Data Sheet

BAT54T
Single Schottky barrier diode
Rev. 01 — 14 December 2009
Product data sheet
1. Product profile
1.1 General description
Single planar Schottky barrier diode with an integrated guard ring for stress protection,
encapsulated in a SOT416 (SC-75) ultra small Surface-Mounted Device (SMD) plastic
package.
1.2 Features
„
„
„
„
Low forward voltage: max. 400 mV
Low capacitance: max. 10 pF
Ultra small SMD plastic package
AEC-Q101 qualified
1.3 Applications
„
„
„
„
Ultra high-speed switching
Voltage clamping
Protection circuits
Blocking diode
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
IF
forward current
VR
reverse voltage
VF
[1]
forward voltage
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
Conditions
IF = 10 mA
[1]
Min
Typ
Max
Unit
-
-
200
mA
-
-
30
V
-
-
400
mV
BAT54T
NXP Semiconductors
Single Schottky barrier diode
2. Pinning information
Table 2.
Pinning
Pin
Description
1
anode
2
not connected
3
cathode
Simplified outline
Graphic symbol
3
3
2
n.c.
1
1
006aaa436
2
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
BAT54T
SC-75
plastic surface-mounted package; 3 leads
SOT416
Table 4.
Marking codes
4. Marking
Type number
Marking code
BAT54T
ZW
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VR
reverse voltage
IF
forward current
IFRM
repetitive peak forward
current
tp ≤ 1 s; δ ≤ 0.5
IFSM
non-repetitive peak
forward current
square wave
Min
Max
Unit
-
30
V
-
200
mA
-
300
mA
tp = 100 μs
-
4
A
tp = 1 ms
-
2
A
-
1
A
tp = 10 ms
Tamb ≤ 25 °C
Ptot
total power dissipation
-
150
mW
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−55
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
BAT54T_1
Product data sheet
[1]
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 14 December 2009
2 of 9
BAT54T
NXP Semiconductors
Single Schottky barrier diode
6. Thermal characteristics
Table 6.
Symbol
Thermal characteristics
Parameter
Conditions
Rth(j-a)
thermal resistance from
junction to ambient
Rth(j-sp)
thermal resistance from
junction to solder point
in free air
Min
Typ
Max
Unit
[1]
-
-
833
K/W
[2]
-
-
350
K/W
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Soldering point of cathode tab.
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
VF
IR
Parameter
Conditions
Min
Typ
Max
Unit
IF = 0.1 mA
-
-
240
mV
IF = 1 mA
-
-
320
mV
IF = 10 mA
-
-
400
mV
IF = 30 mA
-
-
500
mV
IF = 100 mA
-
-
800
mV
-
-
2
μA
-
-
5
ns
-
-
10
pF
[1]
forward voltage
reverse current
trr
reverse recovery
time
Cd
diode capacitance
VR = 25 V
[2]
VR = 1 V; f = 1 MHz
[1]
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
[2]
When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA.
BAT54T_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 14 December 2009
3 of 9
BAT54T
NXP Semiconductors
Single Schottky barrier diode
msa892
103
IF
(mA)
msa893
103
IR
(μA)
(1) (2) (3)
102
(1)
102
(2)
10
10
1
10−1
(1)
(2) (3)
0
1
0.4
0.8
VF (V)
(3)
10−1
0
1.2
10
(1) Tamb = 125 °C
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
(3) Tamb = 25 °C
Fig 1.
Forward current as a function of forward
voltage; typical values
Fig 2.
20
VR (V)
30
Reverse current as a function of reverse
voltage; typical values
msa891
15
Cd
(pF)
10
5
0
0
10
20
VR (V)
30
f = 1 MHz; Tamb = 25 °C
Fig 3.
Diode capacitance as a function of reverse voltage; typical values
BAT54T_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 14 December 2009
4 of 9
BAT54T
NXP Semiconductors
Single Schottky barrier diode
8. Test information
tr
t
D.U.T.
RS = 50 Ω
tp
10 %
+ IF
IF
SAMPLING
OSCILLOSCOPE
trr
t
Ri = 50 Ω
V = VR + IF × RS
VR
(1)
90 %
mga881
input signal
output signal
(1) IR = 1mA
Fig 4.
Reverse recovery time test circuit and waveforms
9. Package outline
0.95
0.60
1.8
1.4
3
0.45
0.15
1.75 0.9
1.45 0.7
1
2
0.30
0.15
0.25
0.10
1
Dimensions in mm
Fig 5.
Package outline SOT416 (SC-75)
BAT54T_1
Product data sheet
04-11-04
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 14 December 2009
5 of 9
BAT54T
NXP Semiconductors
Single Schottky barrier diode
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package Description
Packing quantity
3000
10000
BAT54T
SOT416
-115
-135
[1]
4 mm pitch, 8 mm tape and reel
For further information and the availability of packing methods, see Section 14.
11. Soldering
2.2
1.7
solder lands
solder resist
1
0.85
2
solder paste
0.5
(3×)
occupied area
Dimensions in mm
0.6
(3×)
1.3
Fig 6.
Reflow soldering footprint SOT416 (SC-75)
BAT54T_1
Product data sheet
sot416_fr
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 14 December 2009
6 of 9
BAT54T
NXP Semiconductors
Single Schottky barrier diode
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BAT54T_1
20091214
Product data sheet
-
-
BAT54T_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 14 December 2009
7 of 9
BAT54T
NXP Semiconductors
Single Schottky barrier diode
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
Definition
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BAT54T_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 14 December 2009
8 of 9
BAT54T
NXP Semiconductors
Single Schottky barrier diode
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
General description . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quick reference data . . . . . . . . . . . . . . . . . . . .
Pinning information . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal characteristics . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Test information . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
Packing information . . . . . . . . . . . . . . . . . . . . .
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
2
2
2
2
3
3
5
5
6
6
7
8
8
8
8
8
8
9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 14 December 2009
Document identifier: BAT54T_1
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