Data Sheet

PMEG6002EB; PMEG6002TV
0.2 A very low VF MEGA Schottky barrier rectifiers
Rev. 01 — 24 November 2006
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an
integrated guard ring for stress protection, encapsulated in ultra small and flat lead
Surface-Mounted Device (SMD) plastic packages.
Table 1.
Product overview
Type number
Package
Configuration
NXP
JEITA
PMEG6002EB
SOD523
SC-79
single
PMEG6002TV
SOT666
-
dual isolated
1.2 Features
n
n
n
n
Forward current: IF ≤ 0.2 A
Reverse voltage: VR ≤ 60 V
Very low forward voltage
Ultra small and flat lead SMD plastic packages
1.3 Applications
n
n
n
n
n
Low voltage rectification
High efficiency DC-to-DC conversion
Switch mode power supply
Reverse polarity protection
Low power consumption applications
1.4 Quick reference data
Table 2.
Symbol
Quick reference data
Parameter
Conditions
Min
Typ
Max
Unit
IF
forward current
Tamb ≤ 25 °C
-
-
0.2
A
VR
reverse voltage
-
-
60
V
-
540
600
mV
Per diode
VF
[1]
forward voltage
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
IF = 200 mA
[1]
PMEG6002EB; PMEG6002TV
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifiers
2. Pinning information
Table 3.
Pinning
Pin
Description
Simplified outline
Symbol
SOD523
1
cathode
2
anode
[1]
1
1
2
2
sym001
SOT666
1
anode (diode 1)
2
not connected
3
cathode (diode 2)
4
anode (diode 2)
5
not connected
6
[1]
cathode (diode 1)
6
5
4
1
2
3
6
5
4
1
2
3
006aaa440
The marking bar indicates the cathode.
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
Description
Version
PMEG6002EB
SC-79
plastic surface-mounted package; 2 leads
SOD523
PMEG6002TV
-
plastic surface-mounted package; 6 leads
SOT666
4. Marking
Table 5.
Marking codes
Type number
Marking code
PMEG6002EB
B2
PMEG6002TV
1B
PMEG6002EB_PMEG6002TV_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 24 November 2006
2 of 10
PMEG6002EB; PMEG6002TV
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifiers
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per diode
VR
reverse voltage
-
60
V
IF
forward current
Tamb ≤ 25 °C
-
0.2
A
IFRM
repetitive peak forward current
tp ≤ 1 ms;
δ ≤ 0.25
-
2
A
IFSM
non-repetitive peak forward
current
square wave;
tp = 8 ms
[1]
-
2.5
A
Ptot
total power dissipation
Tamb ≤ 25 °C
PMEG6002EB
[1]
-
300
mW
PMEG6002TV
[1]
-
200
mW
[2]
-
300
mW
[1]
-
300
mW
[2]
-
400
mW
Per device
total power dissipation
Ptot
Tamb ≤ 25 °C
PMEG6002TV
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
PMEG6002EB_PMEG6002TV_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 24 November 2006
3 of 10
PMEG6002EB; PMEG6002TV
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifiers
6. Thermal characteristics
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
thermal resistance from
junction to ambient
in free air
Min
Typ
Max
Unit
Per device
Rth(j-a)
PMEG6002EB
[1][2]
-
-
400
K/W
PMEG6002TV
[1][2]
-
-
416
K/W
[1][3]
-
-
318
K/W
PMEG6002EB
-
-
75
K/W
PMEG6002TV
-
-
195
K/W
[4]
thermal resistance from
junction to solder point
Rth(j-sp)
[1]
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4]
Soldering point of cathode tab.
