Data Sheet

RB751 series
Schottky barrier single diodes
Rev. 01 — 21 May 2007
Product data sheet
1. Product profile
1.1 General description
Planar Schottky barrier single diodes with an integrated guard ring for stress protection,
encapsulated in small Surface-Mounted Device (SMD) plastic packages.
Table 1.
Product overview
Type number
Package
NXP
JEITA
Package
configuration
RB751CS40
SOD882
-
leadless ultra small
RB751S40
SOD523
SC-79
ultra small
RB751V40
SOD323
SC-76
very small
1.2 Features
n Low forward voltage
n Low capacitance
1.3 Applications
n
n
n
n
Ultra high-speed switching
Voltage clamping
Line termination
Reverse polarity protection
1.4 Quick reference data
Table 2.
Quick reference data
Symbol
Parameter
IF
Min
Typ
Max
Unit
forward current
-
-
120
mA
VRRM
repetitive peak reverse
voltage
-
-
40
V
VF
forward voltage
-
-
370
mV
[1]
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
Conditions
IF = 1 mA
[1]
RB751 series
NXP Semiconductors
Schottky barrier single diodes
2. Pinning information
Table 3.
Pinning
Pin
Description
Simplified outline
Symbol
SOD882
1
cathode
2
anode
[1]
1
1
2
2
sym001
Transparent
top view
SOD323; SOD523
1
cathode
2
anode
[1]
1
1
2
2
sym001
001aab540
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
Description
Version
RB751CS40
-
leadless ultra small plastic package; 2 terminals;
body 1.0 × 0.6 × 0.5 mm
SOD882
RB751S40
SC-79
plastic surface-mounted package; 2 leads
SOD523
RB751V40
SC-76
plastic surface-mounted package; 2 leads
SOD323
4. Marking
Table 5.
Marking codes
Type number
Marking code
RB751CS40
F6
RB751S40
G4
RB751V40
W8
RB751_SER_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 21 May 2007
2 of 10
RB751 series
NXP Semiconductors
Schottky barrier single diodes
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VRRM
Conditions
Min
Max
Unit
repetitive peak reverse
voltage
-
40
V
VR
reverse voltage
-
40
V
IF
forward current
-
120
mA
IFSM
non-repetitive peak forward
current
square wave;
tp < 10 ms
-
200
mA
Ptot
total power dissipation
Tamb ≤ 25 °C
[1]
RB751CS40
[2]
-
250
mW
RB751S40
[2]
-
280
mW
-
280
mW
Tj
junction temperature
RB751V40
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Reflow soldering is the only recommended soldering method.
6. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
thermal resistance from
junction to ambient
in free air
Min
Typ
Max
Unit
[1]
RB751CS40
[2]
-
-
500
K/W
RB751S40
[2]
-
-
450
K/W
-
-
450
K/W
RB751V40
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Reflow soldering is the only recommended soldering method.
7. Characteristics
Table 8.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Typ
Max
Unit
VF
forward voltage
IF = 1 mA
-
-
370
mV
IR
reverse current
VR = 30 V
-
-
0.5
µA
Cd
diode capacitance
VR = 1 V; f = 1 MHz
-
2
-
pF
[1]
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
RB751_SER_1
Product data sheet
Min
[1]
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 21 May 2007
3 of 10
RB751 series
NXP Semiconductors
Schottky barrier single diodes
mlc361
102
mlc362
103
IR
(µA)
IF
(mA)
(1)
102
10
10
(1)
(2)
(3)
(4)
(2)
1
1
10−1
10−1
(3)
10−2
0
0.2
0.4
0.6
0.8
VF (V)
10−2
1
10
0
(1) Tamb = 125 °C
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
(3) Tamb = 25 °C
20
30
VR (V)
40
(4) Tamb = −40 °C
Fig 1. Forward current as a function of forward
voltage; typical values
Fig 2. Reverse current as a function of reverse
voltage; typical values
mlc363
5
Cd
(pF)
4
3
2
1
0
0
10
20
30
VR (V)
40
f = 1 MHz; Tamb = 25 °C
Fig 3. Diode capacitance as a function of reverse voltage; typical values
RB751_SER_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 21 May 2007
4 of 10
RB751 series
NXP Semiconductors
Schottky barrier single diodes
8. Package outline
0.85
0.75
0.50
0.46
0.62
0.55
0.65
0.58
1
2
0.30
0.22
0.30
0.22
1.65 1.25
1.55 1.15
1.02
0.95
0.65
1
2
0.55
0.47
cathode marking on top side
Dimensions in mm
0.34
0.26
03-04-17
Fig 4. Package outline SOD882
0.17
0.11
Dimensions in mm
02-12-13
Fig 5. Package outline SOD523 (SC-79)
1.35
1.15
1.1
0.8
0.45
0.15
1
2.7
2.3
1.8
1.6
2
0.40
0.25
Dimensions in mm
0.25
0.10
03-12-17
Fig 6. Package outline SOD323 (SC-76)
9. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
3000
8000
10000
RB751CS40
SOD882
2 mm pitch, 8 mm tape and reel
-
-
-315
RB751S40
SOD523
2 mm pitch, 8 mm tape and reel
-
-315
-
4 mm pitch, 8 mm tape and reel
-115
-
-135
RB751V40
SOD323
4 mm pitch, 8 mm tape and reel
-115
-
-135
[1]
For further information and the availability of packing methods, see Section 13.
RB751_SER_1
Product data sheet
Packing quantity
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 21 May 2007
5 of 10
RB751 series
NXP Semiconductors
Schottky barrier single diodes
10. Soldering
1.30
R = 0.05 (8×)
0.30
R = 0.05 (8×)
0.60 0.70 0.80
(2×) (2×) (2×)
0.90
solder lands
solder paste
solder resist
0.30
(2×)
0.40
(2×)
0.50
(2×)
occupied area
mbl872
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 7. Reflow soldering footprint SOD882
2.15
0.50 0.60
1.20
solder lands
solder paste
0.30
0.40
solder resist
occupied area
1.80
1.90
mgs343
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 8. Reflow soldering footprint SOD523 (SC-79)
RB751_SER_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 21 May 2007
6 of 10
RB751 series
NXP Semiconductors
Schottky barrier single diodes
3.05
2.80
2.10
1.60
solder lands
solder resist
1.65
0.95
0.50
0.60
occupied area
solder paste
0.50
(2×)
msa433
Dimensions in mm
Fig 9. Reflow soldering footprint SOD323 (SC-76)
5.00
4.40
1.40
solder lands
solder resist
occupied area
2.75 1.20
msa415
preferred transport direction during soldering
Dimensions in mm
Fig 10. Wave soldering footprint SOD323 (SC-76)
RB751_SER_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 21 May 2007
7 of 10
RB751 series
NXP Semiconductors
Schottky barrier single diodes
11. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
RB751_SER_1
20070521
Product data sheet
-
-
RB751_SER_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 21 May 2007
8 of 10
RB751 series
NXP Semiconductors
Schottky barrier single diodes
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
RB751_SER_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 21 May 2007
9 of 10
RB751 series
NXP Semiconductors
Schottky barrier single diodes
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
Packing information. . . . . . . . . . . . . . . . . . . . . . 5
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 21 May 2007
Document identifier: RB751_SER_1
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