Data Sheet

PEMB11; PUMB11
PNP/PNP resistor-equipped transistors;
R1 = 10 k, R2 = 10 k
Rev. 3 — 30 November 2011
Product data sheet
1. Product profile
1.1 General description
PNP/PNP Resistor-Equipped Transistors (RET) in Surface-Mounted Device (SMD) plastic
packages.
Table 1.
Product overview
Type number
Package
NXP
PEMB11
SOT666
PUMB11
SOT363
JEITA
NPN/PNP
complement
NPN/NPN
complement
Package
configuration
-
PEMD3
PEMH11
ultra small and flat lead
SC-88
PUMD3
PUMH11
very small
1.2 Features and benefits
 100 mA output current capability
 Built-in bias resistors
 Simplifies circuit design
 Reduces component count
 Reduces pick and place costs
 AEC-Q101 qualified
1.3 Applications
 Low current peripheral driver
 Control of IC inputs
 Replaces general-purpose transistors in digital applications
1.4 Quick reference data
Table 2.
Symbol
Quick reference data
Parameter
Conditions
Min
Typ
Max
Unit
open base
-
-
50
V
Per transistor
VCEO
collector-emitter voltage
IO
output current
-
-
100
mA
R1
bias resistor 1 (input)
7
10
13
k
R2/R1
bias resistor ratio
0.8
1.0
1.2
PEMB11; PUMB11
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 10 k, R2 = 10 k
2. Pinning information
Table 3.
Pinning
Pin
Description
Simplified outline
1
GND (emitter) TR1
2
input (base) TR1
3
output (collector) TR2
4
GND (emitter) TR2
5
input (base) TR2
6
output (collector) TR1
6
5
4
Graphic symbol
6
5
4
R1
R2
TR2
1
2
3
TR1
R2
001aab555
1
R1
2
3
006aaa212
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
Description
Version
PEMB11
-
plastic surface-mounted package; 6 leads
SOT666
PUMB11
SC-88
plastic surface-mounted package; 6 leads
SOT363
4. Marking
Table 5.
Type number
Marking code[1]
PEMB11
B1
PUMB11
B*1
[1]
PEMB11_PUMB11
Product data sheet
Marking codes
* = placeholder for manufacturing site code.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 November 2011
© NXP B.V. 2011. All rights reserved.
2 of 14
PEMB11; PUMB11
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 10 k, R2 = 10 k
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per transistor
VCBO
collector-base voltage
open emitter
-
50
V
VCEO
collector-emitter voltage
open base
-
50
V
VEBO
emitter-base voltage
open collector
-
10
V
VI
input voltage
positive
-
+10
V
negative
-
40
V
IO
output current
-
100
mA
ICM
peak collector current
-
100
mA
-
200
mW
-
200
mW
-
300
mW
-
300
mW
total power dissipation
Ptot
Tamb  25 C
[1]
[2]
PEMB11 (SOT666)
PUMB11 (SOT363)
Per device
total power dissipation
Ptot
Tamb  25 C
PEMB11 (SOT666)
PUMB11 (SOT363)
PEMB11_PUMB11
Product data sheet
[1]
[2]
Tj
junction temperature
-
150
C
Tamb
ambient temperature
65
+150
C
Tstg
storage temperature
65
+150
C
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Reflow soldering is the only recommended soldering method.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 November 2011
© NXP B.V. 2011. All rights reserved.
3 of 14
PEMB11; PUMB11
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 10 k, R2 = 10 k
006aac749
400
Ptot
(mW)
300
200
100
0
-75
-25
25
75
125
175
Tamb (°C)
FR4 PCB, standard footprint
Fig 1.
Per device: Power derating curve for SOT363 (SC-88) and SOT666
6. Thermal characteristics
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
-
625
K/W
-
-
625
K/W
-
-
417
K/W
-
-
417
K/W
Per transistor
Rth(j-a)
thermal resistance from
junction to ambient
in free air
[1]
[2]
PEMB11 (SOT666)
PUMB11 (SOT363)
Per device
Rth(j-a)
thermal resistance from
junction to ambient
in free air
PEMB11 (SOT666)
PUMB11 (SOT363)
PEMB11_PUMB11
Product data sheet
[1]
[2]
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Reflow soldering is the only recommended soldering method.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 November 2011
© NXP B.V. 2011. All rights reserved.
4 of 14
PEMB11; PUMB11
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 10 k, R2 = 10 k
006aac751
103
duty cycle = 1
Zth(j-a)
(K/W)
0.75
0.5
0.33
0.2
102
0.1
0.05
10
0.02
0.01
0
1
10-5
10-4
10-3
10-2
10-1
1
10
102
103
tp (s)
FR4 PCB, standard footprint
Fig 2.
