UBA2024 Half-bridge power IC for CFL lamps Rev. 6.2 — 1 November 2010 Product data sheet 1. General description The UBA2024 is a family of high-voltage monolithic Integrated Compact Fluorescent Lamp (CFL) drivers for a large range of lamp powers. Specific versions are optimized for 230 V and 110 V mains supplies. The product family integrates full CFL controller functionality with high voltage half-bridge transistors. All products in the UBA2024 family are pin-to-pin compatible enabling a single application design covering a wide range of power ratings. The IC features a soft start function, an adjustable internal oscillator and an internal drive function with a high-voltage level shifter for driving the half-bridge. To guarantee an accurate 50 % duty cycle, the oscillator signal is passed through a divider before being fed to the output drivers. 2. Features and benefits The common feature set includes: high power efficiency a high integration level with low component counts enabling small form factor electronic ballast integrated bootstrap diode soft start function minimum glow time control integrated low-voltage supply adjustable operating frequency as a result of the embedded oscillator an accurate 50 % duty cycle provided by an embedded oscillator signal integrated half-bridge power transistors an internal drive function with a high-voltage level shifter up to 550 V (300 V for the UBA2024BP and UBA2024BT) 3. Applications Driver for any kind of half-bridge configured load up to 23 W, provided that the maximum junction temperature is not exceeded Designed for electronically self-ballasted CFL lamps UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 4. Ordering information Table 1. Ordering information Type number Package Name Description Version UBA2024P[1] DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 UBA2024T[1] SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 UBA2024AP[2] DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 UBA2024AT[3] SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 UBA2024BP[4] DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 UBA2024BT[4] SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 [1] For this type number, RDS(on) = 9 Ω and ISAT = 900 mA. [2] For this type number, RDS(on) = 6 Ω and ISAT = 1350 mA. [3] For this type number, RDS(on) = 6.4 Ω and ISAT = 1200 mA. [4] For this type number, RDS(on) = 2 Ω and ISAT = 2500 mA. 5. Block diagram (6) 4 (3) 11 VDD CONTROL VDD SW FS 6* (7)** HS 8 (1) SWEEP AND GLOW TIME CONTROL VDD(stop) HIGH VOLTAGE LEVEL SHIFTER HIGH SIDE DRIVER (5) 14 RC HV 7 (8) OSCILLATOR DIVIDE-BY-2 OUT LS DEAD TIME LOW SIDE DRIVER SGND 1,2,3,5,9,10,13 (2) (4) 12 PGND mdb029 Fig 1. Block diagram UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6.2 — 1 November 2010 © NXP B.V. 2010. All rights reserved. 2 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 6. Pinning information 6.1 Pinning UBA2024P UBA2024AP UBA2024BP SW 1 8 RC SGND 2 7 VDD FS 3 6 HV PGND 4 5 OUT SGND 1 14 OUT SGND 2 13 SGND SGND 3 HV 4 SGND 5 VDD 6 RC 7 12 PGND UBA2024T UBA2024AT 11 FS UBA2024BT 014aaa657 Fig 2. 10 SGND 9 SGND 8 SW 014aaa804 Pinning diagram SOT97-1 Fig 3. Pinning diagram SOT108-1 6.2 Pin description Table 2. UBA2024 Product data sheet Pin description Symbol Pin SOT97-1 Pin SOT108-1 Description SW 1 8 sweep timing input SGND 2 1, 2, 3, 5, 9, 10, 13 signal ground FS 3 11 high-side floating supply output PGND 4 12 power ground OUT 5 14 half-bridge output HV 6 4 high-voltage supply VDD 7 6 internal low-voltage supply output RC 8 7 internal oscillator input All information provided in this document is subject to legal disclaimers. Rev. 6.2 — 1 November 2010 © NXP B.V. 2010. All rights reserved. 3 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 7. Functional description 7.1 Supply voltage The UBA2024 does not require an external low-voltage supply as the mains supply voltage applied to pin HV powers it. The IC derives its own low supply voltage from this for its internal circuitry. 7.2 Start-up state With an increase of the supply voltage on pin HV, the IC enters the start-up state. In the start-up state the high-side power transistor is not conducting and the low-side power transistor is switched on. The internal circuit is reset and the capacitors on the bootstrap pin FS and low-voltage supply pin VDD are charged. Pins RC and SW are switched to ground. The start-up state is defined until VDD = VDD(startup). 