I CE3P CS 01 G PF C+ TT F c on tr ol c a r d Addendum to ANEVAL_201410_PL52_002 Addendum About this document Scope and purpose This document is and addendum to the Infineon application note “300 W General Purpose wide-range SMPS” (ANEVAL_201410_PL52_002), which describes a 300 W switched mode power supply design using ICE1CS02G combi controller IC to implement the PFC and TTF function. This addendum describes in technical details the alternative control card, which consist in a circuit using the Infineon ICE3PCS01G CCM PFC controller IC in combination with the Texas Instruments LM5021-2 TTF controller IC. The power board hardware is compatible with both the control cards with minor changes, which are described in this document. Attention: This board is intended for evaluation purposes only and is not intended to be an end product. Intended audience Design engineers who are developing a PFC + TTF switched mode power supply. 1 Revision 1.0, 2015-09-17 ICE3PCS01G PFC+TTF control card Addendum to ANEVAL_201410_PL52_002 Board description Table of Contents 1 1.1 1.2 1.3 1.3.1 1.3.2 Board description .......................................................................................................................... 3 Block diagram...................................................................................................................................... 3 Hardware description ......................................................................................................................... 3 Power board required changes .......................................................................................................... 5 PFC current sense – shunt replacement ...................................................................................... 5 TTF current sense – shunt replacement ....................................................................................... 5 2 2.1 2.2 2.3 2.4 Protections..................................................................................................................................... 7 Brown-Out Protection ......................................................................................................................... 7 Bus Over-Voltage protection .............................................................................................................. 7 Bus Under-Voltage protection ............................................................................................................ 7 PFC Overcurrent protection and TTF overcurrent protection ........................................................... 7 Addendum 2 Revision 1.0, 2015-09-17 ICE3PCS01G PFC+TTF control card Addendum to ANEVAL_201410_PL52_002 Board description 1 Board description The “300 W general purpose wide-range SMPS” application note is the document where most of the information is described. Please refer to this document when replacing the original ICE1CS02G combi IC control card with the ICE3PCS01G control IC card which is described below. 1.1 Block diagram The following pictures represent the board topology and its partitioning with indication of the main components. For a better explanation, the power supply can be divided into five parts, shown in Figure 1. 1. 2. 3. 4. 5. The input filter The PFC stage Originally controlled by combi IC ICE1CS02G Now replaced by ICE3PCS01G The TTF stage Originally controlled by combi IC ICE1Cs02G Now replaced by LM5021-1 The output stage The auxiliary supply Rapid 2 Diode 2 3 CoolMOS™ C6 1 CoolMOS™ CE 4 ICE3PCS01G LM5021-2 2EDL05I06BF Controller ICs EiceDRIVER™ Compact ICE QR/FF 5 Figure 1 CoolSET™ 300 W SMPS evalualtion board - simplified schematic The new control card is put in evidence in green in Figure 1. 