Data Sheet

SO
D1
23W
PMEG4020ETR
40 V, 2 A low VF MEGA Schottky barrier rectifier
Rev. 1 — 5 October 2011
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a SOD123W small and flat
lead Surface-Mounted Device (SMD) plastic package.
1.2 Features and benefits
 Average forward current: IF(AV) ≤ 2 A
 Reverse voltage: VR ≤ 40 V
 Small and flat lead SMD plastic
package
 Low forward voltage
 AEC-Q101 qualified
 High power capability due to
clip-bonding technology
 High temperature Tj ≤ 175 °C
1.3 Applications
 Low voltage rectification
 Reverse polarity protection
 High efficiency DC-to-DC conversion
 Low power consumption applications
 Switch mode power supply
 High temperature applications
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
average forward
current
square wave; δ = 0.5; f = 20 kHz;
Tamb ≤ 110 °C
IF(AV)
Min
Typ
Max
Unit
-
-
2
A
square wave; δ = 0.5; f = 20 kHz;
Tsp ≤ 165 °C
-
-
2
A
[1]
VR
reverse voltage
Tj = 25 °C
-
-
40
V
VF
forward voltage
IF = 2 A; Tj = 25 °C
-
430
490
mV
IR
reverse current
VR = 40 V; Tj = 25 °C
-
25
100
µA
[1]
Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.
PMEG4020ETR
NXP Semiconductors
40 V, 2 A low VF MEGA Schottky barrier rectifier
2. Pinning information
Table 2.
Pin
Pinning information
Symbol Description
1
K
cathode[1]
2
A
anode
Simplified outline
Graphic symbol
1
1
SOD123W
[1]
2
2
sym001
The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
PMEG4020ETR
Package
Name
Description
Version
-
plastic surface-mounted package; 2 leads
SOD123W
4. Marking
Table 4.
Marking codes
Type number
Marking code
PMEG4020ETR
C1
PMEG4020ETR
Product data sheet
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PMEG4020ETR
NXP Semiconductors
40 V, 2 A low VF MEGA Schottky barrier rectifier
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VR
reverse voltage
Tj = 25 °C
average forward current
square wave; δ = 0.5; f = 20 kHz;
Tamb ≤ 110 °C
IF(AV)
Min
Max
Unit
-
40
V
-
2
A
square wave; δ = 0.5; f = 20 kHz;
Tsp ≤ 165 °C
-
2
A
-
50
A
[2][3]
-
680
mW
[4][3]
-
1150
mW
[1][3]
-
2140
mW
[1]
IFSM
non-repetitive peak forward
current
square wave; tp = 8 ms; Tj(init) = 25 °C
Ptot
total power dissipation
Tamb ≤ 25 °C
Tj
junction temperature
-
175
°C
Tamb
ambient temperature
-55
175
°C
Tstg
storage temperature
-65
175
°C
[1]
Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3]
Reflow soldering is the only recommended soldering method.
[4]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance
from junction to
ambient
in free air
Rth(j-sp)
thermal resistance
from junction to solder
point
Min
Typ
Max
Unit
[1][2][3]
-
-
220
K/W
[1][4][3]
-
-
130
K/W
[1][5][3]
-
-
70
K/W
[6]
-
-
18
K/W
[1]
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a
significant part of the total power losses.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3]
Reflow soldering is the only recommended soldering method.
[4]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[5]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
[6]
Soldering point of cathode tab.
PMEG4020ETR
Product data sheet
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Rev. 1 — 5 October 2011
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PMEG4020ETR
NXP Semiconductors
40 V, 2 A low VF MEGA Schottky barrier rectifier
006aab649
103
duty cycle =
Zth(j-a)
(K/W)
1
102
0.5
0.25
0.75
0.33
0.2
0.1
0.05
10
0.02
1
0.01
0
10−1
10−3
10−2
10−1
1
10
102
103
tp (s)
FR4 PCB, standard footprint
Fig 1.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aab650
103
Zth(j-a)
(K/W)
duty cycle =
1
102
0.5
0.25
0.75
0.33
0.2
0.1
10
0.05
0.02
1
0.01
0
10−1
10−3
10−2
10−1
1
10
102
103
tp (s)
FR4 PCB, mounting pad for cathode 1 cm2
Fig 2.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG4020ETR
Product data sheet
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Rev. 1 — 5 October 2011
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PMEG4020ETR
NXP Semiconductors
40 V, 2 A low VF MEGA Schottky barrier rectifier
102
006aab651
duty cycle =
1
Zth(j-a)
(K/W)
0.75
0.5
0.33
0.25
0.2
10
0.1
0.05
0.02
0.01
1
0
10−1
10−3
10−2
10−1
1
102
10
103
tp (s)
Ceramic PCB, Al2O3, standard footprint
Fig 3.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
7. Characteristics
Table 7.
