Material Content Data Sheet Umbrella Spec Date Revision Construction element chip Base plate and substrate including metallisation wire encapsulation housing lead, finish and plating deviation 62mm C- Serie 2012-03-19 3.0 RoHS compliant Material group Materials Average CAS-Nr. if applicable mass [%]* Sum [%] inorganic material silicon 7440-21-3 0,1 0,1 non noble metal inorganic material non noble metal noble metal non noble metal non noble metal polymers polymers inorganic material plastics plastics inorganic material non noble metal ferrous metal non noble metal non noble metal noble metal non noble metal non noble metal <25% 7440-50-8 1344-28-1 7440-31-5 7440-22-4 7440-02-0 7429-90-5 56,6 1,4 2,7 0,1 0,1 0,6 11,4 8,3 0,9 0,6 0,4 4,4 9,4 3,0 0,1 0,0 0,0 0,0 0,0 Sum in total 60,8 Weight range of product family ** Fluctuation margin copper aluminium oxid tin silver nickel aluminium silicone gel PBT antimonytrioxide brominated resin chlorinated resin silicondioxide / glasfiber copper steel tin zinc silver nickel aluminium 1309-64-4 7440-50-8 7440-31-5 7440-66-6 7440-22-4 7440-02-0 7429-90-5 Yes Traces 0,6 11,4 14,6 12,5 X X X X 100,00 337 <25% *) related to component weight **) Weight of particular product, see technical product information Important Remarks: 1) This document provides full declaration of all materials present in Infineon products above a threshold of 0,1 % b.w. (1000 ppm). 2) Trace concentrations (i.e. < 0,1 % b.w) present in products are marked with an "X" as far as they represent substances-of-concern. A list of substances-of-concern can be found at http://www.infineon.com/soc. 3) All statements are based on our present knowledge and are subject to change at any time due to technical requirements and development. Company Address Internet Infineon Technologies AG 81726 München www.infineon.com Comment