Data Sheet

PMEG3002AELD
30 V, 0.2 A low VF MEGA Schottky barrier rectifier
Rev. 1 — 19 April 2011
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a SOD882D leadless ultra
small Surface-Mounted Device (SMD) plastic package with visible and solderable side
pads.
1.2 Features and benefits
„
„
„
„
Forward current: IF ≤ 0.2 A
Reverse voltage: VR ≤ 30 V
Low forward voltage: VF ≤ 480 mV
Ultra small and leadless SMD plastic
package
„ AEC-Q101 qualified
„ Solderable side pads
„ Package height typ. 0.37 mm
1.3 Applications
„
„
„
„
„
„
Low voltage rectification
High efficiency DC-to-DC conversion
Switch Mode Power Supply (SMPS)
Reverse polarity protection
Low power consumption applications
Ultra high-speed switching
1.4 Quick reference data
Table 1.
Quick reference data
Symbol Parameter
IF(AV)
average forward
current
Conditions
reverse current
VR
reverse voltage
VF
forward voltage
Typ
Max
Unit
-
-
0.2
A
-
-
0.2
A
-
3.5
10
μA
-
-
30
V
-
430
480
mV
square wave; δ = 0.5; f = 20 kHz
Tamb ≤ 125 °C
[1]
Tsp ≤ 140 °C
IR
Min
VR = 10 V
IF = 200 mA
[2]
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
cathode 1 cm2.
[2]
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
PMEG3002AELD
NXP Semiconductors
30 V, 0.2 A low VF MEGA Schottky barrier rectifier
2. Pinning information
Table 2.
Pinning
Pin
Description
1
cathode
2
anode
Simplified outline
Graphic symbol
[1]
1
1
2
2
sym001
Transparent
top view
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
Package
PMEG3002AELD
Name
Description
Version
-
leadless ultra small plastic package; 2 terminals;
body 1 × 0.6 × 0.4 mm
SOD882D
4. Marking
Table 4.
Marking codes
Type number
Marking code[1]
PMEG3002AELD
1101 0000
[1]
For SOD882D binary marking code description, see Figure 1.
4.1 Binary marking code description
CATHODE BAR
READING DIRECTION
VENDOR CODE
READING EXAMPLE:
0111
1011
MARKING CODE
(EXAMPLE)
READING DIRECTION
006aac477
Fig 1.
PMEG3002AELD
Product data sheet
SOD882D binary marking code description
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30 V, 0.2 A low VF MEGA Schottky barrier rectifier
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VR
reverse voltage
IF(AV)
average forward current
Min
Max
Unit
-
30
V
-
0.2
A
Tsp ≤ 140 °C
-
0.2
A
-
1
A
square wave; δ = 0.5;
f = 20 kHz
Tamb ≤ 125 °C
PMEG3002AELD
Product data sheet
[1]
IFRM
repetitive peak forward
current
tp ≤ 1 ms; δ ≤ 0.25
IFSM
non-repetitive peak
forward current
square wave; tp = 8 ms
[2]
-
3
A
Ptot
total power dissipation
Tamb ≤ 25 °C
[3]
-
340
mW
[1]
-
660
mW
[4]
-
1000
mW
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−55
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[2]
Tj = 25 °C prior to surge.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[4]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
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Rev. 1 — 19 April 2011
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30 V, 0.2 A low VF MEGA Schottky barrier rectifier
6. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
Rth(j-sp)
Thermal characteristics
Parameter
Conditions
thermal resistance from in free air
junction to ambient
thermal resistance from
junction to solder point
Min
Typ
Max
Unit
[1][2]
-
-
370
K/W
[1][3]
-
-
190
K/W
[1][4]
-
-
125
K/W
[5]
-
-
50
K/W
[1]
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
[5]
Soldering point of cathode tab.
006aac581
103
duty cycle =
Zth(j-a)
(K/W)
1
0.75
0.5
0.33
102
0.25
0.2
0.1
0.05
0
0.02
0.01
10
10–3
10–2
10–1
1
10
102
103
tp (s)
FR4 PCB, standard footprint
Fig 2.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG3002AELD
Product data sheet
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NXP Semiconductors
30 V, 0.2 A low VF MEGA Schottky barrier rectifier
006aac582
103
Zth(j-a)
(K/W)
duty cycle =
1
0.75
102
0.5
0.25
0.33
0.2
0.1
0.05
0.02
0.01
0
10
10–3
10–2
10–1
1
10
102
103
tp (s)
FR4 PCB, mounting pad for cathode 1 cm2
Fig 3.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aac583
103
Zth(j-a)
(K/W)
102
duty cycle =
1
0.75
0.5
0.33
0.1
10
10–3
0.05
0.02
0.01
0
0.25
0.2
10–2
10–1
1
10
102
103
tp (s)
Ceramic PCB, Al2O3, standard footprint
Fig 4.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG3002AELD
Product data sheet
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Rev. 1 — 19 April 2011
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30 V, 0.2 A low VF MEGA Schottky barrier rectifier
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
forward voltage
VF
reverse current
IR
diode capacitance
Cd
Typ
-
120
190
mV
-
180
250
mV
IF = 10 mA
-
250
300
mV
IF = 100 mA
-
355
400
mV
IF = 200 mA
-
430
480
mV
VR = 10 V
-
3.5
10
μA
VR = 30 V
-
12
50
μA
-
18
25
pF
-
6
-
ns
VR = 1 V; f = 1 MHz
[2]
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
[2]
When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA.
