NSI45035JZ D

NSI45035JZ, NSV45035JZ
Adjustable Constant Current
Regulator & LED Driver
45 V, 35 − 70 mA + 15%, 1.5 W Package
The adjustable constant current regulator (CCR) is a simple,
economical and robust device designed to provide a cost effective
solution for regulating current in LEDs (similar to Constant Current
Diode, CCD). The CCR is based on Self-Biased Transistor (SBT)
technology and regulates current over a wide voltage range. It is
designed with a negative temperature coefficient to protect LEDs from
thermal runaway at extreme voltages and currents.
The CCR turns on immediately and is at 20% of regulation with
only 0.5 V Vak. The Radj pin allows Ireg(SS) to be adjusted to higher
currents by attaching a resistor between Radj (Pin 3) and the Cathode
(Pin 4). The Radj pin can also be left open (No Connect) if no
adjustment is required. It requires no external components allowing it
to be designed as a high or low−side regulator. The high anodecathode voltage rating withstands surges common in Automotive,
Industrial and Commercial Signage applications. This device is
available in a thermally robust package and is qualified to stringent
AEC−Q101 standard, which is lead-free RoHS compliant and uses
halogen-free molding compound, and UL94−V0 certified.
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Ireg(SS) = 35 − 70 mA
@ Vak = 7.5 V
Anode
1
3
Radj
2/4
Cathode
Features
•
•
•
•
•
•
•
•
•
•
•
Robust Power Package: 1.5 Watts
Adjustable up to 70 mA
Wide Operating Voltage Range
Immediate Turn-On
Voltage Surge Suppressing − Protecting LEDs
AEC-Q101 Qualified and PPAP Capable, UL94−V0 Certified
SBT (Self−Biased Transistor) Technology
Negative Temperature Coefficient
Eliminates Additional Regulation
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Automobile: Chevron Side Mirror Markers, Cluster, Display &
•
•
•
•
Instrument Backlighting, CHMSL, Map Light
AC Lighting Panels, Display Signage, Decorative Lighting, Channel
Lettering
Switch Contact Wetting
Application Note AND8391/D − Power Dissipation Considerations
Application Note AND8349/D − Automotive CHMSL
© Semiconductor Components Industries, LLC, 2013
July, 2013 − Rev. 2
1
SOT−223
CASE 318E
STYLE 2
MARKING DIAGRAM
C
AYW
AAKG
G
1
A
C
Radj
A
= Assembly Location
Y
= Year
W
= Work Week
AAK
= Specific Device Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Package
Shipping†
NSI45035JZT1G
SOT−223
(Pb−Free)
1000/Tape & Reel
NSV45035JZT1G
SOT−223
(Pb−Free)
1000/Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NSI45035JZ/D
NSI45035JZ, NSV45035JZ
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Anode−Cathode Voltage
Reverse Voltage
Operating and Storage Junction Temperature Range
ESD Rating:
Human Body Model
Machine Model
Symbol
Value
Vak Max
45
V
VR
500
mV
TJ, Tstg
−55 to +150
ESD
Unit
°C
Class 2
Class C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Steady State Current @ Vak = 7.5 V (Note 1)
Voltage Overhead (Note 2)
Symbol
Min
Typ
Max
Unit
Ireg(SS)
29.75
35
40.25
mA
42.5
mA
Voverhead
1.8
Ireg(P)
Capacitance @ Vak = 7.5 V (Note 4)
C
7.4
pF
Capacitance @ Vak = 0 V (Note 4)
C
31
pF
1.
2.
3.
4.
30.9
V
Pulse Current @ Vak = 7.5 V (Note 3)
Ireg(SS) steady state is the voltage (Vak) applied for a time duration ≥ 35 sec, using FR−4 @ 300 mm2 2 oz. Copper traces, in still air.
Voverhead = Vin − VLEDs. Voverhead is typical value for 75% Ireg(SS).
Ireg(P) non−repetitive pulse test. Pulse width t ≤ 1.0 msec.
f = 1 MHz, 0.02 V RMS.
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation (Note 5) TA = 25°C
Derate above 25°C
Symbol
Max
Unit
PD
1008
8.06
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 5)
RθJA
124
°C/W
Thermal Reference, Junction−to−Lead 4 (Note 5)
RψJL4
33.3
°C/W
PD
1136
9.09
mW
mW/°C
RθJA
110
°C/W
RψJL4
33.3
°C/W
PD
1238
9.9
mW
mW/°C
RθJA
101
°C/W
RψJL4
33.7
°C/W
PD
1420
11.36
mW
mW/°C
RθJA
88
°C/W
RψJL4
32.1
°C/W
PD
1316
10.53
mW
mW/°C
Total Device Dissipation (Note 6) TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient (Note 6)
Thermal Reference, Junction−to−Lead 4 (Note 6)
Total Device Dissipation (Note 7) TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient (Note 7)
Thermal Reference, Junction−to−Lead 4 (Note 7)
Total Device Dissipation (Note 8) TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient (Note 8)
Thermal Reference, Junction−to−Lead 4 (Note 8)
Total Device Dissipation (Note 9) TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient (Note 9)
RθJA
95
°C/W
Thermal Reference, Junction−to−Lead 4 (Note 9)
RψJL4
32.4
°C/W
PD
1506
12.05
mW
mW/°C
Total Device Dissipation (Note 10) TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient (Note 10)
RθJA
83
°C/W
Thermal Reference, Junction−to−Lead 4 (Note 10)
RψJL4
30.8
°C/W
Junction and Storage Temperature Range
TJ, Tstg
−55 to +150
°C
NOTE: Lead measurements are made by non−contact methods such as IR with treated surface to increase emissivity to 0.9.