7. Characteristics
Table 8.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
IF = 0.1 mA
-
130
170
mV
IF = 1 mA
-
190
230
mV
IF = 10 mA
-
260
300
mV
IF = 100 mA
-
420
470
mV
IF = 200 mA
-
540
600
mV
VR = 10 V
-
2
10
µA
VR = 60 V
-
20
100
µA
VR = 10 V; Tamb = 100 °C
-
310
-
µA
VR = 1 V; f = 1 MHz
-
14
20
pF
Per diode
VF
IR
Cd
[1]
[1]
forward voltage
reverse current
diode capacitance
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
PMEG6002EB_PMEG6002TV_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 24 November 2006
4 of 10
PMEG6002EB; PMEG6002TV
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifiers
006aaa765
103
006aaa766
5
IR 10
(µA)
104
IF
(mA)
(1)
(2)
102
103
(3)
102
10
10
(1)
(2)
(3)
(4)
(5)
1
(4)
1
10−1
10−2
(5)
10−3
10−1
0
0.2
0.4
0.6
0.8
0
1.0
20
VF (V)
40
60
VR (V)
(1) Tamb = 150 °C
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(2) Tamb = 125 °C
(3) Tamb = 85 °C
(3) Tamb = 85 °C
(4) Tamb = 25 °C
(4) Tamb = 25 °C
(5) Tamb = −40 °C
(5) Tamb = −40 °C
Fig 1. Forward current as a function of forward
voltage; typical values
Fig 2. Reverse current as a function of reverse
voltage; typical values
006aaa767
30
Cd
(pF)
20
10
0
0
20
40
60
VR (V)
f = 1 MHz; Tamb = 25 °C
Fig 3. Diode capacitance as a function of reverse voltage; typical values
PMEG6002EB_PMEG6002TV_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 24 November 2006
5 of 10
PMEG6002EB; PMEG6002TV
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifiers
8. Test information
P
t2
t1
t2
duty cycle δ =
t1
t
006aaa812
Fig 4. Duty cycle definition
9. Package outline
0.85
0.75
0.65
0.58
1.7
1.5
1
6
0.6
0.5
5
4
0.3
0.1
1.65 1.25
1.55 1.15
1.7
1.5
1.3
1.1
pin 1 index
1
2
0.34
0.26
0.17
0.11
Dimensions in mm
3
0.18
0.08
0.27
0.17
1
02-12-13
Fig 5. Package outline SOD523 (SC-79)
2
0.5
Dimensions in mm
04-11-08
Fig 6. Package outline SOT666
10. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
3000
PMEG6002EB SOD523
PMEG6002TV SOT666
[1]
8000
10000
2 mm pitch, 8 mm tape and reel
-
-
-315
-
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
2 mm pitch, 8 mm tape and reel
-
-
-315
-
4 mm pitch, 8 mm tape and reel
-
-115
-
-
For further information and the availability of packing methods, see Section 14.
PMEG6002EB_PMEG6002TV_1
Product data sheet
4000
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 24 November 2006
6 of 10
PMEG6002EB; PMEG6002TV
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifiers
11. Soldering
2.15
0.50 0.60
1.20
solder lands
solder paste
0.30
0.40
solder resist
1.80
1.90
occupied area
mgs343
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 7. Reflow soldering footprint SOD523 (SC-79)
2.75
2.45
2.10
1.60
0.15
(4×)
0.40
(6×)
2.00 1.70 1.00
0.55
(2×)
0.30 (2×)
0.375
(4×)
1.20
2.20
2.50
solder lands
placement area
solder resist
occupied area
0.075
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Fig 8. Reflow soldering footprint SOT666
PMEG6002EB_PMEG6002TV_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 24 November 2006
7 of 10
PMEG6002EB; PMEG6002TV
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifiers
12. Revision history
Table 10.
Revision history
Document ID
Release date
PMEG6002EB_PMEG6002TV_1 20061124
Data sheet status
Change notice
Supersedes
Product data sheet
-
-
PMEG6002EB_PMEG6002TV_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 24 November 2006
8 of 10
NXP Semiconductors
PMEG6002EB; PMEG6002TV
0.2 A very low VF MEGA Schottky barrier rectifiers
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
PMEG6002EB_PMEG6002TV_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 24 November 2006
9 of 10
NXP Semiconductors
PMEG6002EB; PMEG6002TV
0.2 A very low VF MEGA Schottky barrier rectifiers
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Packing information. . . . . . . . . . . . . . . . . . . . . . 6
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2006.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 24 November 2006
Document identifier: PMEG6002EB_PMEG6002TV_1
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