006aac584
006aac585
10–1
IR
(A)
10–2
IF
(A)
Unit
IF = 1 mA
[1]
10
Max
IF = 0.1 mA
reverse recovery time
trr
Min
[1]
(1)
1
(2)
10–3
(1)
(2)
10–1
(3)
10–4
(3) (4)
10–2
10–5
(5)
(4)
10–6
10–3
10–7
(5)
10–4
0.0
10–8
0.2
0.4
0.6
0.8
1.0
0
VF (V)
(1) Tj = 150 °C
(2) Tj = 125 °C
(2) Tj = 125 °C
(3) Tj = 85 °C
(3) Tj = 85 °C
(4) Tj = 25 °C
(4) Tj = 25 °C
(5) Tj = −40 °C
(5) Tj = −40 °C
Forward current as a function of forward
voltage; typical values
PMEG3002AELD
Product data sheet
20
30
VR (V)
(1) Tj = 150 °C
Fig 5.
10
Fig 6.
Reverse current as a function of reverse
voltage; typical values
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PMEG3002AELD
NXP Semiconductors
30 V, 0.2 A low VF MEGA Schottky barrier rectifier
006aac586
35
Cd
(pF)
30
25
20
15
10
5
0
0
5
10
15
20
VR (V)
f = 1 MHz; Tamb = 25 °C
Fig 7.
Diode capacitance as a function of reverse voltage; typical values
006aac587
0.15
PF(AV)
(W)
006aac588
0.15
PR(AV)
(W)
(4)
(3)
0.10
0.10
(2)
(1)
(1)
(2)
0.05
(3)
0.05
(4)
0.00
0.0
0.00
0.1
0.2
0.3
0
IF(AV) (A)
Tj = 150 °C
(2) δ = 0.2
(2) δ = 0.9
(3) δ = 0.5
(3) δ = 0.8
(4) δ = 1
(4) δ = 0.5
Average forward power dissipation as a
function of average forward current; typical
values
Product data sheet
30
Tj = 125 °C
(1) δ = 1
PMEG3002AELD
20
VR (V)
(1) δ = 0.1
Fig 8.
10
Fig 9.
Average reverse power dissipation as a
function of reverse voltage; typical values
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NXP Semiconductors
30 V, 0.2 A low VF MEGA Schottky barrier rectifier
006aac589
0.3
006aac590
0.3
(1)
(1)
IF(AV)
(A)
IF(AV)
(A)
(2)
(2)
0.2
0.2
(3)
(3)
(4)
0.1
(4)
0.1
0.0
0.0
0
25
50
75
100
125
150
175
Tamb (°C)
0
25
50
75
100
125
150
175
Tamb (°C)
FR4 PCB, mounting pad for cathode 1 cm2
FR4 PCB, standard footprint
Tj = 150 °C
Tj = 150 °C
(1) δ = 1; DC
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig 10. Average forward current as a function of
ambient temperature; typical values
006aac591
0.3
Fig 11. Average forward current as a function of
ambient temperature; typical values
006aac592
0.3
(1)
(1)
IF(AV)
(A)
IF(AV)
(A)
(2)
(2)
0.2
0.2
(3)
(3)
(4)
0.1
(4)
0.1
0.0
0.0
0
25
50
75
100
125
150
175
Tamb (°C)
0
25
50
75
100
125
150
175
Tsp (°C)
Tj = 150 °C
Ceramic PCB, Al2O3, standard footprint
Tj = 150 °C
(1) δ = 1; DC
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig 12. Average forward current as a function of
ambient temperature; typical values
PMEG3002AELD
Product data sheet
Fig 13. Average forward current as a function of
solder point temperature; typical values
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NXP Semiconductors
30 V, 0.2 A low VF MEGA Schottky barrier rectifier
8. Test information
tr
tp
t
D.U.T.
10 %
+ IF
IF
RS = 50 Ω
SAMPLING
OSCILLOSCOPE
V = VR + IF × RS
trr
t
Ri = 50 Ω
(1)
90 %
VR
mga881
input signal
output signal
(1) IR = 1 mA
Fig 14. Reverse recovery time test circuit and waveforms
P
t2
duty cycle δ =
t1
t2
t1
t
006aaa812
Fig 15. Duty cycle definition
The current ratings for the typical waveforms as shown in Figure 10, 11, 12 and 13 are
calculated according to the equations: I F ( AV ) = I M × δ with IM defined as peak current,
I RMS = I F ( AV ) at DC, and I RMS = I M × δ with IRMS defined as RMS current.
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
PMEG3002AELD
Product data sheet
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30 V, 0.2 A low VF MEGA Schottky barrier rectifier
9. Package outline
0.65
0.55
0.4
max
2
0.30
0.22
0.65
1.05
0.95
1
0.30
0.22
0.55
0.45
cathode marking on top side
Dimensions in mm
10-08-06
Fig 16. Package outline SOD882D
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
10000
PMEG3002AELD
[1]
SOD882D
2 mm pitch, 8 mm tape and reel
-315
For further information and the availability of packing methods, see Section 14.
11. Soldering
1.4
0.2
solder lands
0.8
(2×)
0.6
(2×)
0.7
(2×)
solder resist
solder paste
Dimensions in mm
0.3
0.4
1
1.3
sod882d_fr
Reflow soldering is the only recommended soldering method.
Fig 17. Reflow soldering SOD882D
PMEG3002AELD
Product data sheet
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30 V, 0.2 A low VF MEGA Schottky barrier rectifier
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PMEG3002AELD v.1
20110419
Product data sheet
-
-
PMEG3002AELD
Product data sheet
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Rev. 1 — 19 April 2011
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30 V, 0.2 A low VF MEGA Schottky barrier rectifier
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
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Product data sheet
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Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
4.1
5
6
7
8
8.1
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Binary marking code description. . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9
Quality information . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Packing information . . . . . . . . . . . . . . . . . . . . 10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 19 April 2011
Document identifier: PMEG3002AELD