Data Sheet

SO
D3
23F
BAT46WJ
Single Schottky barrier diode
Rev. 2 — 8 November 2011
Product data sheet
1. Product profile
1.1 General description
Single planar Schottky barrier diode with an integrated guard ring for stress protection,
encapsulated in a very small and flat lead SOD323F (SC-90) Surface-Mounted
Device (SMD) plastic package.
1.2 Features and benefits
 Low forward voltage
 Reverse voltage VR  100 V
 Very small and flat lead SMD plastic
package
 Low capacitance
 AEC-Q101 qualified
1.3 Applications
 High-speed switching
 Line termination
 Voltage clamping
 Reverse polarity protection
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
VR
reverse voltage
Conditions
VF
forward voltage
IF = 250 mA
[1]
IR
reverse current
VR = 75 V
[1]
[1]
Min
Typ
Max
Unit
-
-
100
V
-
-
850
mV
-
-
4
A
Pulse test: tp  300 s;   0.02.
2. Pinning information
Table 2.
Pin
Pinning
Description
1
cathode
2
anode
Simplified outline
Graphic symbol
[1]
1
2
1
2
sym001
[1]
The marking bar indicates the cathode.
BAT46WJ
NXP Semiconductors
Single Schottky barrier diode
3. Ordering information
Table 3.
Ordering information
Type number
BAT46WJ
Package
Name
Description
Version
SC-90
plastic surface-mounted package; 2 leads
SOD323F
4. Marking
Table 4.
Marking codes
Type number
Marking code
BAT46WJ
JK
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VR
reverse voltage
IF
forward current
[1]
IFSM
non-repetitive peak
forward current
square wave;
tp < 10 ms
Ptot
total power dissipation
Tamb  25 C
Min
Max
Unit
-
100
V
-
250
mA
-
2.5
A
[2][4]
-
400
mW
[3][4]
-
715
mW
Tj
junction temperature
-
150
C
Tamb
ambient temperature
55
+150
C
Tstg
storage temperature
65
+150
C
[1]
Tj = 25 C before surge.
[2]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4]
Reflow soldering is the only recommended soldering method.
6. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
BAT46WJ
Product data sheet
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
Conditions
in free air
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 8 November 2011
Min
Typ
Max
Unit
[1][3]
-
-
310
K/W
[2][3]
-
-
175
K/W
© NXP B.V. 2011. All rights reserved.
2 of 12
BAT46WJ
NXP Semiconductors
Single Schottky barrier diode
Table 6.
Thermal characteristics …continued
Symbol
Parameter
Rth(j-sp)
thermal resistance from
junction to solder point
Conditions
[4]
Min
Typ
Max
Unit
-
-
35
K/W
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[3]
Reflow soldering is the only recommended soldering method.
[4]
Soldering point of cathode tab.
006aac385
103
duty cycle =
Zth(j-a)
(K/W)
1
0.75
0.5
102
0.33
0.25
0.2
0.1
0.05
10
0.02
0.01
0
1
10−5
10−4
10−3
10−2
10−1
1
10
102
103
tp (s)
FR4 PCB, standard footprint
Fig 1.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aac386
103
Zth(j-a)
(K/W)
duty cycle =
1
0.75
102
0.5
0.33
0.25
0.2
0.1
0.05
10
0.02
0.01
0
1
10−5
10−4
10−3
10−2
10−1
1
10
102
103
tp (s)
FR4 PCB, mounting pad for cathode 1 cm2
Fig 2.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
BAT46WJ
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 8 November 2011
© NXP B.V. 2011. All rights reserved.