Characteristics
Symbol
Parameter
Conditions
VF
forward voltage
IF = 0.1 A; Tj = 25 °C
-
295
330
mV
IF = 1 A; Tj = 25 °C
-
380
440
mV
IF = 2 A; Tj = 25 °C
-
430
490
mV
IF = 2 A; Tj = 125 °C
-
330
380
mV
VR = 10 V; Tj = 25 °C
-
5
-
µA
VR = 40 V; Tj = 25 °C
-
25
100
µA
VR = 10 V; Tj = 125 °C
-
4
-
mA
VR = 40 V; Tj = 125 °C
-
15
-
mA
VR = 1 V; f = 1 MHz; Tj = 25 °C
-
250
-
pF
VR = 10 V; f = 1 MHz; Tj = 25 °C
-
95
-
pF
IR
Cd
reverse current
diode capacitance
PMEG4020ETR
Product data sheet
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Rev. 1 — 5 October 2011
Min
Typ
Max
Unit
© NXP B.V. 2011. All rights reserved.
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PMEG4020ETR
NXP Semiconductors
40 V, 2 A low VF MEGA Schottky barrier rectifier
006aac733
10
IR
(A)
IF
(A)
(1)
(2)
(3)
1
10-1
(4)
(5)
(6)
006aac734
1
10-1
(1)
10-2
(2)
10-3
(3)
10-4
10-2
(4)
10-5
10-6
10-3
10-7
10-4
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
VF (V)
10-8
(5)
0
10
20
(1) Tj = 175 °C
(1) Tj = 150 °C
(2) Tj = 150 °C
(2) Tj = 125 °C
(3) Tj = 125 °C
(3) Tj = 85 °C
(4) Tj = 85 °C
(4) Tj = 25 °C
(5) Tj = 25 °C
(5) Tj = −40 °C
30
VR (V)
40
(6) Tj = −40 °C
Fig 4.
Forward current as a function of forward
voltage; typical values
Fig 5.
006aab654
600
Reverse current as a function of reverse
voltage; typical values
006aac735
1.0
PF(AV)
(W)
Cd
(pF)
(3)
(4)
0.8
400
(2)
0.6
(1)
0.4
200
0.2
0
0
10
20
30
0.0
40
VR (V)
f = 1 MHz; Tamb = 25 °C
0
1
2
IF(AV) (A)
3
Tj = 175 °C
(1) δ = 0.1
(2) δ = 0.2
(3) δ = 0.5
(4) δ = 1.0
Fig 6.
Diode capacitance as a function of reverse
voltage; typical values
PMEG4020ETR
Product data sheet
Fig 7.
Average forward power dissipation as a
function of average forward current; typical
values
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PMEG4020ETR
NXP Semiconductors
40 V, 2 A low VF MEGA Schottky barrier rectifier
006aac736
12
006aac737
3
(1)
PR(AV)
(W)
IF(AV)
(A)
(2)
8
2
(3)
4
(4)
1
(1)
(2)
(3)
(4)
0
0
10
20
30
VR (V)
0
40
0
50
100
Tj = 150 °C
FR4 PCB, standard footprint
(1) δ = 1.0
Tj = 175 °C
(2) δ = 0.9
(1) δ = 1.0 (DC)
(3) δ = 0.8
(2) δ = 0.5; f = 20 kHz
(4) δ = 0.5
(3) δ = 0.2; f = 20 kHz
150
200
Tamb (°C)
(4) δ = 0.1; f = 20 kHz
Fig 8.
Average reverse power dissipation as a
function of reverse voltage; typical values
006aac738
3
(1)
IF(AV)
(A)
Fig 9.
