Data Sheet

PMEG4002EL
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
Rev. 02 — 11 March 2009
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a SOD882 leadless ultra small
Surface-Mounted Device (SMD) plastic package.
1.2 Features
n
n
n
n
n
Forward current: IF ≤ 0.2 A
Reverse voltage: VR ≤ 40 V
Low forward voltage
Leadless ultra small SMD plastic package
Power dissipation comparable to SOT23
1.3 Applications
n
n
n
n
n
n
Ultra high-speed switching
Voltage clamping
Protection circuits
Low voltage rectification
Blocking diodes
Low power consumption applications
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
IF
VR
Conditions
Min
Typ
Max
Unit
forward current
-
-
0.2
A
reverse voltage
-
-
40
V
PMEG4002EL
NXP Semiconductors
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
2. Pinning information
Table 2.
Pinning
Pin
Description
1
cathode
2
anode
Simplified outline
Graphic symbol
[1]
1
1
2
2
sym001
Transparent
top view
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
PMEG4002EL -
Description
Version
leadless ultra small plastic package; 2 terminals;
body 1.0 × 0.6 × 0.5 mm
SOD882
4. Marking
Table 4.
Marking
Type number
Marking code
PMEG4002EL
F4
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VR
IF
IFRM
repetitive peak forward
current
IFSM
non-repetitive peak
forward current
Tj
junction temperature
Tamb
ambient temperature
Tstg
storage temperature
[1]
Conditions
Min
Max
Unit
reverse voltage
-
40
V
forward current
-
0.2
A
tp ≤ 1 ms; δ ≤ 0.25
-
1
A
square wave;
tp = 8 ms
-
3
A
[1]
-
150
°C
[1]
−65
+150
°C
−65
+150
°C
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses. Nomograms for determining the reverse
power losses PR and IF(AV) rating are available on request.
PMEG4002EL_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 11 March 2009
2 of 8
PMEG4002EL
NXP Semiconductors
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
6. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
Conditions
in free air
[1][2]
Min
Typ
Max
Unit
-
-
500
K/W
[1]
Refer to SOD882 standard mounting conditions (footprint), FR4 Printed-Circuit Board (PCB) with
60 µm copper strip line.
[2]
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses. Nomograms for determining the reverse
power losses PR and IF(AV) rating are available on request.
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
VF
forward voltage
Min
Typ
Max
Unit
IF = 0.1 mA
190
220
mV
IF = 1 mA
250
290
mV
IF = 10 mA
320
360
mV
IF = 100 mA
440
500
mV
520
600
mV
VR = 25 V
0.3
0.5
µA
VR = 40 V
0.7
10
µA
VR = 1 V; f = 1 MHz
14
20
pF
IF = 200 mA
IR
Cd
[1]
[1]
reverse current
diode capacitance
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
PMEG4002EL_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 11 March 2009
3 of 8
PMEG4002EL
NXP Semiconductors
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
001aaa337
103
001aaa338
104
IR
(µA)
103
IF
(mA)
(1)
(2)
102
102
(3)
(1)
(2)
(3)
(4)
10
10
1
(4)
1
10−1
10−2
10−1
0
200
400
0
600
10
VF (mV)
30
40
VR (V)
(1) Tj = 150 °C
(1) Tj = 150 °C
(2) Tj = 125 °C
(2) Tj = 125 °C
(3) Tj = 85 °C
(3) Tj = 85 °C
(4) Tj = 25 °C
(4) Tj = 25 °C
Fig 1.
20
Forward current as a function of forward
voltage; typical values
Fig 2.
Reverse current as a function of reverse
voltage; typical values
001aaa339
30
Cd
(pF)
20
10
0
0
10
20
30
40
VR (V)
f = 1 MHz; Tamb = 25 °C
Fig 3.
Diode capacitance as a function of reverse voltage; typical values
PMEG4002EL_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 11 March 2009
4 of 8
PMEG4002EL
NXP Semiconductors
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
8. Package outline
0.50
0.46
0.62
0.55
2
0.30
0.22
0.65
0.30
0.22
1
0.55
0.47
cathode marking on top side
Dimensions in mm
Fig 4.
1.02
0.95
03-04-17
Package outline SOD882
9. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
10000
PMEG4002EL SOD882
[1]
2 mm pitch, 8 mm tape and reel
-315
For further information and the availability of packing methods, see Section 13.
10. Soldering
1.3
0.7
R0.05 (8×)
solder lands
0.6 0.7
(2×) (2×)
0.9
solder resist
solder paste
occupied area
0.3
(2×)
Dimensions in mm
0.4
(2×)
sod882_fr
Reflow soldering is the only recommended soldering method.
Fig 5.
Reflow soldering footprint SOD882
PMEG4002EL_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 11 March 2009
5 of 8
PMEG4002EL
NXP Semiconductors
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
11. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PMEG4002EL_2
20090311
Product data sheet
-
PMEG4002EL_1
Modifications:
PMEG4002EL_1
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Figure 4: superseded by minimized package outline drawing
Section 9 “Packing information”: added
Section 10 “Soldering”: added
Section 12 “Legal information”: updated
20040217
Product data sheet
PMEG4002EL_2
Product data sheet
-
-
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 11 March 2009
6 of 8
PMEG4002EL
NXP Semiconductors
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PMEG4002EL_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 11 March 2009
7 of 8
PMEG4002EL
NXP Semiconductors
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
General description. . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quick reference data. . . . . . . . . . . . . . . . . . . . .
Pinning information . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal characteristics. . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
Packing information. . . . . . . . . . . . . . . . . . . . . .
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
2
2
2
2
3
3
5
5
5
6
7
7
7
7
7
7
8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 11 March 2009
Document identifier: PMEG4002EL_2
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