ISL24021 ® Data Sheet June 3, 2009 1A Rail-to-Rail Input-Output Operational Amplifier FN6637.0 Features • ±1A Output Short Circuit Current The ISL24021 is a high output current, high voltage, rail-to-rail voltage feedback amplifier. The ISL24021 is capable of ±1A peak output short circuit current. The amplifier exhibits beyond the rail input capability, rail-to-rail output capability and is unity gain stable. The operating supply voltage range is from 4.5V to 19V maximum and the ISL24021 can be configured for single or dual supply operation. The ISL24021 has the ability to quickly source and sink large peak currents up to ±1A and to drive large continuous currents of ±300mA. The ISL24021 features fast slewing and settling times. Also, the device provides common mode input capability beyond the supply rails, and rail-to-rail output capability. This enables the amplifier to offer maximum dynamic range at any supply voltage. These features make the ISL24021 an ideal solution as a VCOM driver in TFT-LCD panel applications. Other applications may include battery power and portable devices, and especially where low power consumption is important. • 4.5V to 19V Maximum Supply Voltage Range • 2.0mA Supply Current • 18V/µs Slew Rate • 25MHz -3dB Bandwidth • ±300mA Continuous Output Current • Unity-Gain Stable • Beyond the Rails Input Capability • Rail-to-Rail Output Swing • Built-in Thermal Protection • -40°C to +85°C Ambient Temperature Range • Pb-Free (RoHS Compliant) Applications • TFT-LCD Panels The ISL24021 is available in a 8 Ld 3mmx3mm TDFN package featuring a standard operational amplifier pinout with a lead pitch of 0.65mm. The device utilizes a thermally enhanced package and has a built-in thermal protection circuit. It is specified for operation over an ambient temperature range of -40°C to +85°C. • VCOM Driver Pinout • Battery-Powered Applications ISL24021 (8 LD TDFN) TOP VIEW NC 1 INN 2 THERMAL PAD INP 3 • Active Filters • Test Equipment Ordering Information 8 NC 7 VDD 5 NC THERMAL PAD IS ELECTRICALLY ISOLATED, OR CONNECTED TO VSS 1 • Audio Processing • Portable Equipment 6 OUT VSS 4 • Video Processing PART NUMBER (Note) LEAD PITCH PART PACKAGE PKG. (mm) MARKING (Pb-Free) DWG. # ISL24021IRT065Z 0.65 P021 8 Ld TDFN L8.3x3A ISL24021IRT065Z-T13* 0.65 P021 8 Ld TDFN L8.3x3A *Please refer to TB347 for details on reel specifications NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2009. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL24021 Absolute Maximum Ratings (TA = +25°C) Thermal Information Supply Voltage Range (VDD -VSS) . . . . . . . . . . . . . . . . . . . . . 19.8V Input Voltage Range (INN, INP). . . . . . . . . . VSS - 0.5V, VDD + 0.5V Input Differential Voltage (INP - INN) . . . (VDD + 0.5V) - (VSS - 0.5V) ESD Rating Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3000V Thermal Resistance (Typical, Note 1) θJA (°C/W) 8 Ld TDFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Ambient Operating Temperature . . . . . . . . . . . . . . . .-40°C to +85°C Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . see Figure 28 Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTE: 1. