ADM1023 D

ADM1023
ACPI‐Compliant, High
Accuracy Microprocessor
System Temperature Monitor
The ADM1023 is a 2-channel digital thermometer and
under/overtemperature alarm for use in personal computers and other
systems requiring thermal monitoring and management. Optimized
for the Pentium III, the higher accuracy allows systems designers to
safely reduce temperature guard banding and increase system
performance. The device can measure the temperature of a
microprocessor using a diode-connected PNP transistor, which may be
provided on-chip with the Pentium III or similar processors; or it can
be a low-cost, discrete NPN/PNP device such as the 2N3904/2N3906.
A novel measurement technique cancels out the absolute value of the
transistor’s base emitter voltage so that no calibration is required. The
second measurement channel measures the output of an on-chip
temperature sensor to monitor the temperature of the device and its
environment.
The ADM1023 communicates over a 2-wire serial interface
compatible with SMBus standards. Under/overtemperature limits can
be programmed into the device over the serial bus, and an ALERT
output signals when the on-chip or remote temperature is out of range.
This output can be used as an interrupt or as an SMBus ALERT.
Features
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Next Generation Upgrade of ADM1021
On-Chip and Remote Temperature Sensing
Offset Registers for System Calibration
1C Accuracy and Resolution on Local Channel
0.125C Resolution/1C Accuracy on Remote Channel
Programmable Over/Undertemperature Limits
Programmable Conversion Rate
Supports System Management Bus (SMBus) ALERT
2-Wire SMBus Serial Interface
200 mA Max Operating Current (0.25 Conversions/Second)
1 mA Standby Current
3.0 V to 5.5 V Supply
Small 16-Lead QSOP Package
This is a Pb-Free Package*
Applications
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Desktop Computers
Notebook Computers
Smart Batteries
Industrial Controllers
Telecomm Equipment
Instrumentation
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QSOP 16
CASE 492
PIN ASSIGNMENT
NC
1
16 NC
VDD
2
15 STBY
D+
3
14 SCLK
D−
4
13 NC
NC
5
12 SDATA
ADD1
6
11
GND
7
10 ADD0
GND
8
9
ALERT
NC
ADM1023
(Top View)
MARKING DIAGRAM
1023A
RQZ
YYWWG
1023ARQZ
YY
WW
G
= Specific Device Code
= Year
= Work Week
= Pb-Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 15 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
April, 2012 − Rev. 10
1
Publication Order Number:
ADM1023/D
ADM1023
ADDRESS POINTER
REGISTER
ONE−SHOT
REGISTER
CONVERSION RATE
REGISTER
OFFSET
REGISTERS
ON−CHIP
TEMPERATURE
SENSOR
D+ 3
D– 4
LOCAL TEMPERATURE
VALUE REGISTER
A−TO−D
CONVERTER
ANALOG
MUX
BUSY
RUN/STANDBY
REMOTE TEMPERATURE
VALUE REGISTERS
LOCAL TEMPERATURE
LOW−LIMIT COMPARATOR
LOCAL TEMPERATURE
LOW−LIMIT REGISTER
LOCAL TEMPERATURE
HIGH−LIMIT COMPARATOR
LOCAL TEMPERATURE
HIGH−LIMIT REGISTER
REMOTE TEMPERATURE
LOW−LIMIT COMPARATOR
REMOTE TEMPERATURE
LOW−LIMIT REGISTERS
REMOTE TEMPERATURE
HIGH−LIMIT COMPARATOR
REMOTE TEMPERATURE
HIGH−LIMIT REGISTERS
CONFIGURATION
REGISTER
EXTERNAL DIODE OPEN−CIRCUIT
INTERRUPT
MASKING
STATUS REGISTER
ADM1023
15
STBY
11
ALERT
SMBus INTERFACE
1
2
5
7
8
9
13
16
12
14
10
6
NC
VDD
NC
GND
GND
NC
NC
NC
SDATA
SCLK
ADD0
ADD1
NC = NO CONNECT
Figure 1. Functional Block Diagram
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Unit
−0.3 to +6.0
V
−0.3 to VDD + 0.3
V
Positive Supply Voltage (VDD) to GND
D+, ADD0, ADD1
D− to GND
−0.3 to +0.6
SCLK, SDATA, ALERT, STBY
−0.3 to +6.0
V
50
mA
Input Current, D−
10
mA
ESD Rating, All Pins (Human Body Model)
2000
V
Continuous Power Dissipation
Up to 70C
Derating Above 70C
650
6.7
mW
mW/C
Operating Temperature Range
−55 to +125
C
150
C
−65 to +150
C
Lead Temperature, Soldering (10 s)
300
C
IR Reflow Peak Temperature
220
C
IR Reflow Peak Temperature for Pb-Free
260
C
Input Current
Maximum Junction Temperature (TJmax)
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
Table 2. THERMAL CHARACTERISTICS
Parameter
Rating
16-Lead QSOP Package
qJA = 105C/W, qJC = 39C/W
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ADM1023
Table 3. PIN ASSIGNMENT
Pin No.
