RT6150A/B

®
RT6150A/B
Current Mode Buck-Boost Converter
General Description
Features
The RT6150A/B is a high efficiency, fixed frequency, BuckBoost DC/DC converter that operates from input voltages
above, below or equal to the output voltage. The topology
incorporated in the IC provides a continuous transfer
function through all operating modes, making the product
ideal for single lithium-ion, multi-cell alkaline or Ni-MH
battery applications where the output voltage is within the
battery voltage range.

Single Inductor

Fixed Frequency Operation with Battery Voltages
Synchronous Rectification : Up to 90% Efficiency
Up to 800mA Continuous Output Current
VOUT Disconnected from VIN during Shutdown
1.8V to 5.5V Input and Output Range
Power Save Mode (PSM) Enable Control
<1μ
μA Shutdown Current
10-Lead WDFN Packages
RoHS Compliant and Halogen Free







The device includes two N-MOSFET switches and two PMOSFET switches for high efficiency operation. Switching
frequency is set at 1MHz to reduce the external
component size. Quiescent current is only 60μA in Power
Save Mode (PSM), maximizing battery life in portable
applications. PSM operation is user controlled and can
be enabled by driving the PS pin low. If the PS pin is
driven high, then fixed frequency switching is enabled.

Ordering Information
RT6150A/B
Package Type
QW : WDFN-10L 3x3 (W-Type)
QW : WDFN-10L 2.5x2.5 (W-Type)
Lead Plating System
G : Green (Halogen Free and Pb Free)
Other features include low shutdown current, internal,
soft-start control, thermal shutdown protection and current
limit. The RT6150A is available in the WDFN-10L 3x3
package and the RT6150B is available in the WDFN-10L
2.5x2.5 package.
A : WDFN-10L 3x3
B : WDFN-10L 2.5x2.5
Note :
Richtek products are :

Applications


RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.
Portable Products
Handheld Instrumentation

Suitable for use in SnPb or Pb-free soldering processes.
Simplified Application Circuit
LX1
LX2
RT6150A/B
VOUT
VIN
Battery
VOUT
R1
VINA
FB
Enable
R2
EN
PS
GND
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1
RT6150A/B
Marking Information
Pin Configurations
RT6150AGQW
0N=YM
DNN
VOUT
LX2
GND
LX1
VIN
YMDNN : Date Code
1
2
3
4
5
GND
(TOP VIEW)
0N= : Product Code
11
10
9
8
7
6
FB
GND
VINA
PS
EN
WDFN-10L 3x3 / WDFN-10L 2.5x2.5
RT6150BGQW
00 : Product Code
W : Date Code
00W
Functional Pin Description
Pin No.
Pin Name
Pin Function
1
VOUT
Output of the Buck-Boost Converter. Connect a capacitor between the
VOUT and GND.
2
LX2
Second Switch Node. Connect this pin to the inductor.
3, 9,
11 (Exposed Pad)
GND
Power Ground. The exposed pad must be soldered to a large PCB and
connected to GND for maximum power dissipation.
4
LX1
First Switch Node. Connect this pin to the inductor.
5
VIN
Power Input. Connect an at least 10F capacitor between the VIN pin and
GND.
6
EN
Enable Control Input for the Buck-Boost Converter.
7
PS
PSM Control Input. Pull low for PSM operation and pull high for fixed
switching frequency operation.
8
VINA
Supply Voltage Input for Control Circuit.
10
FB
Feedback Input. Connect a resistive divider to set the output voltage. The
output voltage can be adjusted from 1.8V to 5.5V.
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RT6150A/B
Function Block Diagram
LX2
LX1
VIN
VOUT
Gate Driver
VINA
ISENSE
Temp
Control
OCP
Zero Current
OTP
VPSM
CTRL
PS
EN
CMP
OSC
SS
+
AMP
+
-
+
Slop Comp
VREF
FB
CC
RC
GND
Operation
The RT6150A/B is a synchronous average current mode switching Buck-Boost converter designed to maintain a fixed
output voltage from an input supply that can be above, equal, or below the output voltage. The average inductor current
is regulated by a fast current regulator which is controlled by a voltage control loop. The voltage error amplifier gets its
feedback input from the FB pin. For adjustable output voltage, a resistive voltage divider must be connected to the FB
pin. When VIN is greater than VOUT, the device operates in Buck mode. When VIN is lower than VOUT, the device
operates in Boost mode. When VIN is close to VOUT, the RT6150A/B automatically enters Buck-Boost mode. In BuckBoost mode, the converter will maintain the regulation for output voltage and keep a minimum current ripple in the
inductor to guarantee good performance.
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RT6150A/B
Absolute Maximum Ratings