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA Electrical Specifications PARAMETER VDD = 5V, VSS = -5V, RL = 1kΩ to 0V, TA = +25°C, Unless Otherwise Specified. DESCRIPTION CONDITIONS MIN (Note 4) TYP MAX (Note 4) UNIT 19 V 2.8 mA POWER SUPPLY PERFORMANCE VDD - VSS Supply Voltage Range 4.5 IS Supply Current No load PSRR Power Supply Rejection Ratio VS is moved from ±2.25V to ±9.5V 2.1 60 80 dB INPUT CHARACTERISTICS VOS Input Offset Voltage TCVOS Average Offset Voltage Drift (Note 2) ILEAK Input Leakage Current VCM = 0V 1.4 VCM = 0V 2 15 1 mV µV/°C 10 nA RIN Input Resistance 1 GΩ CIN Input Capacitance 2 pF CMIR Common-Mode Input Range VSS0.5 VDD+ 0.5 V CMRR Common-Mode Rejection Ratio For VIN from -5.5V to 5.5V 50 70 dB AVOL Open-Loop Gain -4.5V ≤ VOUT ≤ 4.5V 75 100 dB VDD0.15 VDD0.025 V OUTPUT CHARACTERISTICS VOH Output Swing High IL= 5mA, VIN = VDD VOL Output Swing Low IL= -5mA,VIN = VSS ISC Short-Circuit Current ±1.0 A IOUT Continuous Output Current (Note 6) ±300 mA VSS+ 0.025 VSS+ 0.15 V DYNAMIC PERFORMANCE SR Slew Rate (Note 3) -4.0V ≤ VOUT ≤ 4.0V 18 V/µs tS Settling to 0.1% (Note 5) AV = +1, VO = 2V step 80 ns BW -3dB Bandwidth AV = +1, RL = 1kΩ, CL= 8pF 25 MHz PM Phase Margin RL = 1kΩ, CL= 8pF 44 ° THERMAL PERFORMANCE TTS Thermal Shutdown Temperature Die temperature at which the device will shutdown until it cools by TTSH °C +165 °C TTSH Thermal Shutdown Hysteresis Die temperature below TTS °C when the device will become operational after shutdown 15 °C 2 FN6637.0 June 3, 2009 ISL24021 . Electrical Specifications PARAMETER VDD = 5V, VSS = GND = 0V, RL = 1kΩ to 2.5V, TA = +25°C, Unless Otherwise Specified. DESCRIPTION CONDITION MIN (Note 4) TYP MAX (Note 4) 19 V 2.0 2.8 mA UNIT POWER SUPPLY PERFORMANCE VDD - VSS Supply Voltage Range IS Supply Current No load 4.5 PSRR Power Supply Rejection Ratio VS is moved from +4.5V to +19V 60 80 dB INPUT CHARACTERISTICS VOS Input Offset Voltage TCVOS Average Offset Voltage Drift (Note 2) ILEAK Input Leakage Current RIN Input Resistance VCM = 2.5V 1.4 15 1 VCM = 2.5V 2 mV µV/°C 10 1 nA GΩ CIN Input Capacitance CMIR Common-Mode Input Range 2 CMRR Common-Mode Rejection Ratio For VIN from -0.5V to 5.5V 45 70 dB AVOL Open-Loop Gain 0.5V ≤ VOUT ≤ 4.5V 70 100 dB VDD0.15 VDD0.025 V VSS0.5 pF VDD+ 0.5 V OUTPUT CHARACTERISTICS VOH Output Swing High IL= 5mA, VIN = VDD VOL Output Swing Low IL= -5mA,VIN = VSS ISC Short-Circuit Current ±0.5 A IOUT Continuous Output Current (Note 6) ±300 mA VSS+ 0.025 VSS+ 0.15 V DYNAMIC PERFORMANCE SR Slew Rate (Note 3) 1V ≤ VOUT ≤ 4V 15 V/µs tS Settling to 0.1% (Note 5) AV = +1, VO = 2V step 80 ns BW -3dB Bandwidth AV = +1, RL = 1kΩ, CL= 8pF 22 MHz PM Phase Margin RL = 1kΩ, CL= 8pF 46 ° THERMAL PERFORMANCE TTS Thermal Shutdown Temperature Die temperature at which the device will shutdown until it cools by TTSH °C +165 °C TTSH Thermal Shutdown Hysteresis Die temperature below TTS °C when the device will become operational after shutdown 15 °C Electrical Specifications PARAMETER VDD = 15V, VSS = GND = 0V, RL = 1kΩ to 7.5V, TA = +25°C, Unless Otherwise Specified. DESCRIPTION CONDITION MIN (Note 4) TYP MAX (Note 4) UNIT 19 V 2.8 mA POWER SUPPLY PERFORMANCE VDD - VSS Supply Voltage Range IS Supply Current No load PSRR Power Supply Rejection Ratio VS is moved from +4.5V to +19V 4.5 2.2 60 80 dB INPUT CHARACTERISTICS VOS Input Offset Voltage TCVOS Average Offset Voltage Drift (Note 2) 3 VCM = 7.5V 1.4 1 15 mV µV/°C FN6637.0 June 3, 2009 ISL24021 Electrical Specifications PARAMETER VDD = 15V, VSS = GND = 0V, RL = 1kΩ to 7.5V, TA = +25°C, Unless Otherwise Specified. (Continued) DESCRIPTION MIN (Note 4) CONDITION VCM = 7.5V TYP MAX (Note 4) UNIT 2 10 nA ILEAK Input Leakage Current RIN Input Resistance 1 GΩ CIN Input Capacitance 2 pF CMIR Common-Mode Input Range CMRR Common-Mode Rejection Ratio For VIN from -0.5V to 15.5V 50 70 dB AVOL Open-Loop Gain 0.5V ≤ VOUT ≤ 14.5V 75 95 dB VDD 0.4 V VDD 0.025 V IL= -100mA,VIN = VSS VSS + 0.4 V IL= -7.5mA,VIN = VSS VSS + 0.025 VSS0.5 