Automotive Brochure

Automotive Memory Products
Serial EEPROM
Powered for Automotive
www.microchip.com/memory
Microchip Serial Memory Products
Microchip Technology has developed industry-leading processes for each step in the design, manufacturing and testing phases
of its serial EEPROMs, and has become one of the most respected leaders in supply of these devices to the automotive
industry – worldwide.
Serial EEPROMs
All Major Bus Types
SPI
I2C™
Microwire
UNI/O®
Extended Temperatures
H-Temp
E-Temp
I-Temp
-40ºC to 150ºC
-40ºC to 125ºC
-40ºC to 85ºC
25LCXX
24LCXX
93LCXX
11LCXX
Serial
EEPROM
Tools
MPLAB® Starter Kit for
Serial Memory Products
Total Endurance™ Software
Verilog and IBIS Models
Microchip Advanced Parts
Selector (MAPS)
Complete Product Lines
Density:
Speed:
128 bits to 1 Mbit
Up to 20 MHz
Highest Quality
QS9000; ISO/TS16949
AEC-Q100 Compliant
Pb-Free Parts
Halogen Free Parts
RoHS Compliant
Long Product Life Cycles
Operating Voltages
Innovative Packages and Die
PDIP, SOIC, TSSOP, T-DFN, MSOP,
SOT-23, SC70, WLCSP, Die and Wafer
Reliability
High Endurance: 1 Million E/W Cycles
Data Retention: Over 200 Years
Serial SRAM
Looking for RAM memory also? Microchip’s SPI
Serial SRAM products offer:
■ A quick and easy way to add external RAM
■ 4-pin SPI interface
■ 8 and 32 Kbyte options
■ 20 MHz clock speed
■ No write cycle time
LC:
AA:
C:
VL:
2.5-5.5V
1.7-5.5V
4.5-5.5V
1.5V-3.6V
Robust Design
■ ESD Protection
> 4000V Human Body Model (HBM)
> 400V Machine Model (MM)
> 1000V Charged Device Model
■ Latch-up protection > 200 mA on all pins
■ ESD Induced Latch-up > 100V (MM) on VDD; >400V on all I/O
> 1M cycles Endurance and > 200 years data retention
■ Up to 150°C Operation (reads and writes)
■ Power-On Reset (POR) and Brown-Out Reset (BOR)
– Effective protection against noisy automotive environments
– Eliminates false writes
■ Schmitt Trigger input filters for noise reduction
■ Complete traceability including die location on wafer
Wafer-level Burn-in
Microchip’s Triple Test Flow is currently the most
robust testing procedure for serial EEPROM devices in
the industry. It tests each cell of each die three times
and also performs extensive endurance and data
retention tests to ensure quality and reliability.
Infant mortality of Microchip serial EEPROMs is among the lowest
in the industry due to this extensive testing, excellent fabrication
and highly reliable memory cell design.
Microchip’s Triple Test and
Wafer-level Burn-in Procedure
Traditional Burn-in
(Old Technology)
General purpose non-specific testing procedure
for random logic cells
■ Non-specific and untargeted testing
mechanism – Increases failure rates.
■ Expensive, time consuming and inefficient.
■ Introduces defect modes like bent leads
and EOS that sometimes go undetected.
Moving beyond traditional burn-in to wafer level burn-in with the Triple
Test Flow specifically targeted for memory cells has helped create the
industry’s most reliable memory products.
■ Extensive Testing – Every cell in every die is tested three times,
including specific endurance and data retention tests to ensure
highest quality.
■ HVST, LVHF and TVPP tests target specific defects.
■ Maverick, SBY and GBN target overall failure patterns and trends.
■ Insight into failure modes along with flexible test flow ensures
continues improvement.
Triple Test Flow
Microchip tests every cell in wafer form twice, then performs a final test after assembly.
Retention Bake
1: Wafer Probe
Full functional
tests on 100% of
die and bits;
85ºC or 125ºC
5000 erase/write
cycles on all bits
2: Wafer Probe
2nd 100% bit
test (25ºC)
full-functional
screen
3:
Assembly
& Final
Test
• 250ºC up to 24 hours
• Equivalent to 100
years at 85ºC
Key Aspects:
Endurance Testing
MAVERICK
HVST
TVPP
Any die with charge loss in
any cell between the
2 probes is rejected to
prevent infant mortality
Key Aspects:
Functional Test
Verify Margins
GBN
EDIO
LVHF
SBY
Main Goals – Zero Defects
■ Full verification of data sheet parameters for
functional compliance at die and package
level.
■ Removal of manufacturing defects to ensure
highest quality and reliability.
■ Screening out of functional devices that may
fail in the future.