(Note 1)
VOUT, VIN, EN, PS, VINA, FB Pin -----------------------------------------------------------------------------------Switch Output Voltage, LX1, LX2 Pin ---------------------------------------------------------------------------------< 10ns ------------------------------------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C
WDFN-10 3x3 --------------------------------------------------------------------------------------------------------------WDFN-10 2.5x2.5 ---------------------------------------------------------------------------------------------------------Package Thermal Resistance (Note 2)
WDFN-10 3x3, θJA ---------------------------------------------------------------------------------------------------------WDFN-10 3x3, θJC --------------------------------------------------------------------------------------------------------WDFN-10 2.5x2.5, θJA ----------------------------------------------------------------------------------------------------WDFN-10 2.5x2.5, θJC ---------------------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) -------------------------------------------------------------------------------Junction Temperature -----------------------------------------------------------------------------------------------------Storage Temperature Range --------------------------------------------------------------------------------------------ESD Susceptibility (Note 3)
HBM (Human Body Model) ----------------------------------------------------------------------------------------------MM (Machine Model) ------------------------------------------------------------------------------------------------------
Recommended Operating Conditions



−0.3V to 6V
−0.3V to 6V
−2V to 7.5V
3.28W
2.44W
30.5°C/W
7.5°C/W
40.9°C/W
18.6°C/W
260°C
150°C
−65°C to 150°C
2kV
200V
(Note 4)
Supply Input Voltage, VIN ------------------------------------------------------------------------------------------------ 1.8V to 5.5V
Junction Temperature Range --------------------------------------------------------------------------------------------- −40°C to 125°C
Ambient Temperature Range --------------------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VIN = VOUT = 3.6V, TA = 25° C, unless otherwise specified.)
Parameter
Min
Typ
Max
High-Level
--
1.65
1.8
Low-Level
1.4
1.55
--
0.495
0.5
0.505
V
--
1
50
nA
--
60
--
--
0.1
1
N-MOSFET Switch Leakage
--
0.1
5
A
P-MOSFET Switch Leakage
N-MOSFET Switch On
Resistance
P-MOSFET Switch On
Resistance
Switch Current Limit
--
0.1
10
A
RDS(ON)_N
--
0.15
--