3 of 12
BAT46WJ
NXP Semiconductors
Single Schottky barrier diode
7. Characteristics
Table 7.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol
VF
IR
Parameter
Conditions
Min
Typ
IF = 0.1 mA
-
175
200
mV
IF = 10 mA
-
315
350
mV
IF = 10 mA; Tj = 40 C
-
-
470
mV
IF = 50 mA
-
415
475
mV
forward voltage
IF = 50 mA; Tj = 40 C
-
-
560
mV
-
710
850
mV
-
0.2
0.5
A
[1]
reverse current
diode capacitance
VR = 1.5 V; Tj = 60 C
-
-
12
A
VR = 10 V
-
0.3
0.8
A
VR = 10 V; Tj = 60 C
-
-
20
A
VR = 50 V
-
0.7
2
A
VR = 50 V; Tj = 60 C
-
-
44
A
VR = 75 V
-
1
4
A
VR = 75 V; Tj = 60 C
-
-
80
A
VR = 100 V
-
2
9
A
VR = 100 V; Tj = 60 C
-
-
120
A
VR = 100 V; Tj = 85 C
-
-
600
A
-
-
39
pF
f = 1 MHz
VR = 0 V
VR = 1 V
trr
BAT46WJ
Product data sheet
Unit
IF = 250 mA
VR = 1.5 V
Cd
Max
[1]
reverse recovery time
[2]
-
-
21
pF
-
5.9
-
ns
[1]
Pulse test: tp  300 s;   0.02.
[2]
When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 8 November 2011
© NXP B.V. 2011. All rights reserved.
4 of 12
BAT46WJ
NXP Semiconductors
Single Schottky barrier diode
006aac387
1
(3)
(4)
IF
(A)
10−1
006aac388
10−2
IR
(A)
10−3
(5)
(1)
10−4
(1)
(2)
(2)
(3)
10−5
10−2
10−6
(4)
(3)
(5)
(4)
10−7
10−3
10−8
10−4
0.0
(5)
10−9
0.4
0.8
0
1.2
20
VF (V)
(1) Tamb = 150 C
60
80
VR (V)
100
(1) Tamb = 125 C
(2) Tamb = 125 C
(2) Tamb = 85 C
(3) Tamb = 85 C
(3) Tamb = 60 C
(4) Tamb = 25 C
(4) Tamb = 25 C
(5) Tamb = 40 C
(5) Tamb = 40 C
Fig 3.
40
Forward current as a function of forward
voltage; typical values
Fig 4.
Reverse current as a function of reverse
voltage; typical values
006aac389
35
Cd
(pF)
30
25
20
15
10
5
0
0
20
40
60
80
100
VR (V)
f = 1 MHz; Tamb = 25 C
Fig 5.
Diode capacitance as a function of reverse voltage; typical values
BAT46WJ
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 8 November 2011
© NXP B.V. 2011. All rights reserved.
5 of 12
BAT46WJ
NXP Semiconductors
Single Schottky barrier diode
006aac390
0.25
PR(AV)
(W)
006aac391
0.3
(1)
IF(AV)
(A)
0.20
0.2
(2)
0.15
(1)
(2)
0.10
(3)
(3)
0.1
(4)
(4)
0.05
0.0
0.0
0
20
40
60
80
100
0
25
50
75
100
125
VR (V)
Tj = 125 C
150
175
Tamb (°C)
FR4 PCB, standard footprint
Tj = 150 C
(1)  = 1
(2)  = 0.9
(1)  = 1; DC
(3)  = 0.8
(2)  = 0.5; f = 20 kHz
(4)  = 0.5
(3)  = 0.2; f = 20 kHz
(4)  = 0.1; f = 20 kHz
Fig 6.
Average reverse power dissipation as a
function of reverse voltage; typical values
Fig 7.
006aac392
0.3
(1)
IF(AV)
(A)
0.2
Average forward current as a function of
ambient temperature; typical values
006aac393
0.3
(1)
IF(AV)
(A)
0.2
(2)
(2)
(3)
0.1
(3)
0.1
(4)
0.0
(4)
0.0
0
25
50
75
100
125
150
175
Tamb (°C)
0
25
50
75
100
125
150
175
Tsp (°C)
Tj = 150 C
FR4 PCB, mounting pad for cathode 1 cm2
Tj = 150 C
(1)  = 1; DC
(1)  = 1; DC
(2)  = 0.5; f = 20 kHz
(2)  = 0.5; f = 20 kHz
(3)  = 0.2; f = 20 kHz
(3)  = 0.2; f = 20 kHz
(4)  = 0.1; f = 20 kHz
(4)  = 0.1; f = 20 kHz
Fig 8.
