LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED ARRAY Pb Lead-Free Parts LA140B/HRFWK-S10-PF DATA SHEET DOC. NO : QW0905-LA140B/HRFWK-S10-PF REV. : A DATE : 26 - Aug. - 2015 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/8 PART NO. LA140B/HRFWK-S10-PF Package Dimensions 2.3 ±0.5 4.5 ψ3.2 6.0 6.0 3.5 3.5 ±0.5 □0.5 TYP HRF 4.25 ± 0.5 2.54TYP 1 2 WK 1 2 Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LHRFWK2642 3.0 3.3 3.15 4.5 1.5 MAX HRF 25.0MIN □0.5 WK TYP 1 1.0MIN 2.54TYP + - 2 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/8 PART NO. LA140B/HRFWK-S10-PF Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT HRF WK Forward Current IF 30 30 mA Peak Forward Current Duty 1/10@10KHz IFP 90 100 mA Power Dissipation PD 75 120 mW Reverse Current @5V Ir 10 50 μA Electrostatic Discharge ESD 2000 500 V Operating Temperature Topr -20~ +80 ℃ Storage Temperature Tstg -30~ +100 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted AlGaInP LA140B/HRFWK-S10-PF Red White Diffused COLOR MATERIAL Emitted InGaN Lens White Lens White Diffused Dominant wave length λDnm Spectral halfwidth △λnm Min. Max. 620 640 20 Chromaticity Coordinates X Y 0.28 0.28 Forward voltage @ 20mA(V) Luminous intensity @20mA(mcd) Min. Max. Min. Typ. 300 700 1.5 2.4 Viewing angle 2θ 1/2 (deg) 50 Forward Luminous Viewing voltage intensity angle @20mA(V) @20mA(mcd) 2θ 1/2 (deg) Typ. Max. Min. 3.5 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 4.0 Typ. 700 1100 50 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA140B/HRFWK-S10-PF Page 3/8 .Bin Code Red Luminous Intensity(mcd) at 20mA Group Min. Max. A16 300 350 A17 350 450 A18 450 550 A19 550 700 A20 700 900 A21 900 1100 WK Luminous Intensity(mcd) at 20mA Group Min. Max. A20 700 900 A21 900 1100 A22 1100 1500 A23 1500 1800 A24 1800 2200 A25 2200 2700 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA140B/HRFWK-S10-PF Page 4/8 . Chromaticity Coordinates Specifications for Bin Grading BIN A1 A2 A3 A4 A5 X Y 0.21 0.190 0.21 0.150 0.22 0.165 0.22 0.205 0.22 0.205 0.22 0.165 0.23 0.180 0.23 BIN X Y 0.26 0.265 X Y 0.31 0.340 0.26 0.225 0.31 0.300 0.27 0.240 0.27 0.280 0.32 0.315 0.32 0.355 0.27 0.280 0.32 0.355 0.27 0.240 0.28 0.255 0.32 0.315 0.33 0.330 0.220 0.28 0.295 0.33 0.370 0.23 0.220 0.23 0.180 0.28 0.295 0.33 0.370 0.28 0.255 0.33 0.330 0.24 0.195 0.29 0.270 0.34 0.345 0.24 0.24 0.235 0.29 0.310 0.34 0.385 0.235 0.29 0.310 0.34 0.385 0.24 0.195 0.29 0.270 0.34 0.345 0.25 0.210 0.25 0.250 0.30 0.285 0.35 0.360 0.30 0.325 0.35 0.400 0.25 0.250 0.30 0.325 0.25 0.210 0.26 0.225 0.30 0.285 0.31 0.300 0.26 0.265 0.31 0.340 B1 B2 B3 B4 B5 Color Coordinates Measurement allowance is ±0.01. . CIE Chromaticity Diagram BIN C1 C2 C3 C4 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/8 PART NO. LA140B/HRFWK-S10-PF Typical Electro-Optical Characteristics Curve HRF CHIP Fig.2 Relative Intensity vs. Forward Current Fig.1 Forward current vs. Forward Voltage 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0 0.1 1.0 1.5 2.0 2.5 3.0 1.0 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize@25 ℃ 1.2 Forward Voltage@20mA Normalize @25 ℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 -0 20 40 60 80 Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 100 10 1.0 0.5 0 550 600 650 Wavelength (nm) 700 100 2.5 2.0 1.5 1.0 0.5 0 -40 -20 -0 20 40 60 80 Ambient Temperature( ℃) 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA140B/HRFWK-S10-PF Page 6/8 Typical Electro-Optical Characteristics Curve WK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1 01 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1 10 Fig.4 Relative Intensity vs. Temperature 1.2 Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 100 SPECTRAL RADIANCE 100 Intensity 80 60 40 20 0 600 Wavelength (nm) 700 2.5 2.0 1.5 1.0 0.5 0.0 -20 0 20 40 60 80 Ambient Temperature( ℃) Fig.5 Luminous Spectrum(Ta=25 ℃) 500 3.0 -40 Ambient Temperature( ℃) 400 1000 Forward Current(mA) Forward Voltage(V) -40 100 800 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA140B/HRFWK-S10-PF Page 7/8 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 ° C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260°C3sec Max 260° 5°/sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/8 PART NO. LA140B/HRFWK-S10-PF Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃± 5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃± 5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. Thermal Shock Test 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11