Lead temperature measurement by attaching a T/C may yield values as high as 30% higher °C/W values based upon empirical
measurements and method of attachment.
5. FR−4 @ 300 mm2, 1 oz. copper traces, still air.
6. FR−4 @ 300 mm2, 2 oz. copper traces, still air.
7. FR−4 @ 500 mm2, 1 oz. copper traces, still air.
8. FR−4 @ 500 mm2, 2 oz. copper traces, still air.
9. FR−4 @ 700 mm2, 1 oz. copper traces, still air.
10. FR−4 @ 700 mm2, 2 oz. copper traces, still air.
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NSI45035JZ, NSV45035JZ
TYPICAL PERFORMANCE CURVES
Minimum FR−4 @ 300 mm2, 2 oz Copper Trace, Still Air
Ireg(SS), STEADY STATE CURRENT (mA)
Ireg, CURRENT REGULATION (mA)
60
50
40
30
20
10
0
−10
TA = 25°C, Radj = Open
−20
−10
0
10
20
30
40
50
70
60
40
TA = −40°C
−0.0290 mA/°C
30
−0.0278 mA/°C
25
TA = 25°C
20
TA = 85°C
15
TA = 125°C
10
Radj = Open
5
0
DC Test Steady State, Still Air
0
3
4
5
6
7
8
10
9
Figure 2. Steady State Current (Ireg(SS)) vs.
Anode−Cathode Voltage (Vak)
Ireg(SS), STEADY STATE CURRENT (mA)
TA = 25°C
36
35
34
33
Radj = Open
32
31
3.0
Non−Repetitive Pulse Test
4.0
5.0
6.0
7.0
8.0
9.0
10
41
40
39
38
37
36
35
34
33
32
Vak @ 7.5 V
TA = 25°C
Radj = Open
31
30
29
30 31 32 33 34 35 36 37 38 39 40 41 42 43 44
Vak, ANODE−CATHODE VOLTAGE (V)
Ireg(P), PULSE CURRENT (mA)
Figure 3. Pulse Current (Ireg(P)) vs.
Anode−Cathode Voltage (Vak)
Figure 4. Steady State Current vs. Pulse
Current Testing
Ireg(SS), STEADY STATE CURRENT (mA)
37
Ireg, CURRENT REGULATION (mA)
2
Figure 1. General Performance Curve for CCR
37
Vak @ 7.5 V
TA = 25°C
Radj = Open
36
35
0
1
Vak, ANODE−CATHODE VOLTAGE (V)
38
34
−0.0302 mA/°C
35
Vak, ANODE−CATHODE VOLTAGE (V)
39
Ireg(P), PULSE CURRENT (mA)
45
5
10
15
20
25
30
35
70
Vak @ 7.5 V
TA = 25°C
65
60
55
50
45
40
35
30
1
TIME (s)
10
100
Radj (W), MAX POWER 50 mW
Figure 6. Ireg(SS) vs. Radj
Figure 5. Current Regulation vs. Time
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3
1000
NSI45035JZ, NSV45035JZ
2300
500 mm2/2 oz
POWER DISSIPATION (mW)
2100
300 mm2/2 oz
1900
1700
100 mm2/2 oz
1500
1300
1100
500 mm2/1 oz
900
300 mm2/1 oz
700
500
−40
100 mm2/1 oz
−20
0
20
40
60
80
TA, AMBIENT TEMPERATURE (°C)
Figure 7. Power Dissipation vs. Ambient
Temperature @ TJ = 1505C
APPLICATIONS INFORMATION
The CCR is a self biased transistor designed to regulate the
current through itself and any devices in series with it. The
device has a slight negative temperature coefficient, as
shown in Figure 2 – Tri Temp. (i.e. if the temperature
increases the current will decrease). This negative
temperature coefficient will protect the LEDS by reducing
the current as temperature rises.
The CCR turns on immediately and is typically at 20% of
regulation with only 0.5 V across it.
The device is capable of handling voltage for short
durations of up to 45 V so long as the die temperature does
not exceed 150°C. The determination will depend on the
thermal pad it is mounted on, the ambient temperature, the
pulse duration, pulse shape and repetition.
Single LED String
The CCR can be placed in series with LEDs as a High Side
or a Low Side Driver. The number of the LEDs can vary
from one to an unlimited number. The designer needs to
calculate the maximum voltage across the CCR by taking the
maximum input voltage less the voltage across the LED
string (Figures 8 and 9).
Figure 8.
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4
NSI45035JZ, NSV45035JZ
Figure 10.
