SO D1 28 PMEG4030ETP 40 V, 3 A low VF MEGA Schottky barrier rectifier Rev. 1 — 10 October 2011 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits Average forward current: IF(AV) ≤ 3 A Reverse voltage: VR ≤ 40 V Small and flat lead SMD plastic package Low forward voltage AEC-Q101 qualified High power capability due to clip-bonding technology High temperature Tj ≤ 175 °C 1.3 Applications Low voltage rectification Reverse polarity protection High efficiency DC-to-DC conversion Low power consumption applications Switch mode power supply High temperature applications 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions average forward current square wave; δ = 0.5; f = 20 kHz; Tamb ≤ 85 °C IF(AV) Min Typ Max Unit - - 3 A square wave; δ = 0.5; f = 20 kHz; Tsp ≤ 165 °C - - 3 A [1] VR reverse voltage Tj = 25 °C - - 40 V VF forward voltage IF = 3 A; Tj = 25 °C - 430 490 mV IR reverse current Tj = 25 °C; VR = 40 V - 35 200 µA [1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint. PMEG4030ETP NXP Semiconductors 40 V, 3 A low VF MEGA Schottky barrier rectifier 2. Pinning information Table 2. Pin Pinning information Symbol Description 1 K cathode[1] 2 A anode Simplified outline Graphic symbol 1 1 2 2 sym001 SOD128 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Ordering information Type number PMEG4030ETP Package Name Description Version - plastic surface-mounted package; 2 leads SOD128 4. Marking Table 4. Marking codes Type number Marking code PMEG4030ETP C3 PMEG4030ETP Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 October 2011 © NXP B.V. 2011. All rights reserved. 2 of 13 PMEG4030ETP NXP Semiconductors 40 V, 3 A low VF MEGA Schottky barrier rectifier 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VR reverse voltage Tj = 25 °C average forward current square wave; δ = 0.5; f = 20 kHz; Tamb ≤ 85 °C IF(AV) Min Max Unit - 40 V - 3 A square wave; δ = 0.5; f = 20 kHz; Tsp ≤ 165 °C - 3 A - 50 A [2][3] - 750 mW [4][3] - 1250 mW [1][3] - 2500 mW [1] IFSM non-repetitive peak forward current square wave; tp = 8 ms; Tj(init) = 25 °C Ptot total power dissipation Tamb ≤ 25 °C Tj junction temperature - 175 °C Tamb ambient temperature -55 175 °C Tstg storage temperature -65 175 °C [1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Reflow soldering is the only recommended soldering method. [4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Rth(j-a) thermal resistance from junction to ambient in free air Rth(j-sp) thermal resistance from junction to solder point Min Typ Max Unit [1][2][3] - - 200 K/W [1][4][3] - - 120 K/W [1][5][3] - - 60 K/W [6] - - 12 K/W [1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Reflow soldering is the only recommended soldering method. [4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [5] Device mounted on a ceramic PCB, Al2O3, standard footprint. [6] Soldering point of cathode tab. PMEG4030ETP Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 October 2011 © NXP B.V. 2011. All rights reserved. 3 of 13 PMEG4030ETP NXP Semiconductors 40 V, 3 A low VF MEGA Schottky barrier rectifier 006aab666 103 Zth(j-a) (K/W) duty cycle = 1 102 0.5 0.25 0.75 0.33 0.2 0.1 10 0.05 0.02 0.01 1 0 10−1 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, standard footprint Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aab667 103 Zth(j-a) (K/W) duty cycle = 102 1 0.5 0.25 0.75 0.33 0.2 0.1 10 0.05 0.02 0.01 1 0 10−1 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, mounting pad for cathode 1 cm2 Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PMEG4030ETP Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 October 2011 © NXP B.V. 2011. All rights reserved. 