Data Sheet

PMEG4002EB
0.2 A very low VF MEGA Schottky barrier rectifier in
SOD523 package
Rev. 02 — 13 January 2010
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a SOD523 (SC-79) ultra small
and flat lead Surface Mounted Device (SMD) plastic package.
1.2 Features
„
„
„
„
Forward current: 200 mA
Reverse voltage: 40 V
Very low forward voltage
Ultra small and flat lead SMD plastic package
1.3 Applications
„
„
„
„
„
Low voltage rectification
High efficiency DC-to-DC conversion
Switch mode power supply
Inverse polarity protection
Low power consumption applications
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
IF
VR
VF
[1]
Min
Typ
Max
Unit
forward current
-
-
200
mA
reverse voltage
-
-
40
V
-
520
600
mV
forward voltage
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
Conditions
IF = 200 mA
[1]
PMEG4002EB
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifier in SOD523 package
2. Pinning information
Table 2.
Pinning
Pin
Description
1
cathode
2
anode
Simplified outline
Symbol
[1]
1
1
2
2
sym001
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
PMEG4002EB
Package
Name
Description
Version
SC-79
plastic surface mounted package; 2 leads
SOD523
4. Marking
Table 4.
Marking codes
Type number
Marking code
PMEG4002EB
L9
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Max
Unit
VR
reverse voltage
-
40
V
IF
forward current
-
200
mA
IFRM
repetitive peak forward current tp ≤ 1 s; δ ≤ 0.5
-
300
mA
IFSM
non-repetitive peak forward
current
-
1
A
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
tp = 8.3 ms half
sine wave; JEDEC
method
PMEG4002EB_2
Product data sheet
Min
© NXP B.V. 2010. All rights reserved.
Rev. 02 — 13 January 2010
2 of 8
PMEG4002EB
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifier in SOD523 package
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Rth(j-a)
Conditions
thermal resistance from
junction to ambient
[1][2]
in free air
Min
Typ
Max
Unit
-
-
450
K/W
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses. Nomograms for determining the reverse
power losses PR and IF(AV) rating will be available on request.
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VF
forward voltage
IF = 0.1 mA
-
190
220
mV
IF = 1 mA
-
250
290
mV
IF = 10 mA
-
320
360
mV
IF = 100 mA
-
440
500
mV
-
520
600
mV
-
-
0.5
μA
-
-
20
pF
IF = 200 mA
IR
reverse current
VR = 25 V
Cd
diode
capacitance
VR = 1 V; f = 1 MHz
[1]
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
PMEG4002EB_2
Product data sheet
[1]
© NXP B.V. 2010. All rights reserved.
Rev. 02 — 13 January 2010
3 of 8
PMEG4002EB
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifier in SOD523 package
mld546
103
mld547
103
IF
(mA)
IR
(μA)
102
102
(1)
(2)
10
10
(1)
(2)
(3)
1
1
(3)
10−1
10−1
0
0.4
0.8
VF (V)
1.2
0
10
(1) Tamb = 125 °C
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
(3) Tamb = 25 °C
Fig 1.
Forward current as a function of forward
voltage; typical values
Fig 2.
20
30
VR (V)
40
Reverse current as a function of reverse
voltage; typical values
mld548
20
Cd
(pF)
16
12
8
4
0
0
10
20
30
VR (V)
40
Tamb = 25 °C; f = 1 MHz
Fig 3.
Diode capacitance as a function of reverse voltage; typical values
PMEG4002EB_2
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 02 — 13 January 2010
4 of 8
PMEG4002EB
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifier in SOD523 package
8. Package outline
0.85
0.75
0.65
0.58
1
1.65 1.25
1.55 1.15
2
0.34
0.26
0.17
0.11
Dimensions in mm
Fig 4.
02-12-13
Package outline SOD523 (SC-79)
9. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
PMEG4002EB
[1]
Package
SOD523
Description
Packing quantity
4 mm pitch, 8 mm tape and reel
3000
10000
-115
-135
For further information and the availability of packing methods, see Section 13.
10. Soldering
2.15
0.50 0.60
1.20
solder lands
solder paste
0.30
0.40
solder resist
occupied area
1.80
1.90
mgs343
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 5.
Reflow soldering footprint SOD523 (SC-79)
PMEG4002EB_2
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 02 — 13 January 2010
5 of 8
PMEG4002EB
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifier in SOD523 package
11. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PMEG4002EB_2
20100113
Product data sheet
-
PMEG4002EB_1
Modifications:
PMEG4002EB_1
•
This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
•
Figure 5 “Reflow soldering footprint SOD523 (SC-79)”: updated
20050712
Product data sheet
PMEG4002EB_2
Product data sheet
-
-
© NXP B.V. 2010. All rights reserved.
Rev. 02 — 13 January 2010
6 of 8
PMEG4002EB
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifier in SOD523 package
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PMEG4002EB_2
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 02 — 13 January 2010
7 of 8
PMEG4002EB
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifier in SOD523 package
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
General description . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quick reference data . . . . . . . . . . . . . . . . . . . .
Pinning information . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal characteristics . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
Packing information . . . . . . . . . . . . . . . . . . . . .
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
2
2
2
2
3
3
5
5
5
6
7
7
7
7
7
7
8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 13 January 2010
Document identifier: PMEG4002EB_2
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