Figure 9.
Higher Current LED Strings
Two or more fixed current CCRs can be connected in
parallel. The current through them is additive (Figure 10).
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5
NSI45035JZ, NSV45035JZ
Other Currents
LEDs on and off for a portion of a single cycle. This on/off
cycle is called the Duty cycle (D) and is expressed by the
amount of time the LEDs are on (Ton) divided by the total
time of an on/off cycle (Ts) (Figure 13).
The adjustable CCR can be placed in parallel with any
other CCR to obtain a desired current. The adjustable CCR
provides the ability to adjust the current as LED efficiency
increases to obtain the same light output (Figure 11).
Figure 13.
The current through the LEDs is constant during the period
they are turned on resulting in the light being consistent with
no shift in chromaticity (color). The brightness is in proportion
to the percentage of time that the LEDs are turned on.
Figure 14 is a typical response of Luminance vs Duty Cycle.
6000
ILLUMINANCE (lx)
5000
4000
Figure 11.
3000
Dimming using PWM
The dimming of an LED string can be easily achieved by
placing a BJT in series with the CCR (Figure 12).
2000
Lux
Linear
1000
0
0
10
20
30
40 50
60 70
DUTY CYCLE (%)
80
90 100
Figure 14. Luminous Emmitance vs. Duty Cycle
Reducing EMI
Designers creating circuits switching medium to high
currents need to be concerned about Electromagnetic
Interference (EMI). The LEDs and the CCR switch
extremely fast, less than 100 nanoseconds. To help eliminate
EMI, a capacitor can be added to the circuit across R2.
(Figure 12) This will cause the slope on the rising and falling
edge on the current through the circuit to be extended. The
slope of the CCR on/off current can be controlled by the
values of R1 and C1.
The selected delay / slope will impact the frequency that
is selected to operate the dimming circuit. The longer the
delay, the lower the frequency will be. The delay time should
not be less than a 10:1 ratio of the minimum on time. The
frequency is also impacted by the resolution and dimming
steps that are required. With a delay of 1.5 microseconds on
the rise and the fall edges, the minimum on time would be
30 microseconds. If the design called for a resolution of 100
dimming steps, then a total duty cycle time (Ts) of 3
milliseconds or a frequency of 333 Hz will be required.
Figure 12.
The method of pulsing the current through the LEDs is
known as Pulse Width Modulation (PWM) and has become
the preferred method of changing the light level. LEDs being
a silicon device, turn on and off rapidly in response to the
current through them being turned on and off. The switching
time is in the order of 100 nanoseconds, this equates to a
maximum frequency of 10 Mhz, and applications will
typically operate from a 100 Hz to 100 kHz. Below 100 Hz
the human eye will detect a flicker from the light emitted
from the LEDs. Between 500 Hz and 20 kHz the circuit may
generate audible sound. Dimming is achieved by turning the
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NSI45035JZ, NSV45035JZ
Thermal Considerations
P D(MAX) +
As power in the CCR increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and the ambient temperature
affect the rate of junction temperature rise for the part. When
the device has good thermal conductivity through the PCB,
the junction temperature will be relatively low with high
power applications. The maximum dissipation the device
can handle is given by:
T J(MAX) * T A
R qJA
Referring to the thermal table on page 2 the appropriate
RqJA for the circuit board can be selected.
AC Applications
The CCR is a DC device; however, it can be used with full
wave rectified AC as shown in application notes
AND8433/D and AND8492/D and design notes
DN05013/D and DN06065/D. Figure 15 shows the basic
circuit configuration.
Figure 15. Basic AC Application
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NSI45035JZ, NSV45035JZ
PACKAGE DIMENSIONS
SOT−223 (TO−261)
CASE 318E−04
ISSUE N
D
b1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
4
HE
1
2
3
b
e1
e
A1
C
q
A
0.08 (0003)
DIM
A
A1
b
b1
c
D
E
e
e1
L
L1
HE
E
MIN
1.50
0.02
0.60
2.90
0.24
6.30
3.30
2.20
0.85
0.20
1.50
6.70
0°
q
L
STYLE 2:
PIN 1.
2.
3.
4.
L1
MILLIMETERS
NOM
MAX
1.63
1.75
0.06
0.10
0.75
0.89
3.06
3.20
0.29
0.35
6.50
6.70
3.50
3.70
2.30
2.40
0.94
1.05
−−−
−−−
1.75
2.00
7.00
7.30
10°
−
MIN
0.060
0.001
0.024
0.115
0.009
0.249
0.130
0.087
0.033
0.008
0.060
0.264
0°
INCHES
NOM
0.064
0.002
0.030
0.121
0.012
0.256
0.138
0.091
0.037
−−−
0.069
0.276
−
MAX
0.068
0.004
0.035
0.126
0.014
0.263
0.145
0.094
0.041
−−−
0.078
0.287
10°
ANODE
CATHODE
NC
CATHODE
SOLDERING FOOTPRINT
3.8
0.15
2.0
0.079
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
1.5
0.059
SCALE 6:1
mm Ǔ
ǒinches
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NSI45035JZ/D