4 of 13 PMEG4030ETP NXP Semiconductors 40 V, 3 A low VF MEGA Schottky barrier rectifier 102 006aab668 duty cycle = 1 Zth(j-a) (K/W) 0.75 0.5 0.33 0.25 0.2 10 0.1 0.05 0.02 0.01 1 0 10−1 10−3 10−2 10−1 1 102 10 103 tp (s) Ceramic PCB, Al2O3, standard footprint Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 7. Characteristics Table 7. Characteristics Symbol Parameter Conditions VF forward voltage IF = 0.1 A; Tj = 25 °C - 285 320 mV IF = 1 A; Tj = 25 °C - 360 420 mV IF = 3 A; Tj = 25 °C - 430 490 mV IF = 3 A; Tj = 125 °C - 330 380 mV VR = 10 V; Tj = 25 °C - 7 - µA VR = 40 V; Tj = 25 °C - 35 200 µA VR = 10 V; Tj = 125 °C - 6 - mA VR = 40 V; Tj = 125 °C - 23 - mA IR Cd reverse current diode capacitance PMEG4030ETP Product data sheet Min Typ Max Unit VR = 1 V; f = 1 MHz; Tj = 25 °C - 350 - pF VR = 10 V; f = 1 MHz; Tj = 25 °C - 140 - pF All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 October 2011 © NXP B.V. 2011. All rights reserved. 5 of 13 PMEG4030ETP NXP Semiconductors 40 V, 3 A low VF MEGA Schottky barrier rectifier 006aac741 10 IR (A) IF (A) (1) 1 006aac742 1 10-1 (1) 10-2 (2) (2) (4) (3) (5) (6) (3) 10-3 10-1 10-4 (4) 10-2 10-5 10-6 10-3 10-7 10-4 0.0 0.2 0.4 VF (V) 0.6 10-8 (5) 0 10 (1) Tj = 175 °C (1) Tj = 150 °C (2) Tj = 150 °C (2) Tj = 125 °C (3) Tj = 125 °C (3) Tj = 85 °C (4) Tj = 85 °C (4) Tj = 25 °C (5) Tj = 25 °C (5) Tj = −40 °C 20 30 VR (V) 40 (6) Tj = −40 °C Fig 4. Forward current as a function of forward voltage; typical values Fig 5. 006aab671 800 Reverse current as a function of reverse voltage; typical values 006aac743 1.6 (4) Cd (pF) PF(AV) (W) (3) 600 1.2 (2) 400 0.8 200 0.4 0 0 10 20 30 0.0 40 VR (V) f = 1 MHz; Tamb = 25 °C (1) 0 1 2 3 4 5 IF(AV) (A) Tj = 175 °C (1) δ = 0.1 (2) δ = 0.2 (3) δ = 0.5 (4) δ = 1.0 Fig 6. Diode capacitance as a function of reverse voltage; typical values PMEG4030ETP Product data sheet Fig 7. Average forward power dissipation as a function of average forward current; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 October 2011 © NXP B.V. 2011. All rights reserved. 6 of 13 PMEG4030ETP NXP Semiconductors 40 V, 3 A low VF MEGA Schottky barrier rectifier 006aac744 10 PR(AV) (W) 006aac745 4.5 IF(AV) (A) 8 (1) 3.0 (2) 6 (3) (1) 4 (2) 1.5 (3) (4) 2 (4) 0 0 10 20 30 VR (V) 0 40 0 50 100 Tj = 150 °C FR4 PCB, standard footprint (1) δ = 1.0 Tj = 175 °C (2) δ = 0.9 (1) δ = 1.0 (DC) (3) δ = 0.8 (2) δ = 0.5; f = 20 kHz (4) δ = 0.5 (3) δ = 0.2; f = 20 kHz 150 200 Tamb (°C) (4) δ = 0.1; f = 20 kHz Fig 8. Average reverse power dissipation as a function of reverse voltage; typical values 006aac746 4.5 (1) IF(AV) (A) Fig 9. Average forward current as a function of ambient temperature; typical values 006aac747 4.5 (1) IF(AV) (A) (2) (2) 3.0 3.0 (3) (4) 1.5 0 (3) 0 (4) 1.5 50 100 150 200 Tamb (°C) 0 0 50 100 150 200 Tamb (°C) FR4 PCB, mounting pad for cathode 1 cm2 Ceramic PCB, Al2O3, standard footprint Tj = 175 °C Tj = 175 °C (1) δ = 1.0 (1) δ = 1.0 (DC) (2) δ = 0.9 (2) δ = 0.5; f = 20 kHz (3) δ = 0.8 (3) δ = 0.2; f = 20 kHz (4) δ = 0.5 (4) δ = 0.1; f = 20 kHz Fig 10. Average forward current as a function of ambient temperature; typical values PMEG4030ETP Product data sheet Fig 11. Average forward current as a function of ambient temperature; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 October 2011 © NXP B.V. 2011. All rights reserved. 