Mnemonic
Description
1
NC
No Connect
2
VDD
Positive Supply, 3.0 V to 5.5 V
3
D+
Positive Connection to Remote Temperature Sensor
4
D−
Negative Connection to Remote Temperature Sensor
5
NC
No Connect
6
ADD1
Three-state Logic Input, Higher Bit of Device Address
7
GND
Supply 0 V Connection
8
GND
Supply 0 V Connection
9
NC
10
ADD0
Three-state Logic Input, Lower Bit of Device Address
11
ALERT
Open-drain Logic Output Used as Interrupt or SMBus ALERT
12
SDATA
Logic Input/Output, SMBus Serial Data. Open-drain Output
13
NC
14
SCLK
Logic Input, SMBus Serial Clock
15
STBY
Logic Input Selecting Normal Operation (High) or Standby Mode (Low)
16
NC
No Connect
No Connect
No Connect
Table 4. ELECTRICAL CHARACTERISTICS (TA = TMIN to TMAX, VDD = 3.0 V to 3.6 V, unless otherwise noted. (Note 1)
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
Power Supply and ADC
Temperature Resolution, Local Sensor
Guaranteed No Missed Codes
1.0
−
−
C
Temperature Resolution, Remote Sensor
Guaranteed No Missed Codes
0.125
−
−
C
Temperature Error, Local Sensor
TA = 60C to 100C
TA = 0C to 120C
−1.5
−3.0
0.5
1.0
+1.5
+3.0
C
Temperature Error, Remote Sensor
TA, TD = 60C to 100C (Note 2)
−1.0
−
+1.0
C
TA, TD = 0C to 120C (Note 2)
−3.0
−
+3.0
C
Relative Accuracy
TA = 60C to 100C
Supply Voltage Range (Note 3)
Undervoltage Lockout Threshold
VDD Input, Disables ADC, Rising Edge
Undervoltage Lockout Hysteresis
Power-on Reset Threshold
VDD, Falling Edge (Note 4)
POR Threshold Hysteresis
−
−
0.25
C
3.0
−
3.6
V
2.55
2.7
2.8
V
−
25
−
mV
0.9
1.7
2.2
V
−
50
−
mV
Standby Supply Current
VDD = 3.3 V, No SMBus Activity
SCLK at 10 kHz
−
−
1.0
4.0
5.0
−
mA
Average Operating Supply Current
0.25 Conversions/Sec Rate
−
130
200
mA
Autoconvert Mode, Averaged Over 4 Sec
2 Conversions/Sec Rate
−
225
370
mA
Conversion Time
From Stop Bit to Conversion Complete
(Both Channels) D+ Forced to D− + 0.65 V
65
115
170
ms
Remote Sensor Source Current
High Level (Note 4)
Low Level (Note 4)
120
7.0
205
12
300
16
mA
−
0.7
−
V
−
50
−
mA
D− Source Voltage
Address Pin Bias Current (ADD0, ADD1)
Momentary at Power-on Reset
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ADM1023
Table 4. ELECTRICAL CHARACTERISTICS (TA = TMIN to TMAX, VDD = 3.0 V to 3.6 V, unless otherwise noted. (Note 1)
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
SMBus Interface (See Figure 2)
Logic Input High Voltage, VIH
STBY, SCLK, SDATA
VDD = 3.0 V to 5.5 V
2.2
−
−
V
Logic Input Low Voltage, VIL
STBY, SCLK, SDATA
VDD = 3.0 V to 5.5 V
−
−
0.8
V
SMBus Output Low Sink Current
SDATA Forced to 0.6 V
6.0
−
−
mA
ALERT Output Low Sink Current
ALERT Forced to 0.4 V
1.0
−
−
mA
−1.0
−
+1.0
mA
−
5.0
−
pF
Logic Input Current, IIH, IIL
SMBus Input Capacitance, SCLK, SDATA
SMBus Clock Frequency
−
−
400
kHz
SMBus Clock Low Time, tLOW
tLOW between 10% Points
1.3
−
−
ms
SMBus Clock High Time, tHIGH
tHIGH between 90% Points
0.6
−
−
ms
0.6
−
−
ms
0.6
−
−
ms
SMBus Start Condition Setup Time,
tSU:STA
1.
2.
3.
4.
SMBus Start Condition Hold Time, tHD:STA
Time from 10% of SDATA to 90% of SCLK
SMBus Stop Condition Setup Time, tSU:STO
Time from 90% of SCLK to 10% of SDATA
0.6
−
−
ms
SMBus Data Valid to SCLK Rising Edge
Time, tSU:DAT
Time for 10% or 90% of SDATA to 10% of SCLK
100
−
−
ns
SMBus Bus Free Time, tBUF
Between Start/Stop Condition
1.3
−
−
ms
SCLK SDATA Rise Time, tR MAX
Master Clocking in Data
−
−
300
ns
SCLK SDATA Fall Time, tF MAX
VDD = 0 V
−
−
300
ns
TMAX = 120C, TMIN = 0C
TD is the temperature of the remote thermal diode; TA, TD = 60C to 100C
Operation at VDD = 5.0 V guaranteed by design; not production tested
Guranteed by design; not production tested
tR
tLOW
tHD;STA
tF
SCL
tHD;STA
tHD;DAT
tHIGH
tSU;STA
tSU;DAT
tSU;STO
SDA
P
tBUF
S
S
Figure 2. Diagram for Serial Bus Timing
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P
ADM1023
TYPICAL PERFORMANCE CHARACTERISTICS
5
20
15
D+ TO GND
4
TEMPERATURE ERROR (5C)
TEMPERATURE ERROR (5C)
10
5
0
–5
–10
D+ TO VDD
–15
–20
250mV p−p REMOTE
3
2
100mV p−p REMOTE
1
–25
–30
1
10
LEAKAGE RESISTANCE (M)
0
100
100
Figure 3. Temperature Error vs. Resistance from
Track to VDD and GND
1k
10k
100k
1M
FREQUENCY (Hz)
10M
100M
Figure 4. Remote Temperature Error vs. Supply
Noise Frequency
9
3
100mV p−p
8
TEMPERATURE ERROR (5C)
TEMPERATURE ERROR (5C)
2
7
6
5
4
3
50mV p−p
2
UPPER SPEC LEVEL
1
0
–1
LOWER SPEC LEVEL
–2
1
0
25mV p−p
1
10
100
1k
10k
100k
FREQUENCY (Hz)
1M
10M
–3
50
100M
70
80
90
100
TEMPERATURE (5C)
110
120
Figure 6. Temperature Error of ADM1023 vs.
