Material Content Data Sheet Sales Product Name BSC010N04LSI MA# MA000974064 Package PG-TDSON-8-17 Issued 2. June 2015 Weight* 119.16 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal inorganic material non noble metal non noble metal non noble metal inorganic material non noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper gold carbon black epoxy resin silicondioxide tin silver silver tin lead phosphorus zinc iron copper phosphorus zinc iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7723-14-0 7440-66-6 7439-89-6 7440-50-8 1.517 1.27 0.038 0.03 wire encapsulation leadfinish plating solder heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.27 12733 12733 317 0.011 0.01 37.762 31.70 31.74 316892 95 317304 0.044 0.04 0.04 373 373 0.086 0.07 719 6.079 5.10 36.646 30.75 35.92 307530 359264 1.470 1.23 1.23 12334 12334 0.166 0.14 0.14 1389 1389 0.053 0.04 0.042 0.04 2.010 1.69 0.003 0.00 0.013 0.01 113 0.269 0.23 2255 10.909 9.15 0.007 0.01 0.026 0.02 222 0.529 0.44 4440 21.482 18.03 51015 442 353 1.77 16872 9.39 91547 2. 3. 18.50 180276 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 93943 55 Important Remarks: 1. 17667 28 184993 1000000