ENA2031 D

Ordering number : ENA2031
LC709201F
CMOS IC
Battery Monitor IC
http://onsemi.com
Overview
The LC709201F is an IC that measures the remaining power level of 1-cell lithium-ion secondary batteries by
monitoring the battery voltage without an external sense resistor, and detects the remaining battery power level by
current prediction. It monitors the battery voltage and realizes a function that precisely measures the remaining
battery charge. In addition, the IC realizes the function for calculating the remaining battery power level even more
accurately by utilizing a temperature correction function that makes use of the temperature input from a thermistor.
Features
Accuracy of remaining battery power level measurement
• Accuracy of ±5% during discharging from 100% to 0% (at an ambient operating temperature of 0°C to 50°C)
Measurement of remaining battery power level
• The remaining power level is measured four times a second and calculated with each measurement undertaken.
Interface
• I2Cbus, communication in slave mode up to 100kHz supported
Ports
• I2C-bus communication pin
• Battery temperature reading control pin
• Analog voltage input pin for battery temperature
• Reset pin
• TEST pin
• Power supply pin
2 (SDA, SCL)
1 (TSW)
1 (TSENSE)
1 (RESB)
1 (TEST)
2 (VSS, VDD)
Package form
• MFP10S (225 mil): LC709201FM-01/02/03
• VCT16 (2.6×2.6): LC709201FRD-01/02/03
Semiconductor Components Industries, LLC, 2013
May, 2013
Ver.1.5
32812HKIM 20120307-S00004 No.A2031-1/10
LC709201F
Applications
• Cell phones, PDA devices, MP3 players, cordless phones, digital cameras, USB-related devices, etc.
(Note) Depending on the kinds of battery, applicable model differs (LC709201F-01/02/03).
Please contact us for more detail information.
Package Dimensions
unit : mm (typ)
3086B
5
6.4
1
1.7max
4.4
6
0.63
5.0
10
0.1 (1.5)
0.15
0.35
1.0
(0.5)
SANYO : MFP10S(225mil)
Package Dimensions
unit : mm (typ)
3318
TOP VIEW
SIDE VIEW
BOTTOM VIEW
(0.125)
(0.13)
2.6
16
0.4
2.6
(C0.116)
2
1
0.5
LASER MARKED
INDEX
(0.55)
0.25
(0.035)
0.8
SIDE VIEW
SANYO : VCT16(2.6X2.6)
No.A2031-2/10
LC709201F
Pin Assignment
NC
1
10
SCL
9
SDA
VSS
2
RESB
3
8
TSENSE
VDD
4
7
TSW
TEST
5
6
NC
LC709201FM
Top view
TSW
TSENSE
SDA
SCL
MFP10S (225mil) “Lead-free Type”
12 11 10 9
NC
13
8
NC
NC
14
7
NC
6
NC
5
NC
1
2
3
4
VDD
TEST
16
RESB
NC
VSS
NC
LC709201FRD
15
Top view
VCT16 (2.6×2.6) “Lead-free Type”
No.A2031-3/10
LC709201F
SCL
SDA
Block Diagram
2
IC
interface
Remaining voltage
Processing Unit
Voltage detect
TSENSE
Pin Function
Pin Name
I/O
Description
VSS
-
- power pin
VDD
-
+ power pin
RESB
I
Reset pin
TEST
I/O
Test pin
*Connect an external 100kΩ pull-down resistor.
SDA
I/O
I2C data pin
SCL
I/O
I2C clock pin
TSW
O
Battery temperature reading control pin
*Set high when reading in the temperature, held low at other times.
TSENSE
I
Battery temperature analog voltage input pin
No.A2031-4/10
LC709201F
Absolute Maximum Ratings at Ta=25°C, VSS=0V
Specification
Parameter
Symbol
Pin/Remarks
Conditions
Unit
VDD[V]
Maximum supply
VDD max
VDD
Input voltage
VI (1)
RESB, TSENSE
Output voltage
VO (1)
TSW
Input/output voltage
VIO (1)
SDA, SCL, TEST
Allowable power
Pd max
voltage
MFP10S
dissipation
Operating ambient
min
max
-0.3
+6.5
-0.3
VDD
+0.3
-0.3
VDD
+0.3
-0.3
VDD
+0.3
Ta=-40 to +85°C
V
110
mW
VCT16
55
Topr
temperature
Storage ambient
typ
-40
+85
-55
-125
°C
Tstg
temperature
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Allowable Operating Conditions at Ta=-40 to +85°C, VSS=0V
Specification
Parameter
Symbol
Pin/Remarks
Conditions
unit
VDD[V]
Operating supply
VDD (1)
VDD
VIH (1)
SDA, SCL
2.25 to 5.5
voltage
Low level input
VIL (1)
typ
max
2.25
voltage
High level input
min
SDA, SCL
voltage
VIL (2)
5.5
0.3VDD
VDD
+0.7
4.0 to 5.5
VSS
2.25 to 4.0
VSS
V
0.1VDD
+0.4
0.2VDD
Electrical Characteristics at Ta=-40 to +85°C, VSS=0V
Specification
Parameter
Symbol
Pin/Remarks
Conditions
Unit
VDD[V]
High level input
IIH (1)
current
RESB, SDA,
SCL
VIN=VDD
(including output transistor off
min
typ
max
2.25 to 5.5
1
leakage current)
Low level input
IIL (1)
current
RESB, SDA,
SCL
VIN=VSS
(including output transistor off
μA
2.25 to 5.5
-1
leakage current)
High level output
VOH (1)
voltage
VOH (2)
Low level output
TSW
IOH=-0.4mA
3.0 to 5.5
VDD-0.4
IOH=-0.2mA
2.25 to 5.5
VDD-0.4
VOL (1)
TSW,
IOL=3.0mA
3.0 to 5.5
0.4
voltage
VOL (2)
SDA, SCL
IOL=1.3mA
2.25 to 5.5
0.4
Hysteresis voltage
VHYS
RESB,
SDA, SCL
Pin capacitance
CP
All pins
2.25 to 5.5
0.1VDD
2.25 to 5.5
10
2.25 to 5.5
8
16
2.25 to 5.5
5
12
V
Pins other than the pin under test
VIN=VSS
f=1 MHz
pF
Ta=25°C
Consumption
IDD (1)
current
VDD
When detecting remaining
capacity
IDD (2)
When not detecting remaining
capacity
μA
No.A2031-5/10
LC709201F
I2C Slave Characteristics at Ta=-40 to+85°C, VSS=0V
Specification
Parameter
Symbol
Pin/Remarks
Conditions
unit
VDD[V]
Clock frequency
TSCL
SCL
Bus free time between
TBUF
SCL, SDA
min
typ
max
100
kHz
See Fig. 1.