Pentium III Temperature
14
70
12
60
10
SUPPLY CURRENT (A)
TEMPERATURE ERROR (5C)
Figure 5. Temperature Error vs. Common-mode
Noise Frequency
60
8
6
4
2
50
40
VDD = 3.3V
30
20
10
0
VDD = 5V
–2
2
4
6
8
10
12
14
16
CAPACITANCE (nF)
18
20
22
0
24
Figure 7. Temperature Error vs. Capacitance
Between D+ and D−
1
5
10
25
50
75
100 250
SCLK FREQUENCY (kHz)
500
750
Figure 8. Standby Supply Current vs.
SCLK Frequency
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5
1000
ADM1023
TYPICAL PERFORMANCE CHARACTERISTICS
4
550
450
3
SUPPLY CURRENT (A)
TEMPERATURE ERROR (5C)
500
10mV p−p
2
1
400
350
300
250
200
3.3V
150
100
0
100k
1M
10M
FREQUENCY (Hz)
100M
5V
50
0.0625
1G
Figure 9. Temperature Error vs. Differential-mode
Noise Frequency
0.1250
0.2500 0.5000 1.0000 2.0000
CONVERSION RATE (Hz)
4.0000
8.0000
Figure 10. Operating Supply Current vs.
Conversion Rate, VDD = 5.0 V and 3.3 V
100
125
REMOTE
TEMPERATURE
100
60
TEMPERATURE (5C)
SUPPLY CURRENT (A)
80
40
20
50
25
0
−20
INT
TEMPERATURE
75
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
SUPPLY VOLTAGE (V)
4.0
4.5
0
5.0
Figure 11. Standby Supply Current vs.
Supply Voltage
0
1
2
3
4
5
6
TIME (Seconds)
7
8
9
Figure 12. Response to Thermal Shock
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ADM1023
Theory of Operation
on-chip limit registers. As with the measured value, the local
temperature limits are stored as 8-bit values and the remote
temperature limits as 11-bit values. Out-of-limit
comparisons generate flags that are stored in the status
register, and one or more out-of-limit results cause the
ALERT output to pull low.
Registers can be programmed, and the device controlled
and configured, via the serial system management bus
(SMBus). The contents of any register can also be read back
via the SMBus.
Control and configuration functions consist of:
 Switching the Device between Normal Operation and
Standby Mode
 Masking or Enabling the ALERT Output
 Selecting the Conversion Rate
Functional Description
The ADM1023 contains a two-channel analog-to-digital
converter (ADC) with special input-signal conditioning to
enable operation with remote and on-chip diode temperature
sensors. When the ADM1023 is operating normally, the
ADC operates in a free-running mode. The analog input
multiplexer alternately selects either the on-chip
temperature sensor to measure its local temperature or the
remote temperature sensor. These signals are digitized by
the ADC, and the results are stored in the local and remote
temperature value registers. Only the eight most significant
bits (MSBs) of the local temperature value are stored as an
8-bit binary word. The remote temperature value is stored as
an 11−bit binary word in two registers. The eight MSBs are
stored in the remote temperature value high byte register at
Address 0x01. The three least significant bits (LSBs) are
stored, left justified, in the remote temperature value low
byte register at Address 0x10.
Error sources such as PCB track resistance and clock noise
can introduce offset errors into measurements on the remote
channel. To achieve the specified accuracy on this channel,
these offsets must be removed, and two offset registers are
provided for this purpose at Address 0x11 and Address
0x12.
An offset value may automatically be added to or
subtracted from the measurement by writing an 11-bit, twos
complement value to Register 0x11 (high byte) and Register
0x12 (low byte, left-justified).
The offset registers default to 0 at powerup and have no
effect if nothing is written to them.
The measurement results are compared with local and
remote, high and low temperature limits, stored in six
I
NyI
On initial powerup, the remote and local temperature
values default to −128C. The device normally powers up
converting, making a measure of local and remote
temperature. These values are then stored before making a
comparison with the stored limits. However, if the part is
powered up in standby mode (STBY pin pulled low), no new
values are written to the register before a comparison is
made. As a result, both RLOW and LLOW are tripped in the
status register, thus generating an ALERT output. This may
be cleared in one of two ways:
 Change both the local and remote lower limits to
–128C and read the status register (which in turn
clears the ALERT output).
 Take the part out of standby and read the status register
(which in turn clears the ALERT output). This works
only when the measured values are within the limit
values.
VDD
IBIAS
D+
REMOTE
SENSING
TRANSISTOR
VOUT+
C11
D–
TO ADC
BIAS
DIODE
LOW−PASS FILTER
fC = 65kHz
VOUT–
1CAPACITOR
C1 IS OPTIONAL. IT IS ONLY NECESSARY IN NOISY ENVIRONMENTS.
C1 = 1000pF MAX.
