Data Sheet

PMEG2020CPA
2 A low VF dual MEGA Schottky barrier rectifier
Rev. 1 — 5 August 2010
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier in
common cathode configuration with an integrated guard ring for stress protection,
encapsulated in a SOT1061 leadless small Surface-Mounted Device (SMD) plastic
package with medium power capability.
1.2 Features and benefits
„
„
„
„
„
„
Average forward current: IF(AV) ≤ 2 A
Reverse voltage: VR ≤ 20 V
Low forward voltage
Exposed heat sink (cathode pad) for excellent thermal and electrical conductivity
Leadless small SMD plastic package with medium power capability
AEC-Q101 qualified
1.3 Applications
„
„
„
„
„
„
Low voltage rectification
High efficiency DC-to-DC conversion
Switch Mode Power Supply (SMPS)
Reverse polarity protection
Low power consumption applications
Battery chargers for mobile equipment
1.4 Quick reference data
Table 1.
Quick reference data
Tj = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
average forward
current
square wave;
δ = 0.5; f = 20 kHz
Min
Typ
Max
Unit
-
-
2
A
Per diode
IF(AV)
Tamb ≤ 80 °C
Tsp ≤ 140 °C
VR
reverse voltage
VF
forward voltage
IR
reverse current
[1]
[1]
-
-
2
A
-
-
20
V
IF = 2 A
-
385
420
mV
VR = 20 V
-
380
1000
μA
Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.
PMEG2020CPA
NXP Semiconductors
2 A low VF dual MEGA Schottky barrier rectifier
2. Pinning information
Table 2.
Pinning
Pin
Description
Simplified outline
1
anode diode 1
2
anode diode 2
3
common cathode
Graphic symbol
3
3
1
2
1
Transparent top view
2
006aaa438
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
PMEG2020CPA HUSON3 plastic thermal enhanced ultra thin small outline package; SOT1061
no leads; three terminals; body 2 × 2 × 0.65 mm
4. Marking
Table 4.
Marking codes
Type number
Marking code
PMEG2020CPA
AL
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VR
reverse voltage
Tj ≤ 25 °C
-
20
V
IF(AV)
average forward current
square wave;
δ = 0.5;
f = 20 kHz
-
2
A
Per diode
Tamb ≤ 80 °C
PMEG2020CPA
Product data sheet
[1]
Tsp ≤ 140 °C
-
2
A
IFRM
repetitive peak forward
current
tp ≤ 1 ms;
δ ≤ 0.25
-
7
A
IFSM
non-repetitive peak
forward current
square wave;
tp = 8 ms
-
9
A
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Rev. 1 — 5 August 2010
[2]
© NXP B.V. 2010. All rights reserved.
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2 A low VF dual MEGA Schottky barrier rectifier
Table 5.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
[3][4]
-
500
mW
[3][5]
-
960
mW
[1][3]
-
1800
mW
Per device, one diode loaded
total power dissipation
Ptot
Tamb ≤ 25 °C
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−55
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
[2]
Tj = 25 °C prior to surge.
[3]
Reflow soldering is the only recommended soldering method.
[4]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[5]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
Table 6.
Symbol
Thermal characteristics
Parameter
Conditions
Min
Typ
Max
Unit
[3]
-
-
250
K/W
[4]
-
-
130
K/W
[5]
-
-
70
K/W
[6]
-
-
12
K/W
Per device, one diode loaded
Rth(j-a)
Rth(j-sp)
PMEG2020CPA
Product data sheet
thermal resistance from
junction to ambient
in free air
thermal resistance from
junction to solder point
[1][2]
[1]
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses.
[2]
Reflow soldering is the only recommended soldering method.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[4]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[5]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
[6]
Soldering point of cathode tab.
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Rev. 1 — 5 August 2010
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NXP Semiconductors
2 A low VF dual MEGA Schottky barrier rectifier
006aac403
103
Zth(j-a)
(K/W)
duty cycle =
1
0.75
0.5
102
0.33
0.25
0.2
0.1
0.05
10
0.02
0.01
0
1
10−3
10−2
10−1
1
10
102
103
tp (s)
FR4 PCB, standard footprint
Fig 1.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aac404
103
Zth(j-a)
(K/W)
duty cycle =
1
102
0.75
0.5
0.33
0.25
0.1
10
0
1
10−3
0.2
0.05
0.02
0.01
10−2
10−1
1
10
102
103
tp (s)
FR4 PCB, mounting pad for cathode 1 cm2
Fig 2.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG2020CPA
Product data sheet
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Rev. 1 — 5 August 2010
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NXP Semiconductors
2 A low VF dual MEGA Schottky barrier rectifier
102
006aac405
duty cycle =
1
0.75
Zth(j-a)
(K/W)
0.5
0.33
10
0.25
0.2
0.1
0.05
0
0.02
0.01
1
10−3
10−2
10−1
1
102
10
103
tp (s)
Ceramic PCB, Al2O3, standard footprint
Fig 3.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
7. Characteristics
Table 7.
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
forward voltage
IF = 100 mA
-
220
-
mV
IF = 1 A
-
320
360
mV
Per diode
VF
IR
Cd
trr
[1]
PMEG2020CPA
Product data sheet
reverse current
diode capacitance
IF = 2 A
-
385
420
mV
VR = 10 V
-
160
-
μA
VR = 20 V
-
380
1000
μA
f = 1 MHz
VR = 1 V
-
175
-
pF
VR = 10 V
-
65
-
pF
-
55
-
ns
reverse recovery time
[1]
When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA.