RDS(ON)_P
--
0.15
--

ILIM
1.6
--
--
A
Oscillator Frequency
fOSC
0.8
1
1.2
MHz
--
0.65
1
ms
Input Voltage
UVLO
Feedback Voltage
Symbol
VFB
Feedback Input Current
VPS = VIN
VFB = 0.5V
IOUT = 0mA, PS = 0V
(Note 5)
Power Save Mode
EN = 0V, Not Including Switch
Leakage Shutdown
Quiescent Current
Soft-Start Time
Test Conditions
tSS
VIN = 3.6V
Time from when EN signal asserts
to output voltage IOUT = 0mA
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Unit
V
A
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RT6150A/B
Parameter
EN and PS Input
Voltage
Symbol
Min
Typ
Max
Logic-High
1.2
--
--
Logic-Low
--
--
0.4
--
0.01
1
A
--
140
--
C
EN and PS Input Current
Thermal Shutdown
Test Conditions
VEN = VPS = VIN
TSD
Unit
V
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Current measurements are performed when the output are not switching.
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RT6150A/B
Typical Application Circuit
RT6150A/B
VIN
5
CIN
10µF
8
VIN
VOUT 1
VINA
FB
Enable
6
7
EN
LX2
R1
487k
10
LX1 4
VOUT
R2
86.6k
2
PS
COUT
20µF
L
2.2µH
GND
3, 9, 11 (Exposed Pad)
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RT6150A/B
Typical Operating Characteristics
Buck-Boost 3.3V Efficiency
Buck-Boost 3.3V Efficiency
100
100
90
90
80
VIN = 1.8V
VIN = 2.4V
VIN = 3.3V
VIN = 4.2V
VIN = 5.5V
70
60
50
Efficiency (%)
Efficiency (%)
80
40
30
VIN = 1.8V
VIN = 2.4V
VIN = 3.3V
VIN = 4.2V
VIN = 5.5V
70
60
50
40
30
20
20
10
10
L = 2.2μH, COUT = 20μF, PS/SYNC = L
L = 2.2μH, COUT = 20μF, PS/SYNC = H
0
0
1
10
100
1
1000
10
100
1000
Output Current (mA)
Output Current (mA)
Efficiency vs. Input Voltage
Output Voltage vs. Output Current
100
3.6
90
3.5
Output Voltage (V)
Efficiency (%)
80
IOUT = 500mA
IOUT = 100mA
IOUT = 10mA
70
60
50
40
30
20
3.4
3.3
VIN = 1.8V
VIN = 2.4V
VIN = 3.3V
VIN = 4.2V
VIN = 5V
3.2
3.1
10
L = 2.2μH, COUT = 20μF, PS/SYNC = L
COUT = 20μF, PS = L
0
3.0
1.8
2.54
3.28
4.02
4.76
5.5
0
200
600
800
1000
Maximum Output Current vs. Input Voltage
Output Voltage vs. Input Voltage
3.6
Maximum Output Current (mA)1
2000
3.5
Output Voltage (V)
400
Output Current (mA)
Input Voltage (V)
3.4
3.3
IOUT = 500mA
IOUT = 300mA
IOUT = 100mA
3.2
3.1
1750
1500
1250
1000
750
500
250
COUT = 20μF, PS = L
VOUT = 3.3V, COUT = 20μF, PS = H
0
3.0
1.8
2.54
3.28
4.02
4.76
Input Voltage (V)
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5.5
1.8
2.54
3.28
4.02
4.76
5.5
Input Voltage (V)
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RT6150A/B
Output Voltage Ripple
Output Voltage Ripple
LX1
(2V/Div)
LX1
(2V/Div)
LX2
(2V/Div)
LX2
(2V/Div)
VOUT_ac
(20mV/Div)
VOUT_ac
(20mV/Div)
VIN = 3.3V, VOUT = 3.3V,
IOUT = 500mA, L = 2.2μH, COUT = 20μF
VIN = 2.5V, VOUT = 3.3V,
IOUT = 500mA, L = 2.2μH, COUT = 20μF
Time (500ns/Div)
Time (500ns/Div)
Output Voltage Ripple
Load Transient Response
LX1
(2V/Div)
I LOAD
(200mA/Div)
VOUT_ac
(100mV/Div)
LX2
(2V/Div)
VOUT_ac
(20mV/Div)
VIN = 4.2V, VOUT = 3.3V,
IOUT = 500mA, L = 2.2μH, COUT = 20μF
VIN = 3V, VOUT = 3.3V,
IOUT = 200mA to 600mA, L = 2.2μH, COUT = 20μF
Time (500ns/Div)
Time (2.5ms/Div)
Load Transient Response
Load Transient Response
I LOAD
(200mA/Div)
VOUT_ac
(100mV/Div)
I LOAD
(200mA/Div)
VOUT_ac
(100mV/Div)
VIN = 3.3V, VOUT = 3.3V,
IOUT = 200mA to 600mA, L = 2.2μH, COUT = 20μF
Time (2.5ms/Div)
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VIN = 4.2V, VOUT = 3.3V,
IOUT = 200mA to 600mA, L = 2.2μH, COUT = 20μF
Time (2.5ms/Div)
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RT6150A/B
Application Information
The RT6150A/B Buck-Boost DC/DC converter is designed
for systems powered by one-cell Li-Ion or Li-Polymer
battery with a typical voltage between 2.5V and 4.2V. They
can also be used in systems powered by a double or
triple cell Alkaline, NiCd, or NiMH battery with a typical
terminal voltage between 1.8V and 5.5V. Additionally, the
output voltage can be set between 1.8V and 5.5V.
The controller monitors the average input current as well
as the peak input current. With this, maximum input power
can be controlled to achieve a safe and stable operation.
To protect the device from overheating, an internal
temperature sensor is implemented.
Enable
The device can be enabled or disenabled by the EN pin.
When the EN pin is higher than the threshold of logichigh, the device starts operation with soft-start. Once the
EN pin is set at low, the device will be shut down. In
shutdown mode, the converter stops switching, internal
control circuitry is turned off, and the load is disconnected
from the input. This also means that the output voltage
can drop below the input voltage during shutdown.
Soft-Start
When the RT6150A/B is enabled, the output voltage will
increase to its setting value within 1ms. During start-up
period, the duty cycle and the peak current are limited to
reduce high peak current flowing from the input.
For example, an output voltage of 3.3V is needed. It is
recommended to use a 487kΩ resistor for R1. For better
transient response performance, adding a feedforward
capacitor in parallel with R1 is recommended. The value
for the feedforward capacitor can be calculated using
equation as below :
Cff = [(487k/R1) x 20] −20 (pF)
Power Save Mode
The PS pin can be used to select different operation
modes. To enable Power Save Mode (PSM), the PS pin
must be set at low. The PSM is used to improve the
efficiency at light load. If the power save mode is disabled
by pulling high the PS pin, the converter will operate in
PWM mode with fixed switching frequency.
Under-Voltage Lockout
The under-voltage lockout circuit prevents the device from
operating incorrectly at low input voltages. It prevents the
converter from turning on the power switches under
undefined conditions and prevents the battery from deep
discharge. VINA voltage must be greater than 1.65V to
enable the converter. During operation, if VINA voltage
drops below 1.55V, the converter is disabled until the
supply exceeds the UVLO rising threshold. The
RT6150A/B automatically restarts if the input voltage
recovers to the input voltage UVLO high level.
Thermal Shutdown
Output Voltage Setting
The output voltage is adjustable by an external resistive
divider. The resistive divider must be connected between
VOUT, FB and GND. When the output voltage is regulated
properly, the typical value of the voltage at the FB pin is
500mV, and the current into FB pin is about 10nA
generally. The current through divider resistor should be
about 100 times larger than the current into FB pin in
order to neglect the FB input current. The suggested value
for R2 is 80kΩ to 500kΩ, and the value of R1 is depended
on the needed output voltage. Output voltage can be
calculated by equation as below :
V
R1 = R2   OUT  1
 VFB

