LC898111AXB CMOS LSI Optical Image Stabilization (OIS) Controller & Driver www.onsemi.com Overview The LC898111AXB is Optical Image Stabilization (OIS) system control LSI for smartphone camera modules. The LSI have built-in digital signal processing circuits, such as a 2ch saturation H-Bridge Driver and a Flexible Filter circuit, and control VCM type actuators. The LC898111AXB is identical LSI except for the dimensions, i.e. XB has WLP thickness, max. 0.69 mm with B/C. WLCSP48, 3.22x2.57 Function Motor Driver Saturation-drive H bridge x2ch IO max : 220mA Digital signal processing LSI (Logic LSI) Built-in digital servo circuit Built-in Gyro filter AD converter 12-bit input 5ch Equipped with a sample-hold circuit DA converter 8-bit Output 2ch (Constant current Bias : max 7mA) Built-in Serial I/F circuit (2-wire I2C-Bus or 4-wire SPI Bus interface) Built-in Hall Bias circuit Built-in Hall Amp (Gain of Opamp : x25, x50, x75, x100, x150, x200) Built-in OSC (Oscillator) 48MHz 5% (Frequency adjustment function) External Clock input is possible from TSTCLK (48MHz 5%) Built-in LDO (Low Drop-Out regulator) Digital Gyro I/F for the companies (SPI Bus) (Please refer for the details) Support Hall sensor and Photo Reflector as means to detect a position Package WLCSP48, 3.22mm x 2.57mm, thickness max 0.69mm, with B/C Pb-Free Halogen Free Power supply voltage Logic : DVDD30 = 2.6 to 3.6 V Driver : VM = 2.6 to 3.6 V 2 * I C Bus is a trademark of Philips Corporation. ORDERING INFORMATION See detailed ordering and shipping information on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2015 April 2015 - Rev. 1 1 Publication Order Number : LC898111AXB/D LC898111AXB Block Diagram Figure 3.1 Example of wiring diagram (Hall) in LC898111AXB www.onsemi.com 2 LC898111AXB Package Dimensions unit : mm WLCSP48, 3.22x2.57 CASE 567GE ISSUE O D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. PIN A1 REFERENCE DIM A A1 A2 b D E e E 0.13 C 2X 0.13 C 2X GENERIC MARKING DIAGRAM* TOP VIEW XXXXXXX XXXXXXX AWLYYWW A2 0.10 C A 0.08 C NOTE 3 A1 MILLIMETERS MIN MAX 0.69 0.16 0.26 0.43 REF 0.21 0.31 3.22 BSC 2.57 BSC 0.40 BSC C SIDE VIEW XXXXXXX A WL YY WW SEATING PLANE e/2 48X e b 0.05 C A B 0.03 C F = Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package *This information is generic. Please refer to device data sheet for actual part marking. E RECOMMENDED SOLDERING FOOTPRINT* D C e/2 B PACKAGE OUTLINE A1 e A 1 2 3 4 5 6 7 0.40 PITCH 8 BOTTOM VIEW 48X 0.40 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 3 LC898111AXB Pin Assignment Top View 1 OPTESTO OPINPY ADVDD ADVSS GYYI HXI 2 HLXBO OPINMY ADVRH GYXI DVSS I2CDT 3 EPSOIF DAOPVDD ADVRL HYI EPCSBIF2 I2CCK 4 DVDD30 DAOPVSS OPINPX SAD4 SSB MISO 5 BUSY2 HLYBO OPINMX ZRESET LDOPO DVDD30 6 BUSY1 TEST DVSS TSTCLK LDSTBB DGSCLK 7 VM MON CLKSEL DGMOSI DGMISO DGINT 8 OUT4 OUT3 OUT2 OUT1 PGND DGSSB F E