Figure 13. Input Signal Conditioning
Measurement Method
This technique, however, requires calibration to nullify
the effect of the absolute value of VBE, which varies from
device to device.
The technique used in the ADM1023 is to measure the
change in VBE when the device is operated at two different
collector currents.
A simple method of measuring temperature is to exploit
the negative temperature coefficient of a diode, or the base
emitter voltage of a transistor, operating at constant current.
Thus, the temperature may be obtained from a direct
measurement of VBE where:
V BE + nKT
q
1n
ǒICǓ
IS
(eq. 1)
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ADM1023
This is given by:
DV BE + nKT
q
1n (N)
ADM1023 is optimized for nTYPICAL = 1.008; any deviation
on n from this typical value causes a temperature error that is
calculated below for the nMIN and nMAX of a Pentium III
processor at TTD = 100C.
(eq. 2)
where:
K is Boltzmann’s constant.
q is the charge on the electron (1.6  10–19 Coulombs).
T is the absolute temperature in Kelvins.
N is the ratio of the two collector currents.
n is the ideality factor of the thermal diode (TD).
DT MIN + 1.0057 * 1.008
1.008
+ * 0.85° C
ǒ273.15 Kelvin ) 100° CǓ +
+ ) 1.67° C
Thus, the temperature error due to variation on n of the
thermal diode for a Pentium III processor is about 2.5C.
In general, this additional temperature error of the thermal
diode measurement due to deviations on n from its typical
value is given by:
DT + n * 1.008
1.008
ǒ273.15 Kelvin ) TTDǓ
(eq. 5)
where TTD is in C.
Beta of Thermal Transistor (b)
In Figure 13, the thermal diode is a substrate PNP
transistor where the emitter current is forced into the device.
The derivation of Equation 2 assumed that the collector
currents were scaled by N as the emitter currents were also
scaled by N. Thus, this assumes that beta (b) of the transistor
is constant for various collector currents. Figure 14 shows
typical b variation vs. collector current for Pentium III
processors at 100C. The maximum b is 4.5 and varies less
than 1% over the collector current range from 7 mA to
300 mA.
bMAX < 4.5
IE
nb
Sources of Errors on Thermal Transistors
Measurement Method; The Effect of Ideality Factor (n)
b
The effects of ideality factor (n) and beta (b) of the
temperature measured by a thermal transistor are described in
this section. For a thermal transistor implemented on a
submicron process, such as the substrate PNP used on a
Pentium III processor, the temperature errors due to the
combined effect of the ideality factor and beta are shown to
be less than 3C. Equation 2 is optimized for a substrate PNP
transistor (used as a thermal diode) usually found on CPUs
designed on submicron CMOS processes such as the Pentium
III processor. There is a thermal diode on board each of these
processors. The n in Equation 2 represents the ideality factor
of this thermal diode. This ideality factor is a measure of the
deviation of the thermal diode from ideal behavior.
According to Pentium III processor manufacturing
specifications, measured values of n at 100C are:
+ 1.0125
(eq. 4)
DT MAX + 1.0125 * 1.008
1.008
To measure DVBE, the sensor is switched between
operating currents of I and NI. The resulting waveform is
passed through a low-pass filter to remove noise, then to a
chopper-stabilized amplifier that performs the functions of
amplification and rectification of the waveform to produce
a dc voltage proportional to DVBE. This voltage is measured
by the ADC, which gives a temperature output in binary
format. To further reduce the effects of noise, digital filtering
is performed by averaging the results of 16 measurement
cycles. Signal conditioning and measurement of the internal
temperature sensor are performed in a similar manner.
Figure 13 shows the input signal conditioning used to
measure the output of an external temperature sensor. This
figure shows the external sensor as a substrate PNP
transistor, provided for temperature monitoring on some
microprocessors, but it could equally well be a discrete
transistor. If a discrete transistor is used, the collector is not
grounded and should be connected to the base. To prevent
ground noise from interfering with the measurement, the
more negative terminal of the sensor is not referenced to
ground but is biased above ground by an internal diode at the
D− input. If the sensor is operating in a noisy environment,
C1 may optionally be added as a noise filter. Its value is
1000 pF maximum. See the Layout Considerations section
for more information on C1.
n MIN + 1.0057 t n TYPICAL + 1.008 t n MAX +
ǒ273.15 Kelvin ) 100° CǓ +
IC =
7
300
b
b+1
IE
IC (mA)
Figure 14. Variation of b with Collector Currents
Expressing the collector current in terms of the emitter
current.
I C + I E ƪbń(b ) 1)]
(eq. 6)
where:
bǒ300 mAǓ + bǒ7 mAǓ(1 ) e)
(eq. 7)
e + D bńb and b + b(7mA)
Rewriting the equation for DVBE, to include the ideality
factor, n, and beta, b yields:
DV BE + nKT
q
(eq. 3)
ƪ
1n
(1 ) e) ǒb ) 1Ǔ
(1 ) e ) b ) 1
N
ƫ
(eq. 8)
All b variations of less than 1% (e < 0.01) contribute to
temperature errors of less than 0.4C.
The ADM1023 takes this ideality factor into consideration
when calculating temperature TTD of the thermal diode. The
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ADM1023
Temperature Data Format
Register Functions
One LSB of the ADC corresponds to 0.125C, so the
ADM1023 can measure from 0C to 127.875C. The
temperature data format and extended temperature
resolution are shown in Table 5 and Table 6.
The ADM1023 contains registers that are used to store the
results of remote and local temperature measurements and
high and low temperature limits, and to configure and
control the device. A description of these registers follows,
and further details are given in Table 7 to Table 11. Most of
the registers for the ADM1023 are dual-port and have
different addresses for read and write operations.