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DS6150A/B-04 March 2015
The device has a built-in temperature sensor which
monitors the internal junction temperature. If the
temperature exceeds the threshold, the device stops
operating. As soon as the IC temperature has decreased
below the threshold with a hysteresis, it starts operating
again. The built-in hysteresis is designed to avoid unstable
operation at IC temperatures near the over temperature
threshold.
Inductor Selection
To properly configure the Buck-Boost converter, an
inductor must be connected between the LX1 and LX2
pins. To estimate the inductance value, two equations are
listed as below :
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RT6150A/B
L1 >
VOUT   VIN(MAX)  VOUT 
f  IL  VIN(MAX)
L2 >
VIN(MIN)   VOUT  VIN(MIN) 
f  IL  VOUT
(H)
(H)
where f is the minimum switching frequency. L1 is the
minimum inductor value for Buck mode operation. VIN(MAX)
is the maximum input voltage. L2 is the minimum
inductance, for Boost mode operation. VIN(MIN) is the
minimum input voltage. The recommended minimum
inductor value is either L1 or L2 whichever is higher. For
example, a suitable inductor value is 2.2μH for generating
a 3.3V output voltage from a Li-Ion battery with the range
from 2.5V to 4.2V. The recommended inductor value range
is between 1.5μH and 4.7μH. In general, a higher inductor
value offers better performance in high voltage conversion
condition.
Input Capacitor Selection
At least a 10μF input capacitor is recommended to improve
transient behavior of the regulator and EMI behavior of the
total power supply circuit. A ceramic capacitor placed as
close as possible to the VIN and GND pins of the IC is
recommended.
Output Capacitor Selection
The output capacitor selection determines the output
voltage ripple and transient response. It is recommended
to use ceramic capacitors placed as close as possible to
the VOUT and GND pins of the IC. If, for any reason, the
application requires the use of large capacitors which can
not be placed close to the IC, using a small ceramic
capacitor in parallel to the large one is recommended.
This small capacitor should be placed as close as possible
to the VOUT and GND pins of the IC. The output voltage
ripple for a given output capacitor is expressed as follows :
VOUT , peak (Buck) =
VOUT  (VIN  VOUT )
VIN  8  L  (fOSC )2  COUT
I
 (VOUT  VIN )
VOUT , peak (Boost) = LOAD
COUT  VOUT  fOSC
If the RT6150A/B operates in Buck mode, the worst-case
voltage ripple occurs at the highest input voltage. When
the RT6150A/B operates in boost mode, the worst-case
voltage ripple occurs at the lowest input voltage.
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The maximum voltage of overshoot or undershoot, is
inversely proportional to the value of the output capacitor.
To ensure stability and excellent transient response, it is
recommended to use a minimum of 10μF/X7R/1206
capacitors at the output. For surface mount applications,
Taiyo Yuden or TDK ceramic capacitors, X7R series Multilayer Ceramic Capacitor is recommended.
A capacitor with a value in the range of the calculated
minimum should be used. This is required to maintain
control loop stability. There are no additional requirements
regarding minimum ESR. Low ESR capacitors should be
used to minimize output voltage ripple. Larger capacitors
will cause lower output voltage ripple as well as lower
output voltage drop during load transients.
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
PD(MAX) = (TJ(MAX) − TA) / θJA
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction to ambient
thermal resistance.
For recommended operating condition specifications, the
maximum junction temperature is 125°C. The junction to
ambient thermal resistance, θJA, is layout dependent. For
WDFN-10L 3x3 package, the thermal resistance, θJA, is
30.5°C/W on a standard JEDEC 51-7 four-layer thermal
test board. For WDFN-10L 2.5x2.5 package, the thermal
resistance, θJA, is 40.9°C/W on a standard JEDEC 51-7
four-layer thermal test board. The maximum power
dissipation at TA = 25°C can be calculated by the following
formula :
PD(MAX) = (125°C − 25°C) / (30.5°C/W) = 3.28W for
WDFN-10L 3x3 package
PD(MAX) = (125°C − 25°C) / (40.9°C/W) = 2.44W for
WDFN-10L 2.5x2.5 package
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RT6150A/B
Layout Considerations
The maximum power dissipation depends on the operating
ambient temperature for fixed T J(MAX) and thermal
resistance, θJA. The derating curve in Figure 1 allows the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
For the best performance of the RT6150A/B, the following
PCB layout guidelines must be strictly followed.

