DN329 - Addressable I²C Bus Buffer Provides Capacitance Buffering, Live Insertion and Nested Addressing in 2-Wire Bus Systems

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Addressable I2C Bus Buffer Provides Capacitance Buffering,
Live Insertion and Nested Addressing in 2-Wire Bus Systems
Design Note 329
John Ziegler
Introduction
In an effort to improve the reliability of large data processing, data storage and communications systems, their
subsystems include a growing number of active circuits
to monitor parameters such as temperature, fan speed
and system voltages. Individual subsystem monitors
often communicate with the host system through 2-wire
serial busses, such as SMBus or I2CTM, to a dedicated
microcontroller.
As monitoring functions increase in complexity and number, several practical problems arise. First, data bus rise
time specifications become difficult to meet. Second,
many uninterruptible systems cannot tolerate cycling
power whenever a new I/O card is installed. Finally, a
device’s address is often dictated by the function that it
performs. If an existing system already contains a temperature sensor, for example, then inserting a new I/O
card with a temperature sensor risks having two devices
with the same address. The new LTC®4302-1/LTC4302-2,
addressable 2-wire bus buffers provide solutions to all of
these problems.
Live Insertion and Removal and
Capacitance Buffering Application
The LTC4302 solves bus connect/disconnect problems
by creating an active bridge between two physically separate 2-wire busses. The LTC4302’s two “input” pins,
SDAIN and SCLIN, connect to one 2-wire bus, i.e., a
backplane; and its two “output” pins, SDAOUT and
SCLOUT, connect to a second 2-wire bus, i.e., an I/O card.
The application shown in Figure 1 highlights the live
insertion and removal and the capacitance buffering features of the LTC4302 -1. Because the LTC4302’s SDA and
SCL pins default to a high impedance and low capacitance
(<10pF) state even when no VCC voltage is applied, an
LTC4302 can be inserted onto a live 2-wire bus without
corrupting it.
If a staggered connector is available, make CONN the
shortest pin and connect a large value resistor from CONN
to ground on the I/O card to force the CONN voltage low
before it connects to the backplane. This ensures that the
LTC4302 remains in a high impedance state while SDAIN
and SCLIN are making connection during live insertion.
, LTC and LT are registered trademarks of Linear Technology Corporation.
I2C is a trademark of Philips Electronics N.V.
BACKPLANE
CONNECTOR
BACKPLANE
VCC
5V
PCB EDGE
BACKPLANE
CONNECTOR
I/O PERIPHERAL CARD
+
R1
10k
R3
137Ω
R2
10k
SDA
SCL
CONN
R5
200k
R4
8660Ω
C1
0.01µF
VCC
LTC4302-1
SDAIN SDAOUT
SCLOUT
SCLIN
CONN
ADDRESS GPIO2
GND
GPIO1
X1
R6
10k
R7
10k
R8
1k
R9
1k
CARD SDA
CARD SCL
LED
LED
DN329 F01
Figure 1. LTC4302-1 in a Live Insertion and Capacitance Buffering Application
01/04/329
With the I/O card firmly connected, drive CONN high to
allow masters to communicate with the LTC4302. During
live removal, having CONN disconnect first ensures that
the LTC4302 enters a high impedance state in a controlled
manner before SDAIN and SCLIN disconnect.
Inserting an LTC4302 on the edge of the card isolates the
card capacitance from the backplane. As more I/O cards
are added to the system, placing an LTC4302 on the edge
of each card breaks what would be one large, unmanageable bus into several manageable segments. Moreover,
the LTC4302 can be programmed to provide rise time
accelerator pull-up currents on all four SDA and SCL pins
during rising edges, to further aid in meeting the rise time
specification. Figure 2 shows the rise time improvement
achieved for VCC = 3.3V and bus equivalent capacitances
of 50pF and 150pF.
Nested Addressing and 5V to 3.3V Level
Translator Application
Figure 3 illustrates how the LTC4302 can be used to
expand the number of devices in a system by using nested
addressing. In this example, each I/O card contains a
sensor device having address 1111 111. The LTC4302
isolates the devices on its card from the rest of the system
BACKPLANE
CONNECTOR
VCC
5V
50pF
150pF
DN329 F02
200ns/DIV
Figure 2. Rise Time Accelerators Reduce Rise Time
for CBUS = 50pF, CBUS = 150pF
until it is commanded to connect by a master. If masters
use the LTC4302s to connect only one I/O card at a time,
then each I/O card can have a device with address 1111
111 without any conflicts.
Figure 3 also shows the LTC4302-2 providing voltage
level translation from the 5V backplane SDA and SCL lines
to the 3.3V I/O card lines. The LTC4302-2 functions for
voltages ranging from 2.7V to 5.5V on both VCC and VCC2.
If either VCC or VCC2 supply voltage falls below its UVLO
threshold, the LTC4302-2 disconnects the backplane
from the card so that the side that is still powered can
continue to function.
PCB EDGE
BACKPLANE
CONNECTOR
I/O PERIPHERAL CARD 1
+
R1
10k
R2
10k
R3
8660Ω
C1
0.01µF
+
VCC
VCC2
C3
0.01µF
LTC4302-2
SDAIN SDAOUT
SCLOUT
SCLIN
CONN
ADDRESS
GND
GPIO1
X1
SDA
SCL
R4
137Ω
CARD
VCC = 3.3V
R5
10k
R6
10k
CARD SDA
CARD SCL
SENSOR
ADDRESS = 1111 111
ADDRESS = 1100 000
I/O PERIPHERAL CARD 2
R7
2800Ω
R8
137Ω
+
C2
0.01µF
+
VCC
VCC2
LTC4302-2
SDAIN SDAOUT
SCLOUT
SCLIN
CONN
ADDRESS
GND
GPIO1
X2
ADDRESS = 1100 001
C4
0.01µF
R9
10k
R10
10k
CARD
VCC = 3.3V
CARD SDA
CARD SCL
SENSOR
ADDRESS = 1111 111
DN329 F03
Figure 3. LTC4302-2 in a Nested Addressing and 5V to 3.3V Level Translator Application
Data Sheet Download
http://www.linear.com/go/dnLTC4302
Linear Technology Corporation
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call (408) 432-1900, Ext. 2452
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 LINEAR TECHNOLOGY CORPORATION 2004