Attempting to write to a read address or to read from a write
address produces an invalid result. Register addresses above
0x14 are reserved for future use or factory test purposes and
should not be written to.
Table 5. TEMPERATURE DATA FORMAT
(LOCAL AND REMOTE TEMPERATURE HIGH BYTE)
Temperature (5C) (Note 1)
Digital Output
0
0 000 0000
1
0 000 0001
10
0 000 1010
25
0 001 1001
Address Pointer Register
50
0 011 0010
75
0 100 1011
100
0 110 0100
125
0 111 1101
127
0 111 1111
The address pointer register does not have, nor does it
require, an address, because it is the register to which the
first data byte of every write operation is automatically
written. This data byte is an address pointer that sets up one
of the other registers for the second byte of the write
operation or for a subsequent read operation.
1. The ADM1023 differs from the ADM1021 in that the temperature
resolution of the remote channel is improved from 1C to
0.125C, but it cannot measure temperatures below 0C. If
negative temperature measurement is required, the ADM1021
should be used.
Value Registers
The ADM1023 has three registers to store the results of
local and remote temperature measurements. These
registers are written to by the ADC and can only be read over
the SMBus.
The results of the local and remote temperature
measurements are stored in the local and remote temperature
value registers and are compared with limits programmed
into the local and remote high and low limit registers.
The Offset Register
Two offset registers are provided at Address 0x11 and
Address 0x12. These are provided so that the user may
remove errors from the measured values of remote
temperature. These errors may be introduced by clock noise
and PCB track resistance. See Table 8 for an example of
offset values.
The offset value is stored as an 11-bit, twos complement
value in Register 0x11 (high byte) and Register 0x12 (low
byte, left justified). The value of the offset is negative if the
MSB of Register 0x11 is 1, and it is positive if the MSB of
Register 0x11 is 0. This value is added to the remote
temperature. These registers default to 0 at powerup and
have no effect if nothing is written to them. The offset
register can accept values from −128.875C to +127.875C.
The ADM1023 detects overflow so the remote temperature
value register does not wrap around +127C or −128C.
Table 6. EXTENDED TEMPERATURE RESOLUTION
(REMOTE TEMPERATURE LOW BYTE)
Extended Resolution (5C)
Temperature Low Bits
0.000
0000 0000
0.125
0010 0000
0.250
0100 0000
0.375
0110 0000
0.500
1000 0000
0.625
1010 0000
0.750
1100 0000
0.875
1110 0000
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9
ADM1023
Table 7. LIST OF ADM1023 REGISTERS
Read Address (Hex)
Write Address (Hex)
Not Applicable
Not Applicable
Address Pointer
Name
Undefined
Power-on Default
00
Not Applicable
Local Temperature Value
1000 0000 (0x80) (−128C)
01
Not Applicable
Remote Temperature Value High Byte
1000 0000 (0x80) (−128C)
02
Not Applicable
Status
Undefined
03
09
Configuration
0000 0000 (0x00)
04
0A
Conversion Rate
0000 0010 (0x02)
05
0B
Local Temperature High Limit
0111 1111 (0x7F) (+127C)
06
0C
Local Temperature Low Limit
1100 1001 (0xC9) (−55C)
07
0D
Remote Temperature High Limit High Byte
0111 1111 (0x7F) (+127C)
Remote Temperature Low Limit High Byte
1100 1001 (0xC9) (−55C)
08
0E
Not Applicable
0F (Note 1)
10
Not Applicable
Remote Temperature Value Low Byte
0000 0000
One-shot
11
11
Remote Temperature Offset High Byte
0000 0000
12
12
Remote Temperature Offset Low Byte
0000 0000
13
13
Remote Temperature High Limit Low Byte
0000 0000
14
14
Remote Temperature Low Limit Low Byte
0000 0000
19
Not Applicable
Reserved
0000 0000
20
21
Reserved
Undefined
FE
Not Applicable
Manufacturer Device ID
0100 0001 (0x41)
FF
Not Applicable
Die Revision Code
0011 xxxx (0x3x)
1. Writing to Address 0F causes the ADM1023 to perform a single measurement. It is not a data register as such; thus, it does not matter what
data is written to it.
Table 8. OFFSET VALUES
Offset Registers
Remote Temperature
0x11
0x12
Offset Value
With Offset
Without Offset
1111 1100
0000 0000
−4C
14C
18C
1111 1111
0000 0000
−1C
17C
18C
1111 1111
1110 0000
−0.125C
17.875C
18C
0000 0000
0000 0000
0C
18C
18C
0000 0000
0010 0000
+0.125C
18.125C
18C
0000 0001
0000 0000
+1C
19C
18C
0000 0100
0000 0000
+4C
22C
18C
Status Register
Reading the status register clears the five flag bits,
provided the error conditions that caused the flags to be set
have gone away. While a limit comparator is tripped due to
a value register containing an out-of-limit measurement or
the sensor is open-circuit, the corresponding flag bit cannot
be reset. A flag bit can be reset only if the corresponding
value register contains an in-limit measurement, or the
sensor is good.
The ALERT interrupt latch is not reset by reading the
status register, but it resets when the ALERT output has been
serviced by the master reading the device address, provided
the error condition has gone away and the status register flag
bits have been reset.
Bit 7 of the status register (see Table 9) indicates that the
ADC is busy converting when it is high. Bit 6 to Bit 3 are
flags indicating the results of the limit comparisons.
