Data Sheet

DISCRETE SEMICONDUCTORS
DATA SHEET
dbook, halfpage
M3D088
PMBD7100
High-speed double diode
Product data sheet
2003 Nov 07
NXP Semiconductors
Product data sheet
High-speed double diode
PMBD7100
FEATURES
PINNING
• Small plastic SMD package
PIN
DESCRIPTION
• High switching speed: max. 4 ns
1
anode (a1)
• Continuous reverse voltage: max. 100 V
2
anode (a2)
• Repetitive peak reverse voltage: max. 100 V
3
common connection
• Repetitive peak forward current: max. 450 mA.
APPLICATIONS
• High-speed switching in thick and thin-film circuits.
DESCRIPTION
handbook, halfpage
3
3
The PMBD7100 consists of two high-speed switching
diodes with common cathodes, fabricated in planar
technology, and encapsulated in the small SOT23 SMD
plastic package.
1
1
MARKING
Top view
2
MAM383
MARKING CODE(1)
TYPE NUMBER
PMBD7100
2
*3A
Note
1. * = p: made in Hong Kong.
* = t: made in Malaysia.
* = W: made in China.
Fig.1 Simplified outline (SOT23) and symbol.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
PMBD7100
2003 Nov 07
−
DESCRIPTION
plastic surface mounted package; 3 leads
2
VERSION
SOT23
NXP Semiconductors
Product data sheet
High-speed double diode
PMBD7100
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Per diode
VRRM
repetitive peak reverse voltage
VR
continuous reverse voltage
IF
continuous forward current
IFRM
repetitive peak forward current
IFSM
non-repetitive peak forward current
−
100
V
−
100
V
single diode loaded; see Fig.2; note 1
−
215
mA
double diode loaded; see Fig.2; note 1
−
125
mA
−
450
mA
tp = 1 µs
−
4
A
tp = 1 ms
−
1
A
tp = 1 s
−
0.5
A
−
250
mW
square wave; Tj = 25 °C prior to surge;
see Fig.4
Tamb = 25 °C; note 1
Ptot
total power dissipation
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−
150
°C
Note
1. Device mounted on an FR4 printed-circuit board.
2003 Nov 07
3
NXP Semiconductors
Product data sheet
High-speed double diode
PMBD7100
ELECTRICAL CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MAX.
UNIT
Per diode
VF
IR
forward voltage
reverse current
see Fig.3
IF = 1 mA
715
mV
IF = 10 mA
855
mV
IF = 50 mA
1
V
IF = 150 mA
1.25
V
VR = 25 V
30
nA
VR = 100 V
2.5
µA
VR = 25 V; Tj = 150 °C
60
µA
VR = 100 V; Tj = 150 °C
100
µA
see Fig.5
Cd
diode capacitance
VR = 0 V; f = 1 MHz; see Fig.6
1.5
pF
trr
reverse recovery time
when switched from IF = 10 mA to
IR = 10 mA; RL = 100 Ω; measured at
IR = 1 mA; see Fig.7
4
ns
Vfr
forward recovery voltage
when switched from IF = 10 mA to tr = 20 nA;
see Fig.8
1.75
V
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth j-tp
thermal resistance from junction to tie-point
Rth j-a
thermal resistance from junction to ambient
CONDITIONS
note 1
Note
1. Device mounted on an FR4 printed-circuit board.
2003 Nov 07
4
VALUE
UNIT
360
K/W
500
K/W
NXP Semiconductors
Product data sheet
High-speed double diode
PMBD7100
GRAPHICAL DATA
MBD033
300
MDB820
300
F
(mA)
250
handbook,
halfpage
I
IF
(mA)
200
200
single diode loaded
150
double diode loaded
100
100
(1)
(2)
(3)
50
0
0
100
T amb ( oC)
0
200
0
1.0
1.5 V (V) 2.0
F
(1) Tj = 150 °C; typical values.
(2) Tj = 25 °C; typical values.
(3) Tj = 25 °C; maximum values.
Device mounted on an FR4 printed-circuit board.
Fig.2
0.5
Maximum permissible continuous forward
current as a function of ambient
temperature.
Fig.3
Forward current as a function of
forward voltage.
MBG704
102
handbook, full pagewidth
IFSM
(A)
10
1
10−1
1
10
102
103
tp (µs)
Based on square wave currents.
Tj = 25 °C prior to surge.
Fig.4 Maximum permissible non-repetitive peak forward current as a function of pulse duration.
2003 Nov 07
5
104
NXP Semiconductors
Product data sheet
High-speed double diode
PMBD7100
MDB821
102
handbook, halfpage
MDB822
0.8
handbook, halfpage
IR
(µA)
Cd
(pF)
(1)
10
0.6
(2)
1
(3)
0.4
10-1
0.2
10-2
10−3
0
50
100
0
150 T (°C) 200
j
0
5
(1) VR = 100 °C; maximum values.
(2) VR = 100 °C; typical values.
(3) VR = 25 °C; typical values.
f = 1 MHz; Tj = 25 °C.
Fig.5
Fig.6
Reverse current as a function of junction
temperature.
2003 Nov 07
6
10
VR (V)
15
Diode capacitance as a function of reverse
voltage; typical values.
NXP Semiconductors
Product data sheet
High-speed double diode
PMBD7100
handbook, full pagewidth
tr
tp
t
D.U.T.
10%
IF
RS = 50 Ω
IF
SAMPLING
OSCILLOSCOPE
t rr
t
R i = 50 Ω
V = VR I F x R S
(1)
90%
VR
MGA881
input signal
output signal
(1) IR = 1 mA.
Fig.7 Reverse recovery voltage test circuit and waveforms.
I
1 kΩ
450 Ω
V
I
90%
R = 50 Ω
S
D.U.T.
OSCILLOSCOPE
V fr
R i = 50 Ω
10%
MGA882
t
tr
input
signal
Fig.8 Forward recovery voltage test circuit and waveforms.
2003 Nov 07
7
t
tp
output
signal
NXP Semiconductors
Product data sheet
High-speed double diode
PMBD7100
PACKAGE OUTLINE
Plastic surface mounted package; 3 leads
SOT23
D
E
B
A
X
HE
v M A
3
Q
A
A1
1
2
e1
bp
c
w M B
Lp
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max.
bp
c
D
E
e
e1
HE
Lp
Q
v
w
mm
1.1
0.9
0.1
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
1.9
0.95
2.5
2.1
0.45
0.15
0.55
0.45
0.2
0.1
OUTLINE
VERSION
SOT23
2003 Nov 07
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
99-09-13
TO-236AB
8
NXP Semiconductors
Product data sheet
High-speed double diode
PMBD7100
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Qualification
This document contains data from the preliminary specification.
Product data sheet
Production
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
General ⎯ Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
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of such information and shall have no liability for the
consequences of use of such information.
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Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
2003 Nov 07
9
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were
made to the content, except for the legal definitions and disclaimers.
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Printed in The Netherlands
R76/01/pp10
Date of release: 2003 Nov 07
Document order number: 9397 750 12001
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