7 of 13 PMEG4030ETP NXP Semiconductors 40 V, 3 A low VF MEGA Schottky barrier rectifier 006aac748 4.5 (1) IF(AV) (A) (2) 3.0 (3) (4) 1.5 0 0 50 100 150 Tsp (°C) 200 Tj = 175 °C (1) δ = 1.0 (2) δ = 0.9 (3) δ = 0.8 (4) δ = 0.5 Fig 12. Average forward current as a function of solder point temperature; typical values 8. Test information P tcy duty cycle δ = tp tcy tp t 006aac658 Fig 13. Duty cycle definition The current ratings for the typical waveforms as shown in figures 9, 10, 11 and 12 are calculated according to the equations: IF(AV) = IM × δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ with IRMS defined as RMS current. 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. PMEG4030ETP Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 October 2011 © NXP B.V. 2011. All rights reserved. 8 of 13 PMEG4030ETP NXP Semiconductors 40 V, 3 A low VF MEGA Schottky barrier rectifier 9. Package outline 2.7 2.3 1.1 0.9 0.6 0.3 1 5.0 4.4 4.0 3.6 2 1.9 1.6 0.22 0.10 Dimensions in mm 07-09-12 Fig 14. Package outline SOD128 10. Packing information Table 8. Ordering information The indicated -xxx are the last three digits of the 12NC ordering code. [1] Type number Package Description Packing quantity 3000 PMEG4030ETP [1] SOD128 4 mm pitch, 12 mm tape and reel -115 For further information and the availability of packing methods, see 14 “Contact information”. 11. Soldering 6.2 4.4 4.2 solder lands solder resist 1.9 2.1 (2×) (2×) 3.4 2.5 solder paste occupied area Dimensions in mm 1.2 (2×) 1.4 (2×) sod128_fr Reflow soldering is the only recommended soldering method. Fig 15. Reflow soldering footprint for SOD128 PMEG4030ETP Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 October 2011 © NXP B.V. 2011. All rights reserved. 9 of 13 PMEG4030ETP NXP Semiconductors 40 V, 3 A low VF MEGA Schottky barrier rectifier 12. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes PMEG4030ETP v.1 20111010 Product data sheet - - PMEG4030ETP Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 October 2011 © NXP B.V. 2011. All rights reserved. 10 of 13 PMEG4030ETP NXP Semiconductors 40 V, 3 A low VF MEGA Schottky barrier rectifier 13. Legal information 13.1 Data sheet status Document status [1] [2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Preview — The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 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This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 October 2011 © NXP B.V. 2011. All rights reserved. 11 of 13 PMEG4030ETP NXP Semiconductors 40 V, 3 A low VF MEGA Schottky barrier rectifier Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PMEG4030ETP Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 October 2011 © NXP B.V. 2011. All rights reserved. 12 of 13 PMEG4030ETP NXP Semiconductors 40 V, 3 A low VF MEGA Schottky barrier rectifier 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 Thermal characteristics . . . . . . . . . . . . . . . . . . .3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Test information . . . . . . . . . . . . . . . . . . . . . . . . . .8 Quality information . . . . . . . . . . . . . . . . . . . . . . .8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9 Packing information . . . . . . . . . . . . . . . . . . . . . .9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . .10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Contact information. . . . . . . . . . . . . . . . . . . . . .12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 10 October 2011 Document identifier: PMEG4030ETP