Average forward current as a function of
ambient temperature; typical values
006aac739
3
(1)
IF(AV)
(A)
(2)
(2)
2
2
(3)
(4)
1
0
(3)
0
(4)
1
50
100
150
200
Tamb (°C)
0
0
50
100
150
200
Tamb (°C)
FR4 PCB, mounting pad for cathode 1 cm2
Ceramic PCB, Al2O3, standard footprint
Tj = 175 °C
Tj = 175 °C
(1) δ = 1.0
(1) δ = 1.0 (DC)
(2) δ = 0.9
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.8
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.5
(4) δ = 0.1; f = 20 kHz
Fig 10. Average forward current as a function of
ambient temperature; typical values
PMEG4020ETR
Product data sheet
Fig 11. Average forward current as a function of
ambient temperature; typical values
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PMEG4020ETR
NXP Semiconductors
40 V, 2 A low VF MEGA Schottky barrier rectifier
006aac740
3
(1)
IF(AV)
(A)
(2)
2
(3)
(4)
1
0
0
50
100
150
Tsp (°C)
200
Tj = 175 °C
(1) δ = 1.0
(2) δ = 0.9
(3) δ = 0.8
(4) δ = 0.5
Fig 12. Average forward current as a function of solder point temperature; typical values
PMEG4020ETR
Product data sheet
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Rev. 1 — 5 October 2011
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40 V, 2 A low VF MEGA Schottky barrier rectifier
8. Test information
P
tcy
duty cycle δ =
tp
tcy
tp
t
006aac658
Fig 13. Duty cycle definition
The current ratings for the typical waveforms as shown in figures 9, 10, 11 and 12 are
calculated according to the equations: IF(AV) = IM × δ with IM defined as peak current,
IRMS = IF(AV) at DC, and IRMS = IM × √δ with IRMS defined as RMS current.
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics
Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and
is suitable for use in automotive applications.
9. Package outline
1.9
1.5
1.1
0.9
1
0.6
0.3
3.7
3.3
2.8
2.4
2
1.05
0.75
0.22
0.10
Dimensions in mm
08-11-06
Fig 14. Package outline SOD123W
PMEG4020ETR
Product data sheet
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40 V, 2 A low VF MEGA Schottky barrier rectifier
10. Packing information
Table 8.
Ordering information
The indicated -xxx are the last three digits of the 12NC ordering code. [1]
Type number
Package
Description
Packing quantity
3000
PMEG4020ETR
[1]
SOD123W
4 mm pitch, 8 mm tape and reel
-115
For further information and the availability of packing methods, see 14 “Contact information”.
11. Soldering
4.4
2.9
2.8
solder lands
solder resist
1.1 1.2
(2×) (2×)
2.1 1.6
solder paste
occupied area
1.1
(2×)
1.2
(2×)
Dimensions in mm
sod123w_fr
Reflow soldering is the only recommended soldering method.
Fig 15. Reflow soldering footprint for SOD123W
PMEG4020ETR
Product data sheet
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Rev. 1 — 5 October 2011
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PMEG4020ETR
NXP Semiconductors
40 V, 2 A low VF MEGA Schottky barrier rectifier
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PMEG4020ETR v.1
20111005
Product data sheet
-
-
PMEG4020ETR
Product data sheet
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Rev. 1 — 5 October 2011
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40 V, 2 A low VF MEGA Schottky barrier rectifier
13. Legal information
13.1 Data sheet status
Document status [1] [2]
Product status [3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term 'short data sheet' is explained in section "Definitions".
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
PMEG4020ETR
Product data sheet
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 5 October 2011
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40 V, 2 A low VF MEGA Schottky barrier rectifier
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PMEG4020ETR
Product data sheet
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40 V, 2 A low VF MEGA Schottky barrier rectifier
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
13
13.1
13.2
13.3
13.4
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
General description . . . . . . . . . . . . . . . . . . . . . .1
Features and benefits . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Quick reference data . . . . . . . . . . . . . . . . . . . . .1
Pinning information . . . . . . . . . . . . . . . . . . . . . . .2
Ordering information . . . . . . . . . . . . . . . . . . . . . .2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3
Thermal characteristics . . . . . . . . . . . . . . . . . . .3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Test information . . . . . . . . . . . . . . . . . . . . . . . . . .9
Quality information . . . . . . . . . . . . . . . . . . . . . . .9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9
Packing information . . . . . . . . . . . . . . . . . . . . .10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . .12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Contact information. . . . . . . . . . . . . . . . . . . . . .13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 5 October 2011
Document identifier: PMEG4020ETR
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