1.2 Hardware description The following sections gives a detailed description of the hardware and how it can be used. Addendum 3 Revision 1.0, 2015-09-17 ICE3PCS01G PFC+TTF control card Addendum to ANEVAL_201410_PL52_002 Board description Figure 2 Hardware TOP overview – ICE3PCS01G in evidence Figure 3 Control card schematic Addendum 4 Revision 1.0, 2015-09-17 ICE3PCS01G PFC+TTF control card Addendum to ANEVAL_201410_PL52_002 Board description The connector is described in the following table: Table 1 1 Control card connector 2 3 4 VBUS VCC 5 6 PWMout PFCout 7 8 VCC 9 GND PWMcs 10 FB 11 12 13 PFCcs GND 14 RECac+ Pin1 and Pin14 are connected to high voltage, please be careful when handling the control cards while connected to the power board. 1.3 Power board required changes The use of the alternative control card requires a hardware change in the power board, which is the one hosting the power active components and magnetics. The only hardware changes needed are the re-sizing of the shunt current sense resistors for both the PFC and the TTF circuits. 1.3.1 PFC current sense – shunt replacement The PFC current sense sizing is described in chapter 3.3 of the “300 W General Purpose wide-range SMPS” application note. We are then goin to follow the same rules. The power board is designed for a typical shunt voltage threshold VCSTH=0.2 V giving the following result: |𝑉𝐶𝑆𝑇𝐻 | |𝑉𝐶𝑆𝑇𝐻 | 0.2 𝑉 = = ∆𝑖𝐿1𝑚𝑎𝑥 20% ∙ 𝐼𝐿1𝑚𝑎𝑥 5.82 𝐴𝑝𝑘 ∙ (1.1) 𝐼𝐿1𝑚𝑎𝑥 + 𝐼𝐿1𝑚𝑎𝑥 + 2 2 = 312 𝑚Ω 𝑅𝑆𝐻𝑈𝑁𝑇_𝑃𝐹𝐶 ≤ Eq 1 A second point to keep in mind is the power dissipation: 𝑃𝑆𝐻𝑈𝑁𝑇_𝑃𝐹𝐶 = |𝑉𝐶𝑆𝑇𝐻 | ∙ 𝐼𝐷(𝑟𝑚𝑠)𝑄1 = 0.2 ∙ 3.55 𝐴 = 0.71 𝑊 Eq 2 In order to fulfill both requirements, three shunt resistors of 100 mΩ in parallel have been used. The choice is on 1 W SMD resistors, type “2512” resistors to keep also low the stray inductance, which would cause spikes on the sensed voltage. Chosen values are R6=R7=R11=0.1Ω. 1.3.2 TTF current sense – shunt replacement The same procedure as explained in chapter 4 in “300 W General Purpose wide-range SMPS” application note is applied here. The power board is designed for a shunt voltage threshold Vcsth=0.5 V giving the following result: 𝑅𝑆𝐻𝑈𝑁𝑇_𝑇𝑇𝐹 ≤ |𝑉𝐶𝑆𝑇𝐻 | 𝐼𝑀𝑂𝑆(𝑚𝑎𝑥) = 0.5 𝑉 = 190 𝑚Ω 2.63 𝐴𝑝𝑘 Eq 3 A second point to keep in mind is the power dissipation: Addendum 5 Revision 1.0, 2015-09-17 ICE3PCS01G PFC+TTF control card Addendum to ANEVAL_201410_PL52_002 Board description 𝑃𝑆𝐻𝑈𝑁𝑇_𝑇𝑇𝐹 = |𝑉𝐶𝑆𝑇𝐻 | ∙ 𝐼𝑀𝑂𝑆(𝑟𝑚𝑠) = 0.5 𝑉 ∙ 2 𝐴 = 1 𝑊 Eq 4 In order to fulfill both requirements, and to keep some flexibility, two shunt resistors of 0.402 mΩ in parallel have been used. The choice is on 1 W SMD resistors, type “2512” to keep also low the stray inductance, which would cause spikes on the sensed voltage. Addendum 6 Revision 1.0, 2015-09-17 ICE3PCS01G PFC+TTF control card Addendum to ANEVAL_201410_PL52_002 Protections 2 Protections 2.1 Brown-out protection Brown-out protection is set by: R13=R23=2.1 Meg; R12=1.96 Meg; R9=82 K. See below the brown-out input DC voltages 𝑅13 + 𝑅23 + 𝑅12 6.16 𝑀 ) = 1.25 𝑉 ∙ (1 + ) = 95 𝑉 𝑅9 82 𝐾 𝑅13 + 𝑅23 + 𝑅12 6.16 𝑀 = 𝑉𝐵𝑂𝑃_𝐻2𝐿 ∙ (1 + ) = 1 𝑉 ∙ (1 + ) = 76 𝑉 𝑅9 82 𝐾 Eq 5 𝑉𝐼𝑁𝑜𝑛 = 𝑉𝐵𝑂𝑃_𝐿2𝐻 ∙ (1 + 𝑉𝐼𝑁𝑜𝑓𝑓 2.2 Eq 6 Bus over-voltage protection Bus overvoltage protection is set by: R1=R3= 2.05 Meg; R5=1.1 Meg; R10=31 K. See below the BUS Overvoltage values: 𝑅1 + 𝑅3 + 𝑅5 5.2 𝑀 ) = 2.7 𝑉 ∙ (1 + ) = 455 