VDD+ 0.5 V OUTPUT CHARACTERISTICS VOH Output Swing High IL= 100mA, VIN = VDD IL= 7.5mA, VIN = VDD Output Swing Low VOL VDD 0.15 VSS + 0.15 V ISC Short-Circuit Current ±1.0 A IOUT Continuous Output Current (Note 6) ±300 mA DYNAMIC PERFORMANCE SR Slew Rate (Note 3) 1V ≤ VOUT ≤ 14V 19 V/µs tS Settling to 0.1% (Note 5) AV = +1, VO = 2V step 80 ns BW -3dB Bandwidth AV = +1, RL = 1kΩ, CL= 8pF 27 MHz PM Phase Margin RL = 1kΩ, CL= 8pF 42 ° THERMAL PERFORMANCE TTS Thermal Shutdown Temperature Die temperature at which the device will shutdown until it cools by TTSH °C +165 °C TTSH Thermal Shutdown Hysteresis Die temperature below TTS °C when the device will become operational after shutdown 15 °C NOTES: 2. Measured over the -40°C to +85°C ambient operating temperature range. 3. Typical slew rate is an average of the slew rates measured on the rising (20% to 80%) and the falling (80% to 20%) edges of the output signal. 4. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. 5. Settling time measured from [Full Scale - (0.1%*StepSize)] on the rising edge to when the output is bounded within ±0.1% of full scale. 6. Continuous output current with a typical of ±300mA. Care should be taken to ensure the maximum package power dissipation is not exceeded, refer to “Power Dissipation” on page 10. Pin Descriptions PIN NUMBER PIN NAME 1, 5, 8 NC PIN TYPE PIN FUNCTION 2 INN Analog Input Amplifier negative input 3 INP Analog Input Amplifier positive input No Connection 4 VSS Analog Power Negative power supply (connect to GND for single supply operation) 6 OUT Analog Output Amplifier output 7 VDD Analog Power Positive power supply 4 FN6637.0 June 3, 2009 ISL24021 Typical Performance Curves 1.0 500 VS = ±5V TA = +25°C 400 INPUT OFFSET VOLTAGE (mV) NUMBER OF DEVICES 450 TYPICAL PRODUCTION DISTRIBUTION 350 300 250 200 150 100 50 0 -6 -4 -2 0 2 4 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.8 -1.0 -50 6 VS = ±5V 0.8 0 50 TEMPERATURE (°C) INPUT OFFSET VOLTAGE (mV) FIGURE 1. INPUT OFFSET VOLTAGE DISTRIBUTION 4.972 OUTPUT HIGH VOLTAGE (V) INPUT LEAKAGE CURRENT (nA) VS = ±5V AV = 1 RL = 1kΩ VS = ±5V 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 -50 0 50 100 4.970 4.968 4.966 4.964 4.962 4.960 -50 150 0 FIGURE 3. INPUT LEAKAGE CURRENT vs TEMPERATURE 100 150 FIGURE 4. OUTPUT HIGH VOLTAGE vs TEMPERATURE 120 -4.980 VS = ±5V VS = ±5V AV = 1 RL = 1kΩ OPEN LOOP GAIN (dB) OUTPUT LOW VOLTAGE (V) 50 TEMPERATURE (°C) TEMPERATURE (°C) -4.984 -4.986 -4.988 -4.990 -4.992 -50 150 FIGURE 2. INPUT OFFSET VOLTAGE vs TEMPERATURE 2.0 -4.982 100 0 50 100 TEMPERATURE (°C) FIGURE 5. OUTPUT LOW VOLTAGE vs TEMPERATURE 5 150 110 100 90 80 70 -50 0 50 100 150 TEMPERATURE (°C) FIGURE 6. OPEN-LOOP GAIN vs TEMPERATURE FN6637.0 June 3, 2009 ISL24021 Typical Performance Curves (Continued) 100 100 VS = ±5V VS = ±5V 90 90 CMRR (dB) PSRR (dB) 95 85 80 80 70 60 75 70 -50 0 50 TEMPERATURE (°C) 100 50 -50 150 22 100 2.6 20 SUPPLY CURRENT (mA) VS = ±5V AV = 2 RL = 1kΩ 18 16 14 -50 0 50 100 2.4 2.2 2.0 1.8 1.6 -50 150 0 50 100 150 TEMPERATURE (°C) FIGURE 10. SUPPLY CURRENT vs TEMPERATURE FIGURE 9. SLEW RATE vs TEMPERATURE 4.0 140 TA = +25°C TA = +25°C RL = OPEN CL = OPEN SUPPLY CURRENT (mA) 3.5 120 100 80 60 40 4 150 VS = ±5V AV = 1 TEMPERATURE (°C) GAIN (dB) 50 TEMPERATURE (°C) FIGURE 8. CMRR vs TEMPERATURE FIGURE 7. PSRR vs TEMPERATURE SLEW RATE (V/µs) 0 3.0 2.5 2.0 1.5 1.0 0.5 8 12 SUPPLY VOLTAGE (V) 16 FIGURE 11. OPEN-LOOP GAIN vs SUPPLY VOLTAGE 6 20 4 8 12 16 20 SUPPLY VOLTAGE (V) FIGURE 12. SUPPLY CURRENT vs SUPPLY VOLTAGE FN6637.0 June 3, 2009 ISL24021 Typical