Transient thermal impedance from junction to ambient as a function of pulse duration for
PEMB11 (SOT666); typical values
006aac750
103
duty cycle = 1
Zth(j-a)
(K/W)
0.75
0.5
0.33
0.2
102
0.1
0.05
0.02
10
0.01
0
1
10-5
10-4
10-3
10-2
10-1
1
10
102
103
tp (s)
FR4 PCB, standard footprint
Fig 3.
Transient thermal impedance from junction to ambient as a function of pulse duration for
PUMB11 (SOT363); typical values
PEMB11_PUMB11
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 November 2011
© NXP B.V. 2011. All rights reserved.
5 of 14
PEMB11; PUMB11
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 10 k, R2 = 10 k
7. Characteristics
Table 8.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Per transistor
ICBO
collector-base
cut-off current
VCB = 50 V; IE = 0 A
-
-
100
nA
ICEO
collector-emitter
cut-off current
VCE = 30 V; IB = 0 A
-
-
1
A
VCE = 30 V; IB = 0 A;
Tj = 150 C
-
-
5
A
A
IEBO
emitter-base
cut-off current
VEB = 5 V; IC = 0 A
-
-
400
hFE
DC current gain
VCE = 5 V; IC = 5 mA
30
-
-
VCEsat
collector-emitter
saturation voltage
IC = 10 mA; IB = 0.5 mA
-
-
150
mV
VI(off)
off-state input
voltage
VCE = 5 V; IC = 100 A
-
1.1
0.8
V
VI(on)
on-state input
voltage
VCE = 0.3 V; IC = 10 mA
2.5
1.8
-
V
R1
bias resistor 1 (input)
7
10
13
k
R2/R1
bias resistor ratio
0.8
1.0
1.2
Cc
collector capacitance VCB = 10 V; IE = ie = 0 A;
f = 1 MHz
-
-
3
pF
fT
transition frequency
-
180
-
MHz
[1]
PEMB11_PUMB11
Product data sheet
VCB = 5 V; IC = 10 mA;
f = 100 MHz
[1]
Characteristics of built-in transistor.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 November 2011
© NXP B.V. 2011. All rights reserved.
6 of 14
PEMB11; PUMB11
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 10 k, R2 = 10 k
006aac773
103
hFE
006aac774
-1
(1)
VCEsat
(V)
(2)
(3)
102
-10-1
(1)
10
(2)
(3)
1
-10-1
-1
-102
-10
-10-2
-1
-102
-10
IC (mA)
IC (mA)
VCE = 5 V
IC/IB = 20
(1) Tamb = 100 C
(1) Tamb = 100 C
(2) Tamb = 25 C
(2) Tamb = 25 C
(3) Tamb = 40 C
(3) Tamb = 40 C
Fig 4.
DC current gain as a function of collector
current; typical values
Fig 5.
006aac775
-10
Collector-emitter saturation voltage as a
function of collector current; typical values
006aac776
-10
VI(off)
(V)
VI(on)
(V)
(1)
(1)
(2)
(2)
-1
-1
(3)
-10-1
-10-1
-1
-102
-10
(3)
-10-1
-10-1
IC (mA)
VCE = 0.3 V
VCE = 5 V
(1) Tamb = 40 C
(2) Tamb = 25 C
(2) Tamb = 25 C
(3) Tamb = 100 C
(3) Tamb = 100 C
On-state input voltage as a function of
collector current; typical values
PEMB11_PUMB11
Product data sheet
-10
IC (mA)
(1) Tamb = 40 C
Fig 6.
-1
Fig 7.
Off-state input voltage as a function of
collector current; typical values
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 November 2011
© NXP B.V. 2011. All rights reserved.
7 of 14
PEMB11; PUMB11
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 10 k, R2 = 10 k
006aac777
6
006aac763
103
Cc
(pF)
fT
(MHz)
4
102
2
10
-10-1
0
0
-10
-20
-30
-40
-50
VCB (V)
-102
-10
IC (mA)
f = 1 MHz; Tamb = 25 C
Fig 8.
-1
VCE = 5 V; Tamb = 25 C
Collector capacitance as a function of
collector-base voltage; typical values
Fig 9.