D C B A Driver DAC OpAmp ADC EEPROM i/f Logic GND IO VDD (2.6V to 3.6V) Logic Core VDD (1.14 to 1.26V) www.onsemi.com 4 LC898111AXB typ I : INPUT, O : OUTPUT, B : BIDIRECTION, P : Power, GND Ball No Pin Name type F8 OUT4 O Driver Output Description F7 VM P Driver VDD (2.6V to 3.6V) F6 BUSY1 B F5 BUSY2 B F4 DVDD30 P Logic IO VDD (2.6V to 3.6V) F3 EPSOIF I EEPROM I/F F2 HLXBO O Hall-X Bias (Current Drive) F1 OPTESTO O OpAmp Test out E8 OUT3 O Driver output E7 MON B inner signal monitor / General-purpose IOPORT 2 EEPROM I/F (at I C type EEPROM ) / BUSY1(O) / General-purpose IOPORT(B) / inner signal Monitor(O) BUSY2(O) / General-purpose IOPORT(B) / inner signal Monitor(O) E6 TEST I SPI & External clock case sets “1” other cases set “0” E5 HLYBO O Hall-Y Bias (Current Drive) E4 DAOPVSS P DA&Opamp VSS E3 DAOPVDD P DA&Opamp VDD (2.6V to 3.6V) E2 OPINMY I Hall-Y OpAmp input E1 OPINPY I Hall-Y OpAmp input+ D8 OUT2 O Driver Output D7 CLKSEL I change pin of OSC(0) and External clock(1) D6 DVSS P Logic GND D5 OPINMX I Hall-X OpAmp input D4 OPINPX I Hall-X OpAmp input+ D3 ADVRL I ADC Reference Voltage Low input D2 ADVRH I ADC Reference Voltage High input D1 ADVDD P AD VDD (2.6V to 3.6V) C8 OUT1 O Driver Output C7 DGMOSI B Digital Gyro (4-wire)IF data(O) / HPS Control(O) / General-purpose IOPORT(B) C6 TSTCLK I CLKSEL=1 : External Clock, CLKSEL=0 : change pin of I C(0) and SPI(1) C5 ZRESET I Hard Wafer Reset C4 SAD4 I General-purpose AD input C3 HYI I Hall-Y AD input C2 GYXI I Gyro-X AD input C1 ADVSS P AD GND B8 PGND P Driver GND B7 DGMISO B Digital Gyro SPI IF Data( I ) / Digital Gyro I C IF Data(B) B6 LDSTBB I LDO Standby (0 : Standby On, 1 : Standby Off) B5 LDOPO P LDO Power supply out (Logic Core VDD (1.14V to 1.26V)) B4 SSB I SPI I/F Chip Select / VDD fix at I C i/f B3 EPCSBIF2 B EEPROM I/F B2 DVSS P Logic GND B1 GYYI I Gyro-Y AD input A8 DGSSB B DGINT B A6 DGSCLK B A5 DVDD30 P Logic IO VDD (2.6V to 3.6V) and power supply to LDO A4 MISO O SPI I/F Data / General-purpose IOPORT / inner signal monitor A3 I2CCK I I C_IF clock / SPI IF clock A2 I2CDT B I C_IF Data(B) / SPI IF Data A1 HXI I Hall-X AD input A7 2 2 2 Digital Gyro SPI IF Chip Select(O) / inner signal monitor(O) / General-purpose IOPORT(B) Digital Gyro SPI IF Data Busy( I ) / inner signal monitor(O) / General-purpose IOPORT(B) 2 Digital Gyro SPI IF clock (O) / Digital Gyro I C IF clock(O) / HPS Control 1(O) / General-purpose IOPORT (B) 2 2 www.onsemi.com 5 LC898111AXB ORDERING INFORMATION Device LC898111AXB-MH Package Shipping (Qty / Packing) WLCSP48, 3.22x2.57 (Pb-Free / Halogen Free) 4000 / Tape & Reel † For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://www.onsemi.com/pub_link/Collateral/BRD8011-D.PDF ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf . SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. 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