7.3 Sweep mode The IC enters the sweep mode when the voltage on pin VDD > VDD(startup). The capacitor on pin SW is charged by ISW and the half-bridge circuit starts oscillating. The circuit enters the start-up state again when the voltage on pin VDD < VDD(stop). The sweep time (tsweep) is determined by the charge current (Ich(sw)) and the external capacitor (CSW). Typical the total sweep time set by CSW is: t sweep = C SW ( nF ) × 10.3 ms (1) During the sweep time the current flowing through the lamp electrodes performs some preheating of the filaments. See Figure 5. 7.4 Reset A DC reset circuit is incorporated in the high-side driver. The high-side transistor is switched off when the voltage on pin FS is below the high-side lockout voltage Vfloat(UVLO). 7.5 Oscillation The oscillation is based upon the 555-timer function. A self oscillating circuit is made with the external resistor ROSC and the capacitor COSC (see Figure 4). To realize an accurate 50 % duty cycle, an internal divider is used. This reduces the bridge frequency to half the oscillator frequency. The output voltage of the bridge will change at the falling edge of the signal on pin RC. The design equation for the half-bridge frequency is: 1 f osc = ----------------------------------------k × R OSC × C OSC (2) An overview of the oscillator signal, internal LS and HS drive signals and the output is given in Figure 4. UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6.2 — 1 November 2010 © NXP B.V. 2010. All rights reserved. 4 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps VRC 0 time HS drive 0 time LS drive 0 time VOUT half bridge 0 time 014aaa658 Fig 4. Oscillator, drivers and output signals When entering the sweep mode (VSW = 0 V), the bridge oscillator starts at 2.5 times the nominal bridge frequency and sweeps down to the nominal frequency (bridge), set by ROSC and COSC. During the sweep mode the amplitude of the RC oscillator on pin RC, will swing between Vtrip(osc)low and VSW + 0.4Vtrip(osc)high. The amplitude of the RC oscillator will continue to increase until VSW + 0.4Vtrip(osc)high = Vtrip(osc)high, this determines the end of the sweep time. The voltage on pin SW however will continue to rise until it reaches supply voltage level. During this continuous decrease in frequency, the circuit approaches the resonance frequency of the load, and this causes a high voltage across the load, which ignites the lamp. The sweep to resonance time should be much larger than the settling time of the supply voltage on pin HV, to guarantee that the full high-voltage is present at the moment of ignition. See Figure 5. UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6.2 — 1 November 2010 © NXP B.V. 2010. All rights reserved. 5 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps VHV 0 time VDD VDD(startup) 0 time VSW VDD 0.6Vtrip(osc)high 0 time fosc 2.5nom nom 0 time Vlamp Vign VgloA Vnom 0 time tsweep Fig 5. 014aaa659 Start-up frequency behavior 7.6 Non-overlap time The non-overlap time is defined as the time when both MOSFETs are not conducting. The non-overlap time is fixed internally. UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6.2 — 1 November 2010 © NXP B.V. 2010. All rights reserved. 6 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 8. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VHV voltage on pin HV normal operation UBA2024P - 373 V UBA2024AP - 373 V UBA2024T - 373 V UBA2024AT - 373 V UBA2024BP - 187 V UBA2024BT - 187 V - 550 V mains transients during 0.5 s UBA2024P UBA2024AP - 550 V UBA2024T - 550 V UBA2024AT - 550 V UBA2024BP - 300 V UBA2024BT - 300 V VHV VHV + 14 V low voltage; DC supply 0 14 V supply current low voltage; peak value is internally limited; Tamb = 25 °C 0 5 mA VPGND voltage on pin PGND referenced to SGND −1 +1 V VRC voltage on pin RC IRC < 1 mA 0 VDD V VSW voltage on pin SW ISW < 1 mA 0 VDD V SR slew rate pin OUT; repetitive Tj junction temperature Tamb Tstg VFS voltage on pin FS VDD supply voltage IDD [1] −4 +4 V/ns −40 +150 °C ambient temperature −40 +150 °C storage temperature −55 +150 °C Typ Unit 95 K/W 95 K/W SO14 package 8 K/W DIP8 package 16 K/W [1] The maximum junction temperature must not be exceeded. 