Wafer Probe Quality Screens
Microchip performs additional in-house testing
during wafer probe to ensure all parts are of
the highest quality and to eliminate any devices
that are outside the normal distribution or might
possibly fail in the future.
High Voltage Stress Test (HVST)
HVST targets weak devices with oxide defects in
RAM and logic circuits. HVST is a targeted test
that eliminates these devices by stressing the
oxides at higher than normal voltages.
Time at Vpp (TVPP)
TVPP targets oxide defects in EEPROM cells,
charge pumps and other high-voltage circuits.
Programming voltages (VPP) are applied to the
memory array for an extended period of time in
order to highlight any weak devices.
Low Voltage High Frequency (LVHF)
LVHF targets signal paths that are partially
blocked and therefore more resistive than normal.
LVHF eliminates these devices by requiring them
to operate faster than specified and at voltages
lower than specified.
Good Die in a Bad Neighborhood (GBN) and Edge Die Ink Out (EDIO)
Special algorithms target devices that function, but are suspect
because of their proximity to clusters of failing devices or edge die.
Failing Die
Rejected by
GBN screen
Passing Die
Rejected by
EDIO screen
Rejected by
EDIO screen
(Concept)
Maverick Test
Maverick test targets wafer lots with unusual parametric performance
and/or yields. Separate from device data sheet parameters, intrinsic
parameters such as transistor thresholds or thin film resistances are
measured. Maverick testing rejects wafer lots with values outside the
normal range.
Statistical Bin Yield (SBY)
SBY targets individual wafers with yields outside the normal range.
Within a wafer lot, occasionally an individual wafer will differ
significantly from the yield of all the other wafers. SBY rejects that
entire wafer.
Automotive Grade Quality and Tools
Microchip’s best-in-class field performance is the combined result of Wafer Level Burn-In and Wafer Probe Quality Screens.
Microchip Serial EEPROM Field Return Data
24C16 Competitive Endurance Data
2
100
Bit Fails (Bad Bits)
Oxide Fails
1.6
Logic Fails (Die Level)
1.4
Supplier ‘A’
Supplier ‘B’
Supplier ‘C’
Supplier ‘D’
MICROCHIP
90
Percentage of Defective Units
(Sample Size = 128 Units)
1.8
PPM (Field Returns)
QUALITY
Microchip Serial EEPROM Endurance
1.2
1
0.8
0.6
0.4
0.2
0 PPM
80
70
60
50
40
30
20
10
0
1H-2005
2H-2005
1H-2006
2H-2006
1H-2007
2H-2007
1H-2008
2H-2008
0
Year
■ Industry lowest field return numbers – best suited for
automotive applications
Total Endurance™ Software
Total Endurance Software provides a comprehensive
model that helps estimate the endurance and reliability of
Microchip Serial EEPROM devices. By providing operating
conditions
based on your
application, all
design tradeoffs affecting
reliability can
be accurately
estimated both
graphically and
numerically in
PPM, FIT and
MTBF modes,
saving time and
ensuring a truly
robust design.
No Fails
0
500,000
1,000,000
1,500,000
2,000,000
E/W Cycles at 85°C
■ All devices from supplier A and B failed
■ Testing shows zero Microchip EEPROM fails even at
2 million E/W cycles at 85ºC
Automotive Grade*
■ ISO TS-16949 (inc. VDA6.1)
compliant quality manufacturing
systems
■ Restricted site assembly
■ Production Parts Approval
Process (PPAP)
■ Exceeds AEC Q-100 product
qualification requirements
■ Special screening and test methods including Maverick
lot testing
■ Long product life cycle in support of automotive industry
15 year supply requirement
®
MICROCHIP
*Automotive grade criteria will evolve as market requirements change.