Place the input and output capacitors as close as
possible to the input and output pins respectively for
good filtering.

Keep the main power traces as wide and short as
possible.

The switching node area connected to LX and inductor
should be minimized for lower EMI.

Place the feedback components as close as possible
to the FB pin and keep these components away from
the noisy devices.

Connect the GND and Exposed Pad to a strong ground
plane for maximum thermal dissipation and noise
protection.

Directly connect the output capacitors to the feedback
network to avoid bouncing caused by parasitic
resistance and inductance from the PCB trace.
Maximum Power Dissipation (W)1
3.5
Four-Layer PCB
WDFN-10L 3x3
3.0
2.5
2.0
WDFN-10L 2.5x2.5
1.5
1.0
0.5
0.0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 1. Derating Curve of Maximum Power Dissipation
VOUT
GND
R1
Input/Output
capacitors must be
placed as close as
possible to the
Input/Output pin.
L
VOUT
1
LX2
GND
2
LX1
VIN
4
3
5
GND
COUT
10
FB
9
GND
VINA
8
7
11
6
R2
VIN
The feedback divider
should be placed as
close as possible to
the FB pin.
PS
EN
CIN
GND
LX should be connected to inductor by wide and short
trace. Keep sensitive components away from this trace.
Figure 2. PCB Layout Guide
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RT6150A/B
Outline Dimension
D2
D
L
E
E2
1
e
SEE DETAIL A
b
2
1
2
1
A
A1
A3
DETAIL A
Pin #1 ID and Tie Bar Mark Options
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.180
0.300
0.007
0.012
D
2.950
3.050
0.116
0.120
D2
2.300
2.650
0.091
0.104
E
2.950
3.050
0.116
0.120
E2
1.500
1.750
0.059
0.069
e
L
0.500
0.350
0.020
0.450
0.014
0.018
W-Type 10L DFN 3x3 Package
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DS6150A/B-04 March 2015
RT6150A/B
2
1
2
1
DETAIL A
Pin #1 ID and Tie Bar Mark Options
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min.
Max.
Min.
Max.
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.200
0.300
0.008
0.012
D
2.400
2.600
0.094
0.102
D2
1.950
2.050
0.077
0.081
E
2.400
2.600
0.094
0.102
E2
1.150
1.250
0.045
0.049
e
L
0.500
0.350
0.020
0.450
0.014
0.018
W-Type 10L DFN 2.5x2.5 Package
Richtek Technology Corporation
14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
DS6150A/B-04 March 2015
www.richtek.com
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