Data Sheet

PMEG2015EH; PMEG2015EJ
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
Rev. 03 — 15 January 2010
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an
integrated guard ring for stress protection encapsulated in small and flat SMD plastic
packages.
Table 1.
Product overview
Type number
Package
Configuration
NXP
JEITA
PMEG2015EH
SOD123F
-
single diode
PMEG2015EJ
SOD323F
SC-90
single diode
1.2 Features
„
„
„
„
Forward current: ≤ 1.5 A
Reverse voltage: ≤ 20 V
Very low forward voltage
Small and flat lead SMD plastic packages
1.3 Applications
„
„
„
„
„
Low voltage rectification
High efficiency DC-to-DC conversion
Switch mode power supply
Inverse polarity protection
Low and medium power general applications
1.4 Quick reference data
Table 2.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IF
forward current
Tsp ≤ 55 °C
-
-
1.5
A
VR
reverse voltage
-
-
20
V
-
560
660
mV
VF
[1]
forward voltage
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
IF = 1.5 A
[1]
PMEG2015EH; PMEG2015EJ
NXP Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
2. Pinning information
Table 3.
Pinning
Pin
Description
1
cathode
2
anode
Simplified outline
Symbol
[1]
1
1
2
2
sym001
001aab540
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
Description
Version
PMEG2015EH
-
plastic surface mounted package; 2 leads
SOD123F
PMEG2015EJ
SC-90
plastic surface mounted package; 2 leads
SOD323F
4. Marking
Table 5.
Marking codes
Type number
Marking code
PMEG2015EH
AD
PMEG2015EJ
EL
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
VR
reverse voltage
IF
forward current
Tsp ≤ 55 °C
IFRM
repetitive peak forward current tp ≤ 1 ms; δ ≤ 0.25
IFSM
non-repetitive peak forward
current
square wave;
tp = 8 ms
Ptot
total power dissipation
Tamb ≤ 25 °C
PMEG2015EH
PMEG2015EJ
Max
Unit
-
20
V
-
1.5
A
-
5.5
A
[1]
-
9
A
[1]
-
375
mW
[2]
-
830
mW
[1]
-
360
mW
[2]
-
830
mW
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
PMEG2015EH_EJ_3
Product data sheet
Min
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 15 January 2010
2 of 9
PMEG2015EH; PMEG2015EJ
NXP Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
Table 6.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Tstg
Conditions
storage temperature
Min
Max
Unit
−65
+150
°C
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance from
junction to ambient
in free air
Min
Typ
Max
Unit
[1][2]
-
-
330
K/W
[2][3]
-
-
150
K/W
[1][2]
-
-
350
K/W
[2][3]
-
-
150
K/W
PMEG2015EH
-
-
60
K/W
PMEG2015EJ
-
-
55
K/W
PMEG2015EH
PMEG2015EJ
Rth(j-sp)
thermal resistance from
junction to solder point
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses. Nomograms for determining the reverse
power losses PR and IF(AV) rating are available on request.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
7. Characteristics
Table 8.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VF
forward voltage
IF = 10 mA
[1]
-
240
270
mV
IF = 100 mA
[1]
-
300
350
mV
IF = 500 mA
[1]
-
400
460
mV
IF = 1 A
[1]
-
480
550
mV
IF = 1.5 A
[1]
-
560
660
mV
VR = 5 V
-
5
10
μA
VR = 8 V
-
7
20
μA
VR = 10 V
-
8
30
μA
VR = 15 V
-
10
50
μA
VR = 20 V
-
15
70
μA
VR = 1 V; f = 1 MHz
-
40
50
pF
IR
Cd
[1]
reverse current
diode capacitance
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
PMEG2015EH_EJ_3
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 15 January 2010
3 of 9
PMEG2015EH; PMEG2015EJ
NXP Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
006aaa402
104
IF
(mA)
103
IR
(μA)
102
006aaa403
105
(1)
104
(2)
103
(3)
102
(1)
(2)
(3)
(4)
(5)
(4)
10
10
1
1
10−1
10−1
(5)
10−2
10−3
10−2
0
0.1
0.2
0.3
0.4
0.5
0.6
VF (V)
0
5
15
20
VR (V)
(1) Tamb = 150 °C
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(2) Tamb = 125 °C
(3) Tamb = 85 °C
(3) Tamb = 85 °C
(4) Tamb = 25 °C
(4) Tamb = 25 °C
(5) Tamb = −40 °C
(5) Tamb = −40 °C
Fig 1.
10
Forward current as a function of forward
voltage; typical values
Fig 2.
Reverse current as a function of reverse
voltage; typical values
006aaa404
80
Cd
(pF)
60
40
20
0
0
5
10
15
20
VR (V)
Tamb = 25 °C; f = 1 MHz
Fig 3.
Diode capacitance as a function of reverse voltage; typical values
PMEG2015EH_EJ_3
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 15 January 2010
4 of 9
PMEG2015EH; PMEG2015EJ
NXP Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
8. Package outline
1.7
1.5
1.2
1.0
1.35
1.15
1
0.80
0.65
0.5
0.3
1
0.55
0.35
3.6
3.4
2.7
2.3
2.7
2.5
1.8
1.6
2
2
Dimensions in mm
Fig 4.
0.25
0.10
0.40
0.25
0.25
0.10
0.70
0.55
04-11-29
Package outline SOD123F
Dimensions in mm
Fig 5.
04-09-13
Package outline SOD323F (SC-90)
9. Packing information
Table 9.
Packing methods
The -xxx numbers are the last three digits of the 12NC ordering code.[1]
Type number
Package
PMEG2015EH SOD123F
Description
Packing quantity
4 mm pitch, 8 mm tape and reel
3000
10000
-115
-135
PMEG2015EJ SOD323F
[1]
For further information and the availability of packing methods, see Section 13.
10. Soldering
4.4
4
2.9
1.6
solder lands
solder resist
2.1 1.6
1.1 1.2
solder paste
occupied area
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 6.
Reflow soldering footprint SOD123F
PMEG2015EH_EJ_3
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 15 January 2010
5 of 9
PMEG2015EH; PMEG2015EJ
NXP Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
3.05
2.80
2.10
1.60
solder lands
solder resist
1.65
0.95
0.50
0.60
occupied area
solder paste
0.50
(2×)
001aab169
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 7.
Reflow soldering footprint SOD323F (SC-90)
PMEG2015EH_EJ_3
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 15 January 2010
6 of 9
PMEG2015EH; PMEG2015EJ
NXP Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
11. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PMEG2015EH_EJ_3
20100115
Product data sheet
-
PMEG2015EH_EJ_2
Modifications:
•
This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
PMEG2015EH_EJ_2
20050407
Product data sheet
-
PMEG2015EJ_1
PMEG2015EJ_1
20050302
Product data sheet
-
-
PMEG2015EH_EJ_3
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 15 January 2010
7 of 9
NXP Semiconductors
PMEG2015EH; PMEG2015EJ
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
Definition
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PMEG2015EH_EJ_3
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 15 January 2010
8 of 9
NXP Semiconductors
PMEG2015EH; PMEG2015EJ
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
General description . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quick reference data . . . . . . . . . . . . . . . . . . . .
Pinning information . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal characteristics . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
Packing information . . . . . . . . . . . . . . . . . . . . .
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
2
2
2
2
3
3
5
5
5
7
8
8
8
8
8
8
9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 15 January 2010
Document identifier: PMEG2015EH_EJ_3
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