Now Offering I2C™ and SPI Serial EEPROMs with Optional Range from -55°C to +150°C
150oC
■ Automotive Turbo Chargers and Exhaust Gas Recirculation
■ Automotive fan motors, air valves, flaps and spark plugs
■ Areas under the vehicle hood
Additional Resources
Verilog and IBIS Models
Microchip Advanced Part Selector (MAPS): www.microchip.com/maps
Memory Products Webinars: http://techtrain.microchip.com/webseminars
Over 50 different application notes, many with source code options can be found at: www.microchip.com/appnotes
Get started with Microchip’s Serial EEPROMs in four easy steps: www.microchip.com/eeprom
MPLAB Starter Kit for Serial Memory Products (Part Number DV243003) and PIM Packs (AC243003)
Product Specifications
I2C™ Memory Products
Device
Density
(Organization)
24XX00
Max
Clock
Frequency
Operating
Voltage
(AA, LC, C)
Temperature
(I, E, H)
Endurance
(E/W
Cycles)
Data
Retention
Write
Protect
(Hardware)
Packages
128 bits (x8)
400 kHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
No
24XX01/014
1 Kbit (x8)
400 kHz
1.7V-5.5V
-40°C to +150ºC
1M
200 years
W, ½
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, SC70
24XX02/024
2 Kbits (x8)
400 kHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
W, ½
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, SC70
24XX04
4 Kbits (x8)
400 kHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
W, ½
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP
24XX08
8 Kbits (x8)
400 kHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
W, ½
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP
24XX16
16 Kbits (x8)
400 kHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
W, ½
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP
24XX32
32 Kbits (x8)
400 kHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
W, ¼
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP
24XX64/65
64 Kbits (x8)
1 MHz
1.7V-5.5V
-40°C to +125ºC
1M/10M
200 years
W, ¼
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP
24XX128
128 Kbits (x8)
1 MHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
Yes
PDIP, SOIC, TSSOP, 2x3 T-DFN, 6x5 DFN, MSOP, WLCSP
24XX256
256 Kbits (x8)
1 MHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
Yes
PDIP, SOIC, TSSOP, 6x5 DFN, MSOP, WLCSP
24XX512
512 Kbits (x8)
1 MHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
Yes
PDIP, SOIC, TSSOP, 6x5 DFN, WLCSP
24XX1025
1 Mbit (x8)
1 MHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
Yes
PDIP, SOIC, SOIJ, 6x5 DFN
UNI/O® Bus Memory Products
Device
Density
(Organization)
Max
Clock
Frequency
Operating
Voltage
(AA, LC)
Temperature
(I, E)
Endurance
(E/W
Cycles)
Data
Retention
Write
Protect
(Software)
Max
Standby
Current
Packages
11XX010
1 Kbit (x8)
100 kHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
W, ½, ¼
1 μA
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP
11XX020
2 Kbits (x8)
100 kHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
W, ½, ¼
1 μA
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP
11XX040
4 Kbits (x8)
100 kHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
W, ½, ¼
1 μA
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP
11XX080
8 Kbits (x8)
100 kHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
W, ½, ¼
1 μA
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP
11XX160
16 Kbits (x8)
100 kHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
W, ½, ¼
1 μA
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP
Packages
Microwire Memory Products
Density
(x8 or x16)
Max
Clock
Frequency
Operating
Voltage
(AA, LC, C)
Temperature
(I, E)
Endurance
(E/W
Cycles)
Data
Retention
Write
Protect
(Hardware)
Read
Current
93XX46A/B/C
1 Kbit
3 MHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
No
1 mA
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP
93XX56A/B/C
2 Kbits
3 MHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
No
1 mA
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP
93XX66A/B/C
4 Kbits
3 MHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
No
1 mA
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP
93XX76A/B/C
8 Kbits
3 MHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
Yes
1 mA
PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP
93XX86A/B/C
16 Kbits
3 MHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
Yes
1 mA
PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP
Device
A: x8 Organization, B: x16 Organization, C: Selectable x8 or x16 Organization
SPI Memory Products
Device
Density
(Organization)
Max Clock
Frequency
Operating
Voltage
(AA, LC)
Temperature
(I, E, H)
Endurance
(E/W
Cycles)
Data
Retention
Write Protect
(Software)
Packages
25XX010A
1 Kbit (x8)
10 MHz
1.8V-5.5V
-40°C to +150ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP, SOT-23
25XX020A
2 Kbits (x8)
10 MHz
1.8V-5.5V
-40°C to +150ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP, SOT-23
25XX040A
4 Kbits (x8)
10 MHz
1.8V-5.5V
-40°C to +150ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP, SOT-23
25XX080C/D
8 Kbits (x8)
10 MHz
1.8V-5.5V