Performance Curves (Continued) 10 5 V = ±5V 4 AS = 1 V 3 CL = 1.5pF 4 560Ω 1 GAIN (dB) 0 -1 0 -2 -2 -6 150Ω -4 -8 -5 100k 1M 10M FREQUENCY (Hz) -10 100k 100M 5 160 GAIN (dB) 80 GAIN (dB) STEP SIZE (V) 180 100 2 1 0 0.1% -1 120 40 100 20 80 0 -3 -40 -4 -60 -5 50 -80 10 100 110 40 20 VS = ±5V TA = +25°C 100 0 1k 10k 100k 1M 10M -20 100M FREQUENCY (Hz) FIGURE 15. STEP SIZE vs SETTLING TIME FIGURE 16. OPEN LOOP GAIN AND PHASE 10 -10 VS = ±5V RL = 1kΩ TA = +25°C 0 -10 VS = ±5V RL = 1kΩ TA = +25°C -20 PSRR (dB) CMRR (dB) 60 PHASE (°) -20 70 80 90 SETTLING TIME (ns) 140 60 -2 -30 100M 120 VS = ±5V AV = 1 RL = 1kΩ 60 1M 10M FREQUENCY (Hz) FIGURE 14. FREQUENCY RESPONSE FOR VARIOUS CL FIGURE 13. FREQUENCY RESPONSE FOR VARIOUS RL -20 10pF 100pF -4 -3 3 47pF 2 PHASE(°) GAIN (dB) 6 1kΩ 2 4 VS = ±5V AV = 1 RL = OPEN 8 -40 -50 -60 -30 PSRR- -40 -50 -60 -70 -70 -80 -90 100 PSRR+ -80 1k 10k 100k 1M FREQUENCY (Hz) FIGURE 17. CMRR vs FREQUENCY 7 10M 100M -90 100 1k 10k 100k 1M FREQUENCY (Hz) 10M 100M FIGURE 18. PSRR vs FREQUENCY FN6637.0 June 3, 2009 ISL24021 Typical Performance Curves (Continued) VS = ±5V AV = 1 RL = 1kΩ VOLTAGE NOISE (nV/√Hz) 1000 100 10 6V STEP 200ns/DIV 1 10 100 1k 10k 100k FREQUENCY (Hz) 1M 10M 100M FIGURE 19. INPUT VOLTAGE NOISE SPECTRAL DENSITY FIGURE 20. LARGE SIGNAL TRANSIENT RESPONSE VS = ±5V AV = 1 RL = 1kΩ INN VDD INP ISL24021 4.7µF 0.1µF VSS 200mV STEP 200ns/DIV 4.7µF OUT 0.1µF RL CL THERMAL PAD CONNECTED TO VSS FIGURE 21. SMALL SIGNAL TRANSIENT RESPONSE 8 FIGURE 22. TEST CIRCUIT FN6637.0 June 3, 2009 ISL24021 Applications Information VS = ±2.5V, TA = +25°C, AV = 1, VIN = 6VP-P Product Description 1V 10µs The ISL24021 is a high output current, high voltage, rail-to-rail voltage feedback amplifier. The ISL24021 is capable of ±1A peak output short circuit current. The amplifier exhibits beyond the rail input capability, rail-to-rail output capability and is unity gain stable. Other features include fast slew rate and settling time which is important in many applications, such as TFT-LCD panels. Operating Voltage, Input and Output Capability 1V FIGURE 23. OPERATION WITH BEYOND-THE-RAILS INPUT . VS = ±5V, TA = +25°C, AV = 1, VIN = 10VP-P 5V The input common mode voltage range extends 0.5V beyond the supply rails. For this range, the ISL24021 amplifier is immune to phase reversal. If the common mode input voltage exceeds the supply voltage by more than 0.5V, electrostatic protection diodes in the input stage of the device begin to conduct. It is suggested to not overdrive the inputs. Figure 23 shows the input voltage driven beyond the supply rails and the device output swinging between the supply rails. Output Current Limit The output swings of the ISL24021 typically extend to within 25mV of positive and negative supply rails with load currents of ±5mA. Decreasing load currents will extend the output voltage range even closer to the supply rails. Figure 24 shows the input and output waveforms for the device in a unity-gain configuration. Operation is from ±5V supply with a 1kΩ load connected to GND. The input is a 10VP-P sinusoid and the output voltage is approximately 9.95VP-P. Driving Capacitive Loads Refer to the “Electrical Specifications” tables beginning on page 2 for specific device parameters. Parameter variations with operating voltage, loading and/or temperature are shown in the “Typical Performance Curves” on page 5. 10µs INPUT The ISL24021 can operate on a single supply or dual supply configuration. The ISL24021 operating voltage ranges from a minimum of 4.5V to a maximum of 19V. This range allows for a standard 5V (or ±2.5V) supply voltage to dip to -10%, or a standard 18V (or ±9V) to rise by +5.5% without affecting performance or reliability. 