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2 A low VF dual MEGA Schottky barrier rectifier
006aac406
10
IF
(A)
(1)
1
006aac407
1
IR
(A)
10−1
(1)
(2)
(2)
10−2
(3)
10−1
(4)
(5)
10−3
(3)
10−4
10−2
10−5
10−3
10−6
10−4
0.0
(4)
10−7
0.2
0.4
0.6
0
4
VF (V)
(1) Tj = 150 °C
(1) Tj = 125 °C
(2) Tj = 125 °C
(2) Tj = 85 °C
(3) Tj = 85 °C
(3) Tj = 25 °C
(4) Tj = 25 °C
(4) Tj = −40 °C
8
12
16
VR (V)
20
(5) Tj = −40 °C
Fig 4.
Forward current as a function of forward
voltage; typical values
Fig 5.
Reverse current as a function of reverse
voltage; typical values
006aac408
350
Cd
(pF)
300
250
200
150
100
50
0
0
5
10
15
20
VR (V)
f = 1 MHz; Tamb = 25 °C
Fig 6.
Diode capacitance as a function of reverse voltage; typical values
PMEG2020CPA
Product data sheet
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2 A low VF dual MEGA Schottky barrier rectifier
006aac409
1.2
PR(AV)
(W)
(4)
PF(AV)
(W)
006aac410
4.0
(3)
3.0
(2)
0.8
(1)
(1)
2.0
(2)
(3)
0.4
1.0
(4)
0.0
0.0
1.0
2.0
0.0
0.0
3.0
6.0
12.0
IF(AV) (A)
Tj = 150 °C
Tj = 125 °C
(1) δ = 0.1
(1) δ = 1
(2) δ = 0.2
(2) δ = 0.9
(3) δ = 0.5
(3) δ = 0.8
(4) δ = 1
(4) δ = 0.5
Fig 7.
18.0
VR (V)
Average forward power dissipation as a
function of average forward current; typical
values
006aac411
3.0
Fig 8.
Average reverse power dissipation as a
function of reverse voltage; typical values
006aac412
3.0
(1)
IF(AV)
(A)
IF(AV)
(A)
(1)
(2)
2.0
2.0
(2)
(3)
(3)
1.0
(4)
1.0
(4)
0.0
0.0
0
25
50
75
100
125
150
175
Tamb (°C)
0
25
50
Tj = 150 °C
150
175
Tamb (°C)
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Average forward current as a function of
ambient temperature; typical values
Product data sheet
125
Tj = 150 °C
(1) δ = 1; DC
PMEG2020CPA
100
FR4 PCB, mounting pad for cathode 1 cm2
FR4 PCB, standard footprint
Fig 9.
75
Fig 10. Average forward current as a function of
ambient temperature; typical values
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NXP Semiconductors
2 A low VF dual MEGA Schottky barrier rectifier
006aac413
3.0
006aac414
3.0
(1)
(1)
IF(AV)
(A)
IF(AV)
(A)
(2)
(2)
2.0
2.0
(3)
(3)
(4)
1.0
(4)
1.0
0.0
0.0
0
25
50
75
100
125
150
175
Tamb (°C)
0
25
50
75
100
125
150
175
Tsp (°C)
Tj = 150 °C
Ceramic PCB, Al2O3, standard footprint
Tj = 150 °C
(1) δ = 1; DC
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig 11. Average forward current as a function of
ambient temperature; typical values
PMEG2020CPA
Product data sheet
Fig 12. Average forward current as a function of
solder point temperature; typical values
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8. Test information
tr
tp
t
D.U.T.
10 %
+ IF
IF
RS = 50 Ω
SAMPLING
OSCILLOSCOPE
V = VR + IF × RS
trr
t
Ri = 50 Ω
(1)
90 %
VR
mga881
input signal
output signal
(1) IR = 1 mA
Fig 13. Reverse recovery time test circuit and waveforms
P
t2
duty cycle δ =
t1
t2
t1
t
006aaa812
Fig 14. Duty cycle definition
The current ratings for the typical waveforms as shown in Figure 9, 10, 11 and 12 are
calculated according to the equations: I F ( AV ) = I M × δ with IM defined as peak current,
I RMS = I F ( AV ) at DC, and I RMS = I M × δ with IRMS defined as RMS current.
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
PMEG2020CPA
Product data sheet
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Rev. 1 — 5 August 2010
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2 A low VF dual MEGA Schottky barrier rectifier
9. Package outline
1.3
0.65
max
0.35
0.25
1
1.05
0.95
2
0.45
0.35
1.1
0.9
0.3
0.2
2.1
1.9
3
1.6
1.4
Dimensions in mm
2.1
1.9
09-11-12
Fig 15. Package outline SOT1061
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
3000
PMEG2020CPA
[1]
PMEG2020CPA
Product data sheet
SOT1061
4 mm pitch, 8 mm tape and reel
-115
For further information and the availability of packing methods, see Section 14.
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Rev. 1 — 5 August 2010
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11. Soldering
2.1
1.3
0.5 (2×)
0.4 (2×)
0.5 (2×)
0.6 (2×)
1.05
2.3
0.6
0.55
0.25
1.1
0.25
1.2
0.25
0.4
0.5
1.6
1.7
Dimensions in mm
solder paste = solder lands
solder resist
occupied area
sot1061_fr
Reflow soldering is the only recommended soldering method.
Fig 16. Reflow soldering footprint SOT1061
PMEG2020CPA
Product data sheet
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Rev. 1 — 5 August 2010
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12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PMEG2020CPA v.1
20100805
Product data sheet
-
-
PMEG2020CPA
Product data sheet
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Rev. 1 — 5 August 2010
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13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
PMEG2020CPA
Product data sheet
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Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9
Quality information . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Packing information . . . . . . . . . . . . . . . . . . . . 10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 5 August 2010
Document identifier: PMEG2020CPA
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