-40°C to +150ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN
25XX160C/D
16 Kbits (x8)
10 MHz
1.8V-5.5V
-40°C to +150ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN
25XX320A
32 Kbits (x8)
10 MHz
1.8V-5.5V
-40°C to +150ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN
25XX640A
64 Kbits (x8)
10 MHz
1.8V-5.5V
-40°C to +150ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN
25XX128
128 Kbits (x8)
10 MHz
1.8V-5.5V
-40°C to +150ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, 6x5 DFN
25XX256
256 Kbits (x8)
10 MHz
1.8V-5.5V
-40°C to +150ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, 6x5 DFN
25XX512
512 Kbits (x8)
20 MHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, 6x5 DFN
25XX1024
1 Mbit (x8)
20 MHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
W, ½, ¼
PDIP, SOIJ, 6x5 DFN
1. Voltage Range: AA = 1.7- 5.5V; LC = 2.5-5.5V; C = 4.5-5.5V
2. I = -40ºC to 85ºC; E = -40ºC to 125ºC; H = -40ºC to 150ºC
3. Pb-Free, Halogen Free and RoHS Compliant
4. Write Protect: W = Whole Array, ½ = Half Array, ¼ = Quarter Array
5. ESD protection > 4 kV (HBM); > 400V (MM) on all pins
6. H Temp is SOIC only
SRAM Memory Products
Device
Density (Organization)
Max
Clock Frequency
Operating
Voltage (A, K)
Temperature
(I, E)
Read Current
(mA)
Max Standby
Current
Packages
23x640
8KB (64 Kbits)
20 MHz
1.8V, 3V
-40°C to +125ºC
3 mA
4 μA
PDIP, SOIC, TSSOP
23X256
32 KB (256 Kbits)
20 MHz
1.8V, 3V
-40°C to +125ºC
3 mA
4 μA
PDIP, SOIC, TSSOP
1. Voltage Range: A = 1.5- 1.95V; K = 2.7V-3.6V
2. All Devices are Pb-Free, RoHS Compliant and Halogen Free
For up to date product information visit: www.microchip.com/memory
Support
Training
Microchip is committed to supporting its customers
in developing products faster and more efficiently. We
maintain a worldwide network of field applications
engineers and technical support ready to provide product
and system assistance. In addition, the following service
areas are available at www.microchip.com:
■ Support link provides a way to get questions
answered fast: http://support.microchip.com
■ Sample link offers evaluation samples of any
Microchip device: http://sample.microchip.com
■ Forum link provides access to knowledge base and
peer help: http://forum.microchip.com
■ Buy link provides locations of Microchip Sales Channel
Partners: www.microchip.com/sales
If additional training interests you, then Microchip can
help. We continue to expand our technical training options,
offering a growing list of courses and in-depth curriculum
locally, as well as significant online resources – whenever
you want to use them.
■ Regional Training Centers: www.microchip.com/rtc
■ MASTERs Conferences: www.microchip.com/masters
■ Worldwide Seminars: www.microchip.com/seminars
■ eLearning: www.microchip.com/webseminars
■ Resources from our Distribution and Third Party Partners
www.microchip.com/training
Sales Office Listing
AMERICAS
Atlanta
Tel: 678-957-9614
Boston
Tel: 774-760-0087
Chicago
Tel: 630-285-0071
Cleveland
Tel: 216-447-0464
Dallas
Tel: 972-818-7423
Detroit
Tel: 248-538-2250
Kokomo
Tel: 765-864-8360
Los Angeles
Tel: 949-462-9523
Santa Clara
Tel: 408-961-6444
Toronto
Mississauga, Ontario
Tel: 905-673-0699
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Denmark - Copenhagen
Tel: 45-4450-2828
France - Paris
Tel: 33-1-69-53-63-20
Germany - Munich
Tel: 49-89-627-144-0
Italy - Milan
Tel: 39-0331-742611
Netherlands - Drunen
Tel: 31-416-690399
Spain - Madrid
Tel: 34-91-708-08-90
UK - Wokingham
Tel: 44-118-921-5869
ASIA/PACIFIC
Australia - Sydney
Tel: 61-2-9868-6733
China - Beijing
Tel: 86-10-8528-2100
China - Chengdu
Tel: 86-28-8665-5511
China - Hong Kong SAR
Tel: 852-2401-1200
China - Nanjing
Tel: 86-25-8473-2460
China - Qingdao
Tel: 86-532-8502-7355
China - Shanghai
Tel: 86-21-5407-5533
China - Shenyang
Tel: 86-24-2334-2829
China - Shenzhen
Tel: 86-755-8203-2660
China - Wuhan
Tel: 86-27-5980-5300
China - Xiamen
Tel: 86-592-2388138
China - Xian
Tel: 86-29-8833-7252
China - Zhuhai
Tel: 86-756-3210040
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-3090-4444
India - New Delhi
Tel: 91-11-4160-8631
India - Pune
Tel: 91-20-2566-1512
Japan - Yokohama
Tel: 81-45-471- 6166
Korea - Daegu
Tel: 82-53-744-4301
Korea - Seoul
Tel: 82-2-554-7200
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Malaysia - Penang
Tel: 60-4-227-8870
Philippines - Manila
Tel: 63-2-634-9065
Singapore
Tel: 65-6334-8870
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Taiwan - Taipei
Tel: 886-2-2500-6610
Thailand - Bangkok
Tel: 66-2-694-1351
3/26/09
The Microchip name and logo, the Microchip logo, MPLAB, PIC and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries. Total Endurance is a trademark of Microchip Technology Incorporated in the U.S.A.
and other countries. All other trademarks mentioned herein are property of their respective companies.
© 2009, Microchip Technology Incorporated, All Rights Reserved. Printed in the U.S.A. 9/09
DS22078C
*DS22078D*
www.microchip.com
Microchip Technology Inc.
2355 W. Chandler Blvd.
Chandler, AZ 85224-6199
Similar pages