5V OUTPUT The ISL24021 is available in a 8 Ld 3mmx3mm TDFN package featuring a standard operational amplifier pinout and a lead pitch of 0.65mm. The device utilizes a thermally enhanced package and has a built-in thermal protection circuit. It is specified for operation over an ambient temperature range of -40°C to +85°C. FIGURE 24. OPERATION WITH RAIL-TO-RAIL INPUT AND OUTPUT The ISL24021 is capable of ±1A peak output short circuit current. The device will limit the current to ±1A. Maximum reliability is maintained if the output continuous current never exceeds ±300mA. This limit is set by the characteristics of the internal metal interconnects. See “Power Dissipation” on page 10 for detailed information about ensuring device operation with temperature and load conditions. As load capacitance increases, the -3dB bandwidth will decrease and peaking can occur. Depending on the application, it may be necessary to reduce peaking and to improve device stability. To improve device stability a snubber circuit or a series resistor may be added to the output of the ISL24021. A snubber is a shunt load consisting of a resistor in series with a capacitor, see Figure 25. An optimized snubber can improve the phase margin and the stability of the ISL24021. The advantage of a snubber circuit is that it does not draw any DC load current or reduce the gain. Another method to reduce peaking is to add a series output resistor (typically between 1Ω to 10Ω; see Figure 26). Depending on the capacitive loading, a small value resistor may be the most appropriate choice to minimize any reduction in gain. 9 FN6637.0 June 3, 2009 ISL24021 Power Dissipation . INN VDD INP 4.7µF ISL24021 0.1µF VSS OUT RSNUBBER 4.7µF 0.1µF ZL THERMAL PAD CONNECTED TO VSS The ISL24021 has a built-in thermal protection, which automatically shuts the output OFF (high impedance) when the die temperature reaches +165°C. This ensures safe operation and prevents internal damage to the device. When the die cools by +15°C the output will automatically turn ON. CSNUBBER FIGURE 25. OUTPUT SNUBBER CIRCUIT . INN VDD INP 4.7µF 0.1µF ISL24021 VSS With a 300mA maximum continuous output drive capability, it is possible to exceed the rated +150°C maximum junction temperature. It is important to calculate the maximum power dissipation of the ISL24021 for the application. Proper load conditions will ensure that the ISL24021 junction temperature stays within a safe operating region. OUT The maximum power dissipation allowed in a package is determined according to Equation 1: T JMAX – T AMAX P DMAX = --------------------------------------------Θ JA (EQ. 1) where: RSERIES 4.7µF 0.1µF • TJMAX = Maximum junction temperature ZL • TAMAX = Maximum ambient temperature THERMAL PAD CONNECTED TO VSS FIGURE 26. OUTPUT SERIES RESISTOR CIRCUIT • PDMAX = Maximum power dissipation in the package Typical Application Circuit A typical application of the ISL24021 is as a TFT-LCD VCOM driver (see Figure 27). A VCOM driver maintains the backplane common voltage of a TFT-LCD panel. Maintaining the VCOM voltage at a steady level is critical to panel performance. The ability of the ISL24021 to source/sink large peak short circuit currents make it ideal as a VCOM driver. The ±1A short circuit current capability combined with a large bandwidth and fast settling time give the ISL24021 ideal VCOM driver characteristics, and make it a great choice for TFT-LCD