𝑉 𝑅10 31 𝐾 𝑅1 + 𝑅3 + 𝑅5 5.2 𝑀 = 𝑉𝑂𝑉𝑃_𝐻2𝐿 ∙ (1 + ) = 2.5 𝑉 ∙ (1 + ) = 421 𝑉 𝑅10 31 𝐾 Eq 7 𝑉𝐼𝑁𝑜𝑛 = 𝑉𝑂𝑉𝑃_𝐿2𝐻 ∙ (1 + 𝑉𝐼𝑁𝑜𝑓𝑓 2.3 Eq 8 Bus under-voltage protection TTF stage is turned on via VB_OK digital signal. ICE3PCS01G monitors the bus voltage and turns off VB_OK when VSense is below VBTHL_EN pin voltage. In this controller card VBTHL_EN is set to disable the TTF stage at Vbus=330 V: 𝑅15 200 𝐾 𝑉𝐵𝑇𝐻𝐿_𝐸𝑁 = 𝑉𝑟𝑒𝑓 ∙ ( )=5𝑉∙( ) = 2.13 𝑉 𝑅15 + 𝑅11 200 𝐾 + 270 𝐾 𝑅2 + 𝑅4 + 𝑅6 5.2 𝑀 𝑉𝐷𝐶𝑜𝑓𝑓 = 𝑉𝐵𝑇𝐻𝐿_𝐸𝑁 ∙ (1 + ) = 2.13𝑉 ∙ (1 + ) = 330 𝑉 𝑅8 31 𝐾 𝑅2 + 𝑅4 + 𝑅6 5.2 𝑀 𝑉𝐷𝐶𝑜𝑓𝑓 = 𝑉𝑉𝐵𝑂𝐾_𝑜𝑛 ∙ (1 + ) = 2.375 𝑉 ∙ (1 + ) = 368 𝑉 𝑅8 31 𝐾 2.4 Eq 9 Eq 10 Eq 11 PFC overcurrent protection and TTF overcurrent protection ICE3PCS01G protects the power supply by interrupting the PWM pattern at each cycle if overcurrent is detected. As soon as Bus voltage drops, the VB_OK pin is pulled-down and the TTF stage stopped. This protection is not latched. TTF is protecting the power supply by interrupting the PWM pattern and enters hic-up mode in case of continuous overload condition. Please see ICE3PCS01G and LM5021-2 datasheets for more details. Addendum 7 Revision 1.0, 2015-09-17 ICE3PCS01G PFC+TTF control card Addendum to ANEVAL_201410_PL52_002 References and proposed links 3 References and proposed links [1] CoolMOS™ high voltage MOSFETs product main page www.infineon.com/coolmos [2] thinQ™! Silicon Carbide Schottky Diodes main page www.infineon.com/sic [3] Rapid Silicon Diodes main page http://www.infineon.com/cms/en/product/transistor-and-diode/diode/silicon-powerdiode/channel.html?channel=ff80808112ab681d0112ab6a527f04a6 [4] CoolSET™ auxiliary and SMPS controller ICs main page www.infineon.com/coolset [5] ICE1CS02G application note: “300W Evaluation board using ICE1CS02”: http://www.infineon.com/dgdl?folderId=5546d4694909da4801490a2652e6286a&fileId=db3a30431c69a 49d011c8e8e3df1048f [6] ICE1CS02G datasheet from Infineon product page http://www.infineon.com/dgdl?folderId=5546d4694909da4801490a07012f053b&fileId=db3a30431c69a 49d011c8e917a2d0494 [7] Application Note - 300 W general purpose wide range SMPS http://www.infineon.com/dgdl?fileId=5546d4624e765da5014eced06bd44911 Revision History Major changes since the last revision Page or Reference -- Addendum Description of change First Release 8 Revision 1.0, 2015-09-17 Trademarks of Infineon Technologies AG AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolGaN™, CoolMOS™, CoolSET™, CoolSiC™, CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, DrBLADE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, IsoPACK™, iWafer™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OPTIGA™, OptiMOS™, ORIGA™, POWERCODE™, PRIMARION™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, ReverSave™, SatRIC™, SIEGET™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, SPOC™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. ANSI™ of American National Standards Institute. AUTOSAR™ of AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CATiq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. HYPERTERMINAL™ of Hilgraeve Incorporated. MCS™ of Intel Corp. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ of Openwave Systems Inc. RED HAT™ of Red Hat, Inc. RFMD™ of RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2014-07-17 www.infineon.com Edition 2015-09-17 Published by Infineon Technologies AG 81726 Munich, Germany © 2015 Infineon Technologies AG. All Rights Reserved. Do you have a question about any aspect of this document? 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