9. Thermal characteristics Table 4. Symbol Rth(j-a) Thermal characteristics Parameter Conditions thermal resistance from junction to ambient in free air [1] SO14 package DIP8 package Rth(j-c) [1] thermal resistance from junction to case in free air [1] In accordance with IEC 60747-1 UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6.2 — 1 November 2010 © NXP B.V. 2010. All rights reserved. 7 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 10. Characteristics Table 5. Characteristics Tj = 25 °C; all voltages are measured with respect to SGND; positive currents flow into the IC. Symbol Parameter Conditions Min Typ Max Unit UBA2024P 0 - 550 V UBA2024AP 0 - 550 V UBA2024T 0 - 550 V UBA2024AT 0 - 550 V UBA2024BP 0 - 250 V UBA2024BT 0 - 250 V UBA2024P 0 - 564 V UBA2024AP 0 - 564 V UBA2024T 0 - 564 V UBA2024AT 0 - 564 V UBA2024BP 0 - 264 V UBA2024BT 0 - 264 V VHV = 100 V; Rosc = ∞; VSW = VDD; VRC = 0 V 11.4 12.5 13.3 V VHV = 100 V; Rosc = ∞; VSW = VDD; VRC = 0 V - - 0.39 mA High-voltage supply VHV VFS voltage on pin HV voltage on pin FS mains transients during 0.5 s; IHV < 30 μA mains transients during 0.5 s; IHV < 30 μA Low-voltage supply VDD supply voltage Start-up state IHV current on pin HV VDD(startup) start-up supply voltage 10 11 12 V VDD(stop) stop supply voltage 8 8.5 9 V VDD(hys) hysteresis of supply voltage 2 2.5 3 V UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6.2 — 1 November 2010 © NXP B.V. 2010. All rights reserved. 8 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps Table 5. Characteristics …continued Tj = 25 °C; all voltages are measured with respect to SGND; positive currents flow into the IC. Symbol Parameter Conditions Min Typ Max Unit UBA2024P - 9.7 11 Ω UBA2024T - 9.7 11 Ω UBA2024AP - 6.5 7.4 Ω UBA2024AT - 7.0 8.0 Ω UBA2024BP - 2.0 2.35 Ω UBA2024BT - 2.0 2.35 Ω UBA2024P - 8.5 9.4 Ω UBA2024T - 8.5 9.4 Ω UBA2024AP - 5.7 6.3 Ω UBA2024AT - 6.2 6.9 Ω UBA2024BP - 2.3 2.55 Ω UBA2024BT - 2.3 2.55 Ω HS; IF = 200 mA - - 2.0 V LS; IF = 200 mA - - 2.0 V bootstrap diode; IF = 1 mA 0.7 1.0 1.3 V UBA2024P 900 - - mA UBA2024AP 1350 - - mA Output stage Ron on-state resistance HS transistor; VHV = 310 V; ID = 100 mA HS transistor; VHV = 160 V; ID = 100 mA LS transistor; ID = 100 mA VF IDsat forward voltage drain saturation current HS; VDS = 30 V; Tj ≤ 125 °C; VHV = 310 V UBA2024T 900 - - mA UBA2024AT 1200 - - mA UBA2024BP 2500 - - mA UBA2024BT 2500 - - mA UBA2024P 900 - - mA UBA2024AP 1350 - - mA HS; VDS = 30 V; Tj ≤ 125 °C; VHV = 160 V LS; VDS = 30 V; Tj ≤ 125 °C UBA2024T 900 - - mA UBA2024AT 1200 - - mA UBA2024BP 2500 - - mA UBA2024BT 2500 - - mA tno non-overlap time 1 1.35 1.7 μs Vfloat(UVLO) undervoltage lockout floating voltage 3.6 4.2 4.8 V UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6.2 — 1 November 2010 © NXP B.V. 2010. All rights reserved. 9 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps Table 5. Characteristics …continued Tj = 25 °C; all voltages are measured with respect to SGND; positive currents flow into the IC. Symbol Parameter Conditions Min Typ Max Unit IFS current on pin FS VHV = 310 V; VFS = 12.2 V UBA2024P, UBA2024T 10 14 18 μA UBA2024AP, UBA2024AT 10 14 18 μA 10 14 18 μA VSW = 0 V - 150 - kHz VSW = VDD - - 60 kHz operating; nominal; ROSC = 100 kΩ; COSC = 220 pF; VSW = VDD 40.05 41.32 42.68 kHz ROSC = 100 kΩ; COSC = 220 pF; −20 °C ≤ Tj ≤ +150 °C - 2 - % 0.382 0.395 0.408 4.58 4.94 5.29 VHV = 160 V; VFS = 12.2 V UBA2024BP, UBA2024BT Internal oscillator fosc oscillator frequency Δfosc/fosc relative oscillator frequency variation kH high-level trip point factor Vtrip(osc)high high oscillator trip voltage Vtrip(osc)high = kH × VDD V kL low-level trip point factor 0.030 0.033 0.038 Vtrip(osc)low low oscillator trip voltage Vtrip(osc)low = kL × VDD 0.367 0.413 0.483 V Kosc oscillator constant ROSC = 100 kΩ; COSC = 220 pF 1.065 1.1 1.35 V Sweep function Ich(sweep) sweep charge current VSW = 0 V 215 280 345 nA tsweep sweep time CSW = 33 nF; VDD = 12.2 V 0.28 0.35 0.45 s 11. Electrostatic discharge Table 6. ElectroStatic Discharge (ESD) overview Model Class JEDEC classification criteria ESDH (human body model) 1C pass at ESD pulse 1000 V fail at ESD pulse 2000 V ESDC (charged device model) C2 pass at ESD pulse 200 V fail at ESD pulse 500 V ESDM (machine model) UBA2024 Product data sheet B pass at 200 V ≥ ESD pulse < 400 V All information provided in this document is subject to legal disclaimers. Rev. 6.2 — 1 November 2010 © NXP B.V. 2010. All rights reserved. 