applications. V DD = 15V VCOM CALIBRATOR / RESISTOR LADDER ISL24021 INN INP 0.1µF 4.7µF TFT-LCD OUT V SS PANEL CAPACITANCE + C STORAGE THERMAL PAD CONNECTED TO V SS NOTE: C STORAGE WILL VARY DEPENDING ON THE APPLICATION FIGURE 27. TYPICAL APPLICATION CIRCUIT: TFT-LCD VCOM 10 The actual maximum power dissipation of the IC is the total quiescent supply current, times the total power supply voltage, plus the power dissipation in the IC caused by the loading condition. Sourcing: P DMAX = V S × I S + [ V DD – V OUT ) × I LOAD ] (EQ. 2) Sinking: P DMAX = V S × I S + [ V OUT – V SS ) × I LOAD ] (EQ. 3) • VS = Total supply voltage range (VDD - VSS) • IS = Device supply current + 0.1µF • θJA = Thermal resistance of the package • VDD = Positive supply voltage • VSS = Negative supply voltage • VOUT = Output voltage • ILOAD = Load current Device overheating can be avoided by calculating the minimum resistive load condition, RLOAD, resulting in the highest power dissipation. To find RLOAD, set the two PDMAX equations equal to each other and solve for VOUT/ILOAD. Reference the package power dissipation curve, Figure 28, for further information. FN6637.0 June 3, 2009 ISL24021 Printed Circuit Board Layout JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY (4-LAYER) TEST BOARD TDFN EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5 As with any high-frequency device, good printed circuit board layout is necessary for optimum performance. For the ISL24021 low impedance analog power and ground planes are recommended, and trace lengths should be as short as possible. The power supply pins must be well bypassed to reduce the risk of oscillation. For optimal thermal and operating performance the ISL24021 thermal pad should always be connected to the lowest potential, VSS. 3.0 POWER DISSIPATION (W) 2.5W 2.5 TDFN8 2.0 θJA = +50 (°C/W) 1.5 1.0 0.5 0 0 25 50 75 100 125 AMBIENT TEMP (°C) 150 For normal single supply operation (the VSS pin is connected to GND) a 4.7µF capacitor should be placed from VDD to GND, then a parallel 0.1µF capacitor should be connected as close to the amplifier as possible. For dual supply operation the same bypassing techniques should be utilized by connecting capacitors from each supply to GND. FIGURE 28. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE 11 FN6637.0 June 3, 2009 ISL24021 Thin Dual Flat No-Lead Plastic Package (TDFN) L8.3x3A 2X 0.15 C A A 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE D MILLIMETERS 2X 0.15 C B E SYMBOL MIN A 0.70 A1 - A3 6 INDEX AREA b TOP VIEW B 0.10 C // C SEATING PLANE SIDE VIEW D2 (DATUM B) A3 7 - 0.30 0.35 5, 8 2.40 7, 8, 9 1.60 7, 8, 9 - 2.30 - 1.50 - 0.65 BSC - k 0.25 - - - L 0.20 0.30 0.40 8 N 8 Nd 4 8 2 3 Rev. 3 11/04 NOTES: D2/2 1 6 INDEX AREA 0.08 C 0.80 0.05 3.00 BSC 1.40 e A 0.02 NOTES 3.00 BSC 2.20 E E2 0.75 MAX 0.20 REF 0.25 D D2 NOMINAL 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2 2. N is the number of terminals. 3. Nd refers to the number of terminals on D. NX k 4. All dimensions are in millimeters. Angles are in degrees. (DATUM A) E2 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. E2/2 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. NX L N N-1 NX b e 8 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 5 (Nd-1)Xe REF. 0.10 M C A B BOTTOM VIEW 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. 9. Compliant to JEDEC MO-WEEC-2 except for the “L” min dimension. CL (A1) NX (b) L1 5 10 L e SECTION "C-C" TERMINAL TIP FOR EVEN TERMINAL/SIDE All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 12 FN6637.0 June 3, 2009