Transition frequency as a function of collector
current; typical values of built-in transistor
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
1.7
1.5
6
2.2
1.8
0.6
0.5
5
6
4
1.1
0.8
5
4
2
3
0.45
0.15
0.3
0.1
1.7
1.5
2.2 1.35
2.0 1.15
1.3
1.1
pin 1 index
1
2
1
3
0.18
0.08
0.27
0.17
0.5
Dimensions in mm
04-11-08
Fig 10. Package outline PEMB11 (SOT666)
Product data sheet
0.3
0.2
0.65
0.25
0.10
1.3
1
PEMB11_PUMB11
pin 1
index
Dimensions in mm
06-03-16
Fig 11. Package outline PUMB11 (SOT363/SC-88)
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 November 2011
© NXP B.V. 2011. All rights reserved.
8 of 14
PEMB11; PUMB11
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 10 k, R2 = 10 k
10. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description
PEMB11
SOT666
PUMB11
[1]
SOT363
Packing quantity
3000 4000
8000 10000
2 mm pitch, 8 mm tape and reel
-
-
-315
-
4 mm pitch, 8 mm tape and reel
-
-115
-
-
4 mm pitch, 8 mm tape and reel; T1
[2]
-115
-
-
-135
4 mm pitch, 8 mm tape and reel; T2
[3]
-125
-
-
-165
For further information and the availability of packing methods, see Section 14.
[2]
T1: normal taping
[3]
T2: reverse taping
11. Soldering
2.75
2.45
2.1
1.6
solder lands
0.4
(6×) 0.25
(2×)
0.538
2
1.7 1.075
0.3
(2×)
0.55
(2×)
placement area
solder paste
occupied area
0.325 0.375
(4×) (4×)
Dimensions in mm
1.7
0.45
(4×)
0.6
(2×)
0.5
(4×)
0.65
(2×)
sot666_fr
Reflow soldering is the only recommended soldering method.
Fig 12. Reflow soldering footprint PEMB11 (SOT666)
PEMB11_PUMB11
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 November 2011
© NXP B.V. 2011. All rights reserved.
9 of 14
PEMB11; PUMB11
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 10 k, R2 = 10 k
2.65
solder lands
2.35 1.5
0.4 (2×)
0.6 0.5
(4×) (4×)
solder resist
solder paste
0.5
(4×)
0.6
(2×)
occupied area
0.6
(4×)
Dimensions in mm
1.8
sot363_fr
Fig 13. Reflow soldering footprint PUMB11 (SOT363/SC-88)
1.5
solder lands
0.3 2.5
4.5
solder resist
occupied area
1.5
Dimensions in mm
1.3
1.3
preferred transport
direction during soldering
2.45
5.3
sot363_fw
Fig 14. Wave soldering footprint PUMB11 (SOT363/SC-88)
PEMB11_PUMB11
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 November 2011
© NXP B.V. 2011. All rights reserved.
10 of 14
PEMB11; PUMB11
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 10 k, R2 = 10 k
12. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PEMB11_PUMB11 v.3
20111130
Product data sheet
-
PEMB11_PUMB11 v.2
Modifications:
•
The format of this document has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
•
•
•
Legal texts have been adapted to the new company name where appropriate.
•
•
•
•
•
•
Section 1 “Product profile”: updated
Section 4 “Marking”: updated
Table 7 “Thermal characteristics”: updated according to the latest measurements
Table 8 “Characteristics”: ICEO updated according to the latest measurements, Vi(on) and
Vi(off) changed respectively to VI(on) and VI(off), fT added
Figure 1 to 9: added
Section 8 “Test information”: added
Figure 11 and 10: replaced by minimized package outline drawings
Section 10 “Packing information”: added
Section 11 “Soldering”: added
Section 13 “Legal information”: updated
PEMB11_PUMB11 v.2
20031003
Product data sheet
PEMB11 v.1
20010913
Preliminary specification -
-
PUMB11 v.1
20000808
Product specification
-
PEMB11_PUMB11
Product data sheet
-
-
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 November 2011
PEMB11 v.1
PUMB11 v.1
© NXP B.V. 2011. All rights reserved.
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PEMB11; PUMB11
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 10 k, R2 = 10 k
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
PEMB11_PUMB11
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 November 2011
© NXP B.V. 2011. All rights reserved.
12 of 14
PEMB11; PUMB11
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 10 k, R2 = 10 k
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PEMB11_PUMB11
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 November 2011
© NXP B.V. 2011. All rights reserved.
13 of 14
PEMB11; PUMB11
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 10 k, R2 = 10 k
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8
Quality information . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Packing information . . . . . . . . . . . . . . . . . . . . . 9
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 30 November 2011
Document identifier: PEMB11_PUMB11