If the local and/or remote temperature measurement is
above the corresponding high temperature limit or below the
corresponding low temperature limit, one or more of these
flags will be set. Bit 2 is a flag that is set if the remote
temperature sensor is open-circuit. These five flags are
NOR’d together, so that if any of them are high, the ALERT
interrupt latch is set, and the ALERT output goes low.
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ADM1023
Table 9. STATUS REGISTER BIT ASSIGNMENTS
Bit
Name
7
BUSY
6
LHIGH*
Table 11. CONVERSION RATE REGISTER CODE
Function
Data
Conversion/Sec
Average Supply Current
mA Typ at VCC = 3.3 V
At 1 when local high temp limit tripped
0x00
0.0625
150
0.125
150
At 1 when ADC converting
5
LLOW*
At 1 when local low temp limit tripped
0x01
4
RHIGH*
At 1 when remote high temp limit tripped
0x02
0.25
150
0.5
150
3
RLOW*
At 1 when remote low temp limit tripped
0x03
2
OPEN*
At 1 when remote sensor open-circuit
0x04
1
150
0x05
2
150
0x06
4
160
0x07
8
180
0x08 to
0xFF
Reserved
1 to 0
Reserved
*These flags stay high until the status register is read or they are
reset by POR.
Configuration Register
Two bits of the configuration register are used. If Bit 6 is 0,
which is the power-on default, the device is in operating
mode with the ADC converting (see Table 10). If Bit 6 is set
to 1, the device is in standby mode and the ADC does not
convert. Standby mode can also be selected by taking the
STBY pin low. In standby mode, the values of remote and
local temperature remain at the value they were before the
part was placed in standby mode.
Bit 7 of the configuration register is used to mask the
ALERT output. If Bit 7 is 0, which is the power-on default,
the ALERT output is enabled. If Bit 7 is set to 1, the ALERT
output is disabled.
Limit Registers
The ADM1023 has six limit registers to store local and
remote, high and low temperature limits. These registers can
be written to and read back over the SMBus. The high limit
registers perform a > comparison, while the low limit
registers perform a < comparison. For example, if the high
limit register is programmed as a limit of 80C, measuring
81C results in an alarm condition. Even though the
temperature range is 0 to 127C, it is possible to program the
limit register with negative values. This is for
backward-compatibility with the ADM1021.
Table 10. CONFIGURATION REGISTER BIT
ASSIGNMENTS
One−Shot Register
Bit
Name
Function
7
MASK1
0 = ALERT Enabled
1 = ALERT Masked
0
6
RUN/STOP
0 = Run
1 = Standby
0
The one-shot register is used to initiate a single conversion
and comparison cycle when the ADM1023 is in standby
mode, after which the device returns to standby. This is not
a data register as such, and it is the write operation that
causes the one-shot conversion. The data written to this
address is irrelevant and is not stored.
Reserved
0
Serial Bus Interface
5 to 0
Power-on
Default
Control of the ADM1023 is carried out via the serial bus.
The ADM1023 is connected to this bus as a slave device,
under the control of a master device. Note that the SMBus
SDA and SCLK pins are three-stated when the ADM1023
is powered down, and they do not pull down the SMBus.
Conversion Rate Register
The lowest three bits of this register are used to program
the conversion rate by dividing the ADC clock by 1, 2, 4, 8,
16, 32, 64, or 128, to give conversion times from 125 ms
(Code 0x07) to 16 seconds (Code 0x00). This register can be
written to and read back over the SMBus. The higher five
bits of this register are unused and must be set to 0. Use of
slower conversion times greatly reduces the device’s power
consumption, as shown in Table 11.
Address Pins
In general, every SMBus device has a 7-bit device address
(except for some devices that have extended, 10-bit
addresses). When the master device sends a device address
over the bus, the slave device with that address responds.
The ADM1023 has two address pins, ADD0 and ADD1, to
allow selection of the device address, so that several
ADM1023s can be used on the same bus and to avoid
conflict with other devices. Although only two address pins
are provided, these pins are three-state and can be grounded,
left unconnected, or tied to VDD, so that a total of nine
different addresses are possible, as shown in Table 12.
Note that the state of the address pins is sampled only at
powerup, so changing them after powerup has no effect.
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ADM1023
line low during the low period before the ninth
clock pulse, known as the Acknowledge bit. All
other devices on the bus remain idle while the
selected device waits for data to be read from or
written to it. If the R/W bit is 0, the master writes
to the slave device. If the R/W bit is 1, the master
reads from the slave device.
2. Data is sent over the serial bus in sequences of
nine clock pulses, 8 bits of data followed by an
Acknowledge bit from the slave device.
Transitions on the data line must occur during the
low period of the clock signal and remain stable
during the high period, because a low-to-high
transition when the clock is high may be
interpreted as a stop signal. The number of data
bytes that can be transmitted over the serial bus in
a single read or write operation is limited only by
what the master and slave devices can handle.
3. When all data bytes have been read or written,
stop conditions are established. In write mode, the
master pulls the data line high during the 10th
clock pulse to assert a stop condition. In read
mode, the master device overrides the
Acknowledge bit by pulling the data line high
during the low period before the ninth clock pulse.
This is known as No Acknowledge. The master
then takes the data line low during the low period
before the 10th clock pulse, then high during the
10th clock pulse to assert a stop condition.