10 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 12. Application information 1.8 mH max. 550 V LFILT RFUS AC mains supply (230 V) D1 D2 11 W/150 mA CHB2 47 nF D3 FS VDD OUT LLA CFL CHB1 47 nF D4 SW CFS 10 nF CBUF 4.7 μF 33 Ω HV 3.1 mH ROSC 110 kΩ UBA2024 CVDD 10 nF RC CDV 100 pF CLA 1.5 nF CSW 33 nF COSC 180 pF SGND PGND 001aan022 Fig 6. Schematic of 230 V standard compact fluorescent lamp application using UBA2024 LFILT HV maximum 300 V 1.5 mH D1 RFUS AC mains supply (120 V) 4.7 Ω D4 D3 FS CHB1 150 nF D2 VDD CFS 10 nF CBUS 33 μF 24 W/300 mA CHB2 150 nF CRS CFL LR ROSC 26.1 kΩ RC OUT UBA2024B SW CSW 470 nF 0.66 mH CDVDT 820 pF PGND RSW 4.7 MΩ COSC 1.2 nF CVDD 10 nF SGND 10 nF 001aam620 Fig 7. Schematic of 120 V standard compact fluorescent lamp application using UBA2024B UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6.2 — 1 November 2010 © NXP B.V. 2010. All rights reserved. 11 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 13. Package outline DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.02 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. Fig 8. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT97-1 050G01 MO-001 SC-504-8 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 Package outline SOT97-1 (DIP8) UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6.2 — 1 November 2010 © NXP B.V. 2010. All rights reserved. 12 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.010 0.057 inches 0.069 0.004 0.049 0.05 0.244 0.039 0.041 0.228 0.016 0.028 0.024 0.01 0.01 0.028 0.004 0.012 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. Fig 9. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Package outline SOT108-1 (SO14) UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6.2 — 1 November 2010 © NXP B.V. 2010. All rights reserved. 13 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 14. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes UBA2024 v.6.2 20101101 Product data sheet - UBA2024 v.5 Modifications: • • • Figure 5 on page 6 has been changed. • • Table 3 “Limiting values” on page 7: table notes 2 and 3 have been removed. The glow time section has been removed. ESD values have been removed from Table 3 “Limiting values” on page 7, added in to Table 6 “ElectroStatic Discharge (ESD) overview” on page 10 and one error corrected. Table 5 “Characteristics” on page 8: – VDD supply voltage minimum value has been changed. – VF forward voltage HS maximum value has been changed. – KL low-level trip point factor maximum value has been changed. – Vtrip(osc)low low oscillator trip voltage maximum value has been changed. • Figure 6 on page 11 have been changed. UBA2024 v.5 20100916 Product data sheet - UBA2024 v.4 UBA2024 v.4 20090917 Product data sheet - UBA2024 v.3 UBA2024 v.3 081016 Product data sheet - UBA2024 v.2 UBA2024 v.2 040203 Product data sheet - UBA2024 v.1 UBA2024 v.1 030813 Product data sheet - - UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6.2 — 1 November 2010 © NXP B.V. 2010. All rights reserved. 14 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. 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Export might require a prior authorization from national authorities. UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6.2 — 1 November 2010 © NXP B.V. 2010. All rights reserved. 15 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6.2 — 1 November 2010 © NXP B.V. 2010. All rights reserved. 16 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 17. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . 4 Start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Sweep mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Oscillation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Non-overlap time . . . . . . . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal characteristics . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrostatic discharge . . . . . . . . . . . . . . . . . . 10 Application information. . . . . . . . . . . . . . . . . . 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 1 November 2010 Document identifier: UBA2024