . . . . . . . . . . 3 x 105 RAD(SI) - Vertical Architecture Provides Low Dose Rate Immunity - DI RSG Process Provides Latch-Up Immunity • Low Start-Up Current . . . . . . . . . . . . . . . . . . . 100µA (Typ) • Fast Propagation Delay . . . . . . . . . . . . . . . . . . 80ns (Typ) • 12V to 20V Operation • 1A (Peak) Dual Output Drive Capability Constructed with the Intersil Rad Hard Silicon Gate (RSG) Dielectric Isolation BiCMOS process, the HS-1825ARH has been specifically designed to provide highly reliable performance when exposed to harsh radiation environments. • 5.1V Reference Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed below must be used when ordering. • Switching Frequencies to 500kHz • Under-Voltage Lockout • Programmable Soft-Start • Trimmed Oscillator Discharge Current • Latched Overcurrent Comparator with Full Cycle Restart Detailed Electrical Specifications for the HS-1825ARH are contained in SMD 5962-99558. That document may be easily downloaded from our website. www.intersil.com/spacedefense/space.asp • Programmable Leading Edge Blanking Circuit Applications • Current or Voltage Mode Switching Power Supplies Ordering Information • Motor Speed and Direction Control ORDERING NUMBER INTERSIL MKT. NUMBER TEMP. RANGE (oC) 5962F9955801VEC HS1-1825ARH-Q -55 to 125 5962F9955801QEC HS1-1825ARH-8 -55 to 125 5962F9955801VXC HS9-1825ARH-Q -55 to 125 5962F9955801QXC HS9-1825ARH-8 -55 to 125 HS1-1825ARH/Proto HS1-1825ARH/Proto -55 to 125 HS9-1825ARH/Proto HS9-1825ARH/Proto -55 to 125 Pinout HS-1825ARH SBDIP (CDIP2-T16) AND FLATPACK (CDFP4-F16) TOP VIEW INV 1 NON-INV 2 15 VCC E/A OUT 3 14 OUTPUT B CLOCK 4 13 VC RT 5 12 POWER GND CT 6 11 OUTPUT A RAMP 7 SOFT START 8 1 16 VREF 5.1V 10 GND 9 ILIM/SD CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 2000 HS-1825ARH Die Characteristics DIE DIMENSIONS: Backside Finish: 4710µm x 3570µm (185 mils x 140 mils) Thickness: 483µm ±25.4µm (19 mils ±1 mil) INTERFACE MATERIALS: Silicon ASSEMBLY RELATED INFORMATION: Substrate Potential: Glassivation: Unbiased (DI) Type: PSG (Phosphorous Silicon Glass) Thickness: 8.0kÅ ±1.0kÅ ADDITIONAL INFORMATION: Worst Case Current Density: Top Metallization: <2.0 x 105 A/cm2 Type: ALSiCu Thickness: 16.0kÅ ±2kÅ Transistor Count: Substrate: 225 Radiation Hardened Silicon Gate, Dielectric Isolation Metallization Mask Layout HS-1825ARH (4) CLK/LEB RT (5) (3) EAOUT CT (6) (2) IN+ RAMP (7) (1) INSS (8) (16) VREF ILIM (9) OSCGND (NOTE 1) (15) VCC GND (10) (14) OUTB OUTA (11) (12) PGND (NOTE 2) PGND (12) (NOTE 2) (13) VC (NOTE 2) VC (13) (NOTE 2) NOTES: 1. This is the oscillator ground (OSCGND) bond pad and must be connected to GND. 2. PGND and VC each require two bond pad connections. All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site www.intersil.com 2