Data Sheet

PZUxDB2 series
Dual Zener diodes
Rev. 01 — 31 March 2008
Product data sheet
1. Product profile
1.1 General description
Dual isolated general-purpose Zener diodes in SOT353 (SC-88A) very small
Surface-Mounted Device (SMD) standard plastic and dark-green plastic packages.
1.2 Features
n Non-repetitive peak reverse power
dissipation: PZSM = 40 W
n Total power dissipation: Ptot ≤ 250 mW
n Tolerance series:
B2: approximately ±2 %
n Wide working voltage range:
nominal 2.7 V to 24 V
n Dual isolated diodes configuration
n Small standard plastic package suitable
for surface-mounted design
n Small dark-green, halogen-free plastic
package suitable for surface-mounted
design
n AEC-Q101 qualified
1.3 Applications
n General regulation functions
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
VF
forward voltage
IF = 100 mA
PZSM
non-repetitive peak reverse
power dissipation
Min
Typ
Max
Unit
Per diode
[1]
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
[2]
tp = 100 µs; square wave; Tj = 25 °C prior to surge
[1]
-
-
1.1
V
[2]
-
-
40
W
PZUxDB2 series
NXP Semiconductors
Dual Zener diodes
2. Pinning information
Table 2.
Pinning
Pin
Description
1
anode (diode 1)
2
not connected
3
anode (diode 2)
4
cathode (diode 2)
5
cathode (diode 1)
Simplified outline
5
1
Graphic symbol
4
2
5
4
3
1
2
3
006aab219
3. Ordering information
Table 3.
Ordering information
Type number
PZU2.7DB2 to
PZU24DB2[1]
Package
Name
Description
Version
SC-88A
plastic surface-mounted package; 5 leads
SOT353
PZU2.7DB2/DG to
PZU24DB2/DG[1][2]
[1]
The series consists of 25 types with nominal working voltages from 2.7 V to 24 V.
[2]
/DG: halogen-free plastic package
4. Marking
Table 4.
Marking codes
Type number
Marking code[1]
Type number[2]
Marking code[1]
PZU2.7DB2
T1*
PZU2.7DB2/DG
U1*
PZU3.0DB2
T2*
PZU3.0DB2/DG
U2*
PZU3.3DB2
T3*
PZU3.3DB2/DG
U3*
PZU3.6DB2
T4*
PZU3.6DB2/DG
U4*
PZU3.9DB2
T5*
PZU3.9DB2/DG
U5*
PZU4.3DB2
T6*
PZU4.3DB2/DG
U6*
PZU4.7DB2
T7*
PZU4.7DB2/DG
U7*
PZU5.1DB2
T8*
PZU5.1DB2/DG
U8*
PZU5.6DB2
T9*
PZU5.6DB2/DG
U9*
PZU6.2DB2
TA*
PZU6.2DB2/DG
UA*
PZU6.8DB2
TB*
PZU6.8DB2/DG
UB*
PZU7.5DB2
TC*
PZU7.5DB2/DG
UC*
PZU8.2DB2
TD*
PZU8.2DB2/DG
UD*
PZU9.1DB2
TE*
PZU9.1DB2/DG
UE*
PZUXDB2_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 31 March 2008
2 of 12
PZUxDB2 series
NXP Semiconductors
Dual Zener diodes
Table 4.
Marking codes …continued
Type number
Marking code[1]
Type number[2]
Marking code[1]
PZU10DB2
TF*
PZU10DB2/DG
UF*
PZU11DB2
TG*
PZU11DB2/DG
UG*
PZU12DB2
TH*
PZU12DB2/DG
UH*
PZU13DB2
TK*
PZU13DB2/DG
UK*
PZU14DB2
TL*
PZU14DB2/DG
UL*
PZU15DB2
TM*
PZU15DB2/DG
UM*
PZU16DB2
TN*
PZU16DB2/DG
UN*
PZU18DB2
TP*
PZU18DB2/DG
UP*
PZU20DB2
TR*
PZU20DB2/DG
UR*
PZU22DB2
TS*
PZU22DB2/DG
US*
PZU24DB2
TT*
PZU24DB2/DG
UT*
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
[2]
/DG: halogen-free plastic package
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
mA
Per diode
IF
forward current
-
200
IZSM
non-repetitive peak reverse
current
[1]
-
see
Table 8
PZSM
non-repetitive peak reverse
power dissipation
[1]
-
40
W
[2]
-
250
mW
[3]
-
275
mW
Per device
total power dissipation
Ptot
Tamb ≤ 25 °C
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−55
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
tp = 100 µs; square wave; Tj = 25 °C prior to surge
[2]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
PZUXDB2_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 31 March 2008
3 of 12
PZUxDB2 series
NXP Semiconductors
Dual Zener diodes
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
thermal resistance from
junction to ambient
in free air
Min
Typ
Max
Unit
[1]
-
-
500
K/W
[2]
-
-
455
K/W
[3]
-
-
200
K/W
Per device
Rth(j-a)
thermal resistance from
junction to solder point
Rth(j-sp)
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[3]
Soldering points at pin 4 and pin 5.