Average forward current as a function of
ambient temperature; typical values
BAT46WJ
Product data sheet
Fig 9.
Average forward current as a function of
solder point temperature; typical values
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 8 November 2011
© NXP B.V. 2011. All rights reserved.
6 of 12
BAT46WJ
NXP Semiconductors
Single Schottky barrier diode
8. Test information
tr
tp
t
D.U.T.
10 %
+ IF
IF
RS = 50 Ω
SAMPLING
OSCILLOSCOPE
trr
t
Ri = 50 Ω
V = VR + IF × RS
(1)
90 %
VR
mga881
input signal
output signal
(1) IR = 1 mA
Input signal: reverse pulse rise time tr = 0.6 ns; reverse voltage pulse duration tp = 100 ns; duty cycle  = 0.05
Oscilloscope: rise time tr = 0.35 ns
Fig 10. Reverse recovery time test circuit and waveforms
P
t2
duty cycle δ =
t1
t2
t1
t
006aaa812
Fig 11. Duty cycle definition
The current ratings for the typical waveforms as shown in Figure 7, 8 and 9 are
calculated according to the equations: I F  AV  = I M   with IM defined as peak current,
I RMS = I F  AV 
at DC, and I RMS = I M   with IRMS defined as RMS current.
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
BAT46WJ
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 8 November 2011
© NXP B.V. 2011. All rights reserved.
7 of 12
BAT46WJ
NXP Semiconductors
Single Schottky barrier diode
9. Package outline
1.35
1.15
0.80
0.65
0.5
0.3
1
2.7
2.3
1.8
1.6
2
0.25
0.10
0.40
0.25
Dimensions in mm
04-09-13
Fig 12. Package outline SOD323F (SC-90)
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
BAT46WJ
[1]
Package
SOD323F
Description
Packing quantity
4 mm pitch, 8 mm tape and reel
3000
10000
-115
-135
For further information and the availability of packing methods, see Section 14.
11. Soldering
3.05
2.2
2.1
solder lands
solder resist
0.5 (2×)
1.65 0.95
0.6 (2×)
solder paste
occupied area
0.5
(2×)
0.6
(2×)
Dimensions in mm
sod323f_fr
Reflow soldering is the only recommended soldering method.
Fig 13. Reflow soldering footprint SOD323F (SC-90)
BAT46WJ
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 8 November 2011
© NXP B.V. 2011. All rights reserved.
8 of 12
BAT46WJ
NXP Semiconductors
Single Schottky barrier diode
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BAT46WJ v.2
20111108
Product data sheet
-
BAT46WJ v.1
Modifications:
BAT46WJ v.1
BAT46WJ
Product data sheet
•
•
•
Table 7: unit for reverse current IR at VR = 50 V corrected to A
Table 7: conditions of reverse voltage VR corrected
Section 13 “Legal information”: updated
20100728
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 8 November 2011
-
© NXP B.V. 2011. All rights reserved.
9 of 12
BAT46WJ
NXP Semiconductors
Single Schottky barrier diode
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
BAT46WJ
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 8 November 2011
© NXP B.V. 2011. All rights reserved.
10 of 12
BAT46WJ
NXP Semiconductors
Single Schottky barrier diode
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BAT46WJ
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 8 November 2011
© NXP B.V. 2011. All rights reserved.
11 of 12
BAT46WJ
NXP Semiconductors
Single Schottky barrier diode
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7
Quality information . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Packing information . . . . . . . . . . . . . . . . . . . . . 8
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 November 2011
Document identifier: BAT46WJ