Table 12. DEVICE ADDRESSES (Note 1)
ADD0
ADD1
Device Address
0
0
0011 000
0
NC
0011 001
0
1
0011 010
NC
0
0101 001
NC
NC
0101 010
NC
1
0101 011
1
0
1001 100
1
NC
1001 101
1
1
1001 110
1. ADD0 and ADD1 are sampled at powerup only.
The serial bus protocol operates as follows:
1. The master initiates data transfer by establishing a
start condition, defined as a high-to-low transition
on the serial data line, SDATA, while the serial
clock line, SCLK, remains high. This indicates
that an address/data stream will follow. All slave
peripherals connected to the serial bus respond to
the start condition and shift in the next 8 bits.
These bits consist of a 7-bit address (MSB first)
plus an R/W bit, which determines the direction of
the data transfer, that is, whether data is written to,
or read from, the slave device.
The peripheral whose address corresponds to the
transmitted address responds by pulling the data
1
9
1
9
SCLK
0
SDATA
1
0
1
1
A0
A1
D6
D7
R/W
START BY
MASTER
D4
D5
D2
D3
D1
D0
ACK. BY
ADM1023
FRAME 1
SERIAL BUS ADDRESS BYTE
ACK. BY
ADM1023
FRAME 2
ADDRESS POINTER REGISTER BYTE
1
9
SCLK (CONTINUED)
D7
SDATA (CONTINUED)
D4
D5
D6
D2
D3
D1
D0
ACK. BY
ADM1023
FRAME 3
DATA BYTE
STOP BY
MASTER
Figure 15. Writing a Register Address to the Address Pointer Register,
then Writing Data to the Selected Register
1
9
9
1
SCLK
SDATA
0
1
0
1
1
A1
START BY
MASTER
A0
D7
R/W
D6
D5
D4
D3
D2
D1
FRAME 2
ADDRESS POINTER REGISTER BYTE
FRAME 1
SERIAL BUS ADDRESS BYTE
Figure 16. Writing to the Address Pointer Register Only
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12
D0
ACK. BY
ADM1023
ACK. BY
ADM1023
STOP BY
MASTER
ADM1023
9
1
9
1
SCLK
SDATA
START BY
MASTER
A6
A5
A4
A3
A2
A1
A0
FRAME 1
SERIAL BUS ADDRESS BYTE
R/W
D7
D6
ACK. BY
ADM1023
D4
D5
D3
D2
D1
D0
STOP BY
NO ACK.
BY MASTER MASTER
FRAME 2
DATA BYTE FROM ADM1023
Figure 17. Reading Data from a Previously Selected Register
Any number of bytes of data may be transferred over the
serial bus in one operation, but it is not possible to mix read
and write in one operation because the type of operation is
determined at the beginning and cannot subsequently be
changed without starting a new operation.
For the ADM1023, write operations contain either one or
two bytes, while read operations contain one byte and
perform the following functions:
To write data to one of the device data registers or read
data from it, the address pointer register must be set so that
the correct data register is addressed. Data can then be
written into that register or read from it. The first byte of a
write operation always contains a valid address that is stored
in the address pointer register. If data is to be written to the
device, the write operation contains a second data byte that
is written to the register selected by the address pointer
register.
This is illustrated in Figure 15. The device address is sent
over the bus followed by R/W set to 0. This is followed by
two data bytes. The first data byte is the address of the
internal data register to be written to, which is stored in the
address pointer register. The second data byte is the data to
be written to the internal data register.
When reading data from a register, there are two
possibilities:
1. If the ADM1023’s address pointer register value is
unknown or not the desired value, it is necessary
to set it to the correct value before data can be read
from the desired data register. This is done by
performing a write to the ADM1023 as before, but
only the data byte containing the register read
address is sent, as data is not to be written to the
register. This is shown in Figure 16.
A read operation is then performed consisting of
the serial bus address, R/W bit set to 1, followed
by the data byte read from the data register. This is
shown in Figure 17.
2. If the address pointer register is known to be at the
desired address already, data can be read from the
corresponding data register without first writing to
the address pointer register.
NOTES:
 It is possible to read a data byte from a data register
without first writing to the address pointer register.
However, it is not possible to write data to a register

without writing to the address pointer register even if
the address pointer register is already at the correct
value. This is because the first data byte of a write is
always written to the address pointer register.
Do not forget that ADM1023 registers have different
addresses for read and write operations. The write
address of a register must be written to the address
pointer if data is to be written to that register, but it is
not possible to read data from that address. The read
address of a register must be written to the address
pointer before data can be read from that register.
ALERT Output
The ALERT output goes low whenever an out-of-limit
measurement is detected or if the remote temperature sensor
is open-circuit. It is an open drain and requires a 10 kW
pull-up to VDD. Several ALERT outputs can be
wire-AND’ed together, so that the common line goes low if
one or more of the ALERT outputs goes low.
The ALERT output can be used as an interrupt signal to a
processor, or it may be used as an SMBALERT. Slave
devices on the SMBus normally cannot signal to the master
that they want to talk, but the SMBALERT function allows
them to do so.
One or more ALERT outputs are connected to a common
SMBALERT line connected to the master. When the
SMBALERT line is pulled low by one of the devices, the
procedure shown in Figure 18 occurs.
MASTER
RECEIVES
SMBALERT
START
ALERT RESPONSE
ADDRESS
MASTER SENDS
ARA AND READ
COMMAND
RD ACK
DEVICE
ADDRESS
NO
STOP
ACK
DEVICE SENDS
ITS ADDRESS
Figure 18. Use of SMBALERT
SMBALERT Process
1. SMBALERT pulled low.
2. Master initiates a read operation and sends the
alert response address (ARA = 0001 100). This is
a general call address that must not be used as a
specific device address.