7. Characteristics
Table 7.
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IF = 10 mA
-
-
0.9
V
IF = 100 mA
-
-
1.1
V
Per diode
[1]
[1]
forward voltage
VF
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
Table 8.
Characteristics per type; PZU2.7DB2 to PZU24DB2 and PZU2.7DB2/DG to PZU24DB2/DG
Tj = 25 °C unless otherwise specified.
PZUxDB2
Working
PZUxDB2/DG voltage
Differential resistance Reverse
current
r (Ω)
dif
VZ (V)
IR (µA)
Temperature
coefficient
SZ (mV/K)
Diode
Non-repetitive
capacitance peak reverse
current
C (pF)[1]
d
IZSM (A)[2]
IZ = 5 mA
IZ = 0.5 mA IZ = 5 mA
IZ = 5 mA
Min
Max
Max
Max
Max
VR (V)
Typ
Max
Max
2.7
2.65
2.9
1000
100
20
1
−2.0
440
8
3.0
2.95
3.2
1000
95
10
1
−2.1
425
8
3.3
3.25
3.5
1000
95
5
1
−2.4
410
8
3.6
3.55
3.8
1000
90
5
1
−2.4
390
8
3.9
3.87
4.1
1000
90
3
1
−2.5
370
8
4.3
4.15
4.34
1000
90
3
1
−2.5
350
8
4.7
4.55
4.75
800
80
2
1
−1.4
325
8
5.1
4.98
5.2
250
60
2
1.5
0.3
300
5.5
5.6
5.49
5.73
100
40
1
2.5
1.9
275
5.5
6.2
6.06
6.33
80
30
0.5
3
2.7
250
5.5
6.8
6.65
6.93
60
20
0.5
3.5
3.4
215
5.5
7.5
7.28
7.6
60
10
0.5
4
4.0
170
3.5
PZUXDB2_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 31 March 2008
4 of 12
PZUxDB2 series
NXP Semiconductors
Dual Zener diodes
Table 8.
Characteristics per type; PZU2.7DB2 to PZU24DB2 and PZU2.7DB2/DG to PZU24DB2/DG …continued
Tj = 25 °C unless otherwise specified.
PZUxDB2
Working
PZUxDB2/DG voltage
Differential resistance Reverse
current
r (Ω)
dif
VZ (V)
IR (µA)
Temperature
coefficient
SZ (mV/K)
Diode
Non-repetitive
capacitance peak reverse
current
C (pF)[1]
d
IZSM (A)[2]
IZ = 5 mA
IZ = 0.5 mA IZ = 5 mA
Min
Max
Max
Max
Max
VR (V)
Typ
Max
Max
8.2
8.02
8.36
60
10
0.5
5
4.6
150
3.5
9.1
8.85
9.23
60
10
0.5
6
5.5
120
3.5
10
9.77
10.21
60
10
0.1
7
6.4
110
3.5
11
10.76
11.22
60
10
0.1
8
7.4
108
3
12
11.74
12.24
80
10
0.1
9
8.4
105
3
13
12.91
13.49
80
10
0.1
10
9.4
103
2.5
14
13.7
14.3
80
10
0.1
11
10.4
101
2
15
14.34
14.98
80
15
0.05
11
11.4
99
2
16
15.85
16.51
80
20
0.05
12
12.4
97
1.5
18
17.56
18.35
80
20
0.05
13
14.4
93
1.5
20
19.52
20.39
100
20
0.05
15
16.4
88
1.5
22
21.54
22.47
100
25
0.05
17
18.4
84
1.3
24
23.72
24.78
120
30
0.05
19
20.4
80
1.3
[1]
f = 1 MHz; VR = 0 V
[2]
tp = 100 µs; square wave; Tj = 25 °C prior to surge
IZ = 5 mA
PZUXDB2_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 31 March 2008
5 of 12
PZUxDB2 series
NXP Semiconductors
Dual Zener diodes
006aab215
103
PZSM
(W)
mbg781
300
IF
(mA)
102
200
10
100
1
10−4
10−3
0
0.6
10−2
0.8
1
tp (s)
VF (V)
Tj = 25 °C (prior to surge)
Fig 1.