STOP condition and
4.7
μs
4.0
μs
4.7
μs
4.0
μs
ns
START condition
Hold time (repeated)
THD: STA
SCL, SDA
See Fig. 1.
START condition
First clock pulse is
generated after this
interval
Repeated START
TSU: STA
SCL, SDA
See Fig. 1.
TSU: STO
SCL, SDA
See Fig. 1.
2.25 to 5.5
condition setup time
STOP condition setup
time
Data hold time
THD: DAT
SCL, SDA
See Fig. 1.
300
Data setup time
TSU: DAT
SCL, SDA
See Fig. 1.
250
ns
Clock low period
TLOW
SCL
4.7
μs
Clock high period
THIGH
SCL
4.0
Clock/data fall time
TF
SCL, SDA
300
ns
Clock/data rise time
TR
SCL, SDA
1000
ns
tR
tF
tLOW
tHD:STA
μs
tHD:STA
tHD:DAT
tHIGH
tSU:DAT
tSU:STA
tSU:STO
tBUF
P
S
S
P
No.A2031-6/10
LC709201F
Discharge Characteristics
Figure2 Discharge Characteristics by Temperature Change
Figure 3 Discharge Characteristics by Load Change
No.A2031-7/10
LC709201F
Communication Protocol
Communication protocol type: I2C
Frequency: 100kHz
Address: 0x16
Bus Protocols
S
:
Start Condition
Sr
:
Repeated Start Condition
Rd
:
Read (bit value of 1)
Wr
:
Write (bit value of 0)
A
:
ACK (bit value of 0)
N
:
NACK (bit value of 1)
P
:
Stop Condition
CRC-8
:
Slave Address to Last Data (ex.3778mV: 0x16, 0x09, 0x17, 0xC2, 0x0E → 0x86)
:
Master-to-Slave
:
Slave-to-Master
:
Continuation of protocol
…
Read Word Protocol
S
Slave Address
Wr
A
Command Code
A
…
Sr
Slave Address
Rd
A
Data Byte Low
A
Data Byte High
A
CRC-8
N
P
Wr
A
Command Code
A
…
…
Write Word Protocol
S
Slave Address
Data Byte Low
A
Data Byte High
A
CRC-8
A
P
Slave Functions
Command Code
Range
Access
Unit
Cell Temperature
0x08
0 to 65535
R
0.1°K
Cell Voltage
0x09
0 to 65535
R
mV
Current
0x0A
-32768 to 32767
R
mA
Value
Adjustment Pack
0x0B
0 to 255
R
Relative State Of Charge
0x0D
0 to 100
R
%
Remaining Capacity
0x0F
0 to 65535
R
mAh
Full Charge Capacity
0x10
0 to 65535
R
mAh
IC Version
0x11
0 to 65535
R
Version
Adjustment Thermistor
0x12
0 to 255
R
Value
Set Relative State Of Charge
0x08
0xA500 + 0 to 100
W
0xA500 + %
Adjustment Pack
0x08
0x5A00 + 0 to 255
W
0x5A00 + Value
Adjustment Thermistor
0x08
0xAA00 + 0 to 255
W
0xAA00 + Value
Initial Relative State Of Charge
0x09
0xAA55
W
-
No.A2031-8/10
LC709201F
Application Circuit Example
Figure 4 Example of an application schematic using LC709201F
SYSTEM VDD
10kΩ
10kΩ
2
100Ω
I C BUS
VDD
MASTER
100Ω
NC
TSW
TSENSE
SDA
Battery Pac
SCL
10kΩ/100kΩ
ASIC
LC709201FM
PACK-
T
TEST
VDD
RESB
VSS
NC
MFP10S (225mil)
1μF
PACK+
VSS
0.1μF
100
kΩ
SYSTEM VSS
Figure 5 Conceptual diagram using LC709201F
LC709201FM
I2C
TSW
TSENSE
No.A2031-9/10
LC709201F
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PS No.A2031-10/10
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