Tj = 25 °C
Non-repetitive peak reverse power dissipation
as a function of pulse duration; maximum
values
Fig 2.
006aab216
0
Forward current as a function of forward
voltage; typical values
mgl274
10
12
SZ
(mV/K)
4.3
−1
SZ
(mV/K)
11
5
10
9.1
8.2
7.5
6.8
3.9
3.6
−2
6.2
5.6
5.1
0
3.3
4.7
3.0
2.7
−3
Fig 3.
−5
0
20
40
IZ (mA)
60
0
4
8
12
Tj = 25 °C to 150 °C
Tj = 25 °C to 150 °C
PZU2.7DB2 to PZU4.3DB2
PZU4.7DB2 to PZU12DB2
PZU2.7DB2/DG to PZU4.3DB2/DG
PZU4.7DB2/DG to PZU12DB2/DG
Temperature coefficient as a function of
working current; typical values
Fig 4.
IZ (mA)
20
Temperature coefficient as a function of
working current; typical values
PZUXDB2_SER_1
Product data sheet
16
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 31 March 2008
6 of 12
PZUxDB2 series
NXP Semiconductors
Dual Zener diodes
006aab217
102
IZ
(mA)
3.0
3.3
3.6
3.9
4.3
4.7
1
VZ(nom) (V) = 6.8
IZ
(mA)
VZ(nom) (V) = 2.7
10
006aab218
102
7.5
8.2
9.1
10
11
12
13
14
15
10
5.1
6.2
5.6
1
10−1
10−1
10−2
10−2
10−3
16
20
18
10−3
0
1
2
3
4
5
6
7
0
5
10
15
VZ (V)
Fig 5.
24
22
20
25
VZ (V)
Tj = 25 °C
Tj = 25 °C
PZU2.7DB2 to PZU6.2DB2
PZU6.8DB2 to PZU24DB2
PZU2.7DB2/DG to PZU6.2DB2/DG
PZU6.8DB2/DG to PZU24DB2/DG
Working current as a function of working
voltage; typical values
Fig 6.
Working current as a function of working
voltage; typical values
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
PZUXDB2_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 31 March 2008
7 of 12
PZUxDB2 series
NXP Semiconductors
Dual Zener diodes
9. Package outline
2.2
1.8
1.1
0.8
5
0.45
0.15
4
2.2 1.35
2.0 1.15
1
2
3
0.3
0.2
0.65
0.25
0.10
1.3
Dimensions in mm
Fig 7.
04-11-16
Package outline SOT353 (SC-88A)
10. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
PZU2.7DB2 to
PZU24DB2
Package
SOT353
Description
4 mm pitch, 8 mm tape and reel
Packing quantity
3000
10000
-115
-135
PZU2.7DB2/DG to
PZU24DB2/DG
[1]
For further information and the availability of packing methods, see Section 13.
PZUXDB2_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 31 March 2008
8 of 12
PZUxDB2 series
NXP Semiconductors
Dual Zener diodes
11. Soldering
2.65
0.60
(1×)
0.40 0.90 2.10
2.35
0.50
(4×)
solder lands
0.50
(4×)
solder paste
1.20
solder resist
2.40
occupied area
Dimensions in mm
Fig 8.
sot353_fr
Reflow soldering footprint SOT353 (SC-88A)
2.25
2.65
0.30 1.00 4.00
4.50 2.70 0.70
solder lands
1.15
3.75
solder resist
transport direction during soldering
occupied area
Dimensions in mm
Fig 9.
Wave soldering footprint SOT353 (SC-88A)
PZUXDB2_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 31 March 2008
9 of 12
PZUxDB2 series
NXP Semiconductors
Dual Zener diodes
12. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PZUXDB2_SER_1
20080331
Product data sheet
-
-
PZUXDB2_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 31 March 2008
10 of 12
PZUxDB2 series
NXP Semiconductors
Dual Zener diodes
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PZUXDB2_SER_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 31 March 2008
11 of 12
PZUxDB2 series
NXP Semiconductors
Dual Zener diodes
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7
Quality information . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Packing information. . . . . . . . . . . . . . . . . . . . . . 8
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 31 March 2008
Document identifier: PZUXDB2_SER_1
Similar pages