3. The device whose ALERT output is low responds
to the ARA and the master reads its device
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ADM1023
Applications
address. The address of the device is now known,
and it can be interrogated in the usual way.
4. If more than one device’s ALERT output is low,
the one with the lowest device address has priority,
in accordance with normal SMBus arbitration.
5. Once the ADM1023 has responded to the ARA, it
resets its ALERT output, provided that the error
condition that caused the ALERT no longer exists.
If the SMBALERT line remains low, the master
sends ARA again, and so on until all devices
whose ALERT outputs were low have responded.
Factors Affecting Accuracy, Remote Sensing Diode
The ADM1023 is designed to work with substrate
transistors built into processors or with discrete transistors.
Substrate transistors are generally PNP types with the
collector connected to the substrate. Discrete types can be
either PNP or NPN, connected as a diode (base-shorted to
collector). If an NPN transistor is used, the collector and
base are connected to D+ and the emitter to D−. If a PNP
transistor is used, the collector and base are connected to D−
and the emitter to D+.
The user has no choice with substrate transistors, but if a
discrete transistor is used, the best accuracy is achieved by
choosing devices according to the following criteria:
 Base Emitter Voltage Greater than 0.25 V at 6 mA, at
the Highest Operating Temperature
 Base Emitter Voltage Less than 0.95 V at 100 mA, at the
Lowest Operating Temperature
 Base Resistance Less than 100 W
 Small Variation in hfe (Approximately 50 to 150),
which Indicates Tight Control of VBE Characteristics
Low Power Standby Modes
The ADM1023 can be put into a low power standby mode
using hardware or software, that is, by taking the STBY
input low or by setting Bit 6 of the configuration register.
When STBY is high or Bit 6 is low, the ADM1023 operates
normally. When STBY is pulled low or Bit 6 is high, the
ADC is inhibited, and any conversion in progress is
terminated without writing the result to the corresponding
value register.
The SMBus is still enabled. Power consumption in the
standby mode is reduced to less than 10 mA if there is no
SMBus activity, or 100 mA if there are clock and data signals
on the bus.
These two modes are similar but not identical. When
STBY is low, conversions are completely inhibited. When
Bit 6 is set, but STBY is high, a one-shot conversion of both
channels can be initiated by writing any data value to the
one-shot register (Address 0x0F).
Transistors such as 2N3904, 2N3906, or equivalents in
SOT−23 packages are suitable devices to use.
Thermal Inertia and Self-heating
Accuracy depends on the temperature of the remote
sensing diode and/or the internal temperature sensor being
at the same temperature as that being measured, and a
number of factors can affect this. Ideally, the sensor should
be in good thermal contact with the part of the system being
measured, such as the processor, for example. If it is not in
good thermal contact, the thermal inertia caused by the mass
of the sensor causes a lag in the response of the sensor to a
temperature change. With the remote sensor, this should not
be a problem, as it will be either a substrate transistor in the
processor or a small package device, such as SOT−23,
placed in close proximity to it.
The on-chip sensor, however, is often remote from the
processor and monitors only the general ambient
temperature around the package. The thermal time constant
of the QSOP−16 package is about 10 seconds.
In practice, the package has electrical, and hence thermal,
connection to the printed circuit board. Therefore, the
temperature rise due to self-heating is negligible.
Sensor Fault Detection
The ADM1023 has a fault detector at the D+ input that
detects if the external sensor diode is open-circuit. This is a
simple voltage comparator that trips if the voltage at D+
exceeds VCC – 1.0 V (typical). The output of this
comparator is checked when a conversion is initiated and
sets Bit 2 of the status register if a fault is detected.
If the remote sensor voltage falls below the normal
measuring range, for example, due to the diode being
short-circuited, the ADC outputs –128C (1000 0000 000).
Because the normal operating temperature range of the
device extends only down to 0C, this output code is never
seen in normal operation and can be interpreted as a fault
condition.
In this respect, the ADM1023 differs from, and improves
upon, competitive devices that output 0 if the external sensor
goes short-circuit. Unlike the ADM1023, these other
devices can misinterpret a genuine 0C measurement as a
fault condition.
If the external diode channel is not being used and is
shorted out, the resulting ALERT may be cleared by writing
0x80 (−128C) to the low limit register.
Layout Considerations
Digital boards can be electrically noisy environments, and
the ADM1023 is measuring very small voltages from the
remote sensor; therefore, care must be taken to minimize
noise induced at the sensor inputs. The following
precautions are needed:
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ADM1023
can affect the measurement. When using long cables, the
filter capacitor may be reduced or removed.
Cable resistance can also introduce errors. A 1 W series
resistance introduces about 1C error.
 Place the ADM1023 as close as possible to the remote


sensing diode. Provided that the worst noise sources,
such as clock generators, data/address buses, and CRTs,
are avoided, this distance can be 4 to 8 inches.
Route the D+ and D− tracks close together, in parallel,
with grounded guard tracks on each side. Provide a
ground plane under the tracks if possible (see Figure 19).
Use wide tracks to minimize inductance and reduce
noise pickup. 10 mil track minimum width and spacing
is recommended.
Application Circuits
Figure 20 shows a typical application circuit for the
ADM1023, using a discrete sensor transistor connected via
a shielded, twisted-pair cable. The pullups on SCLK,
SDATA, and ALERT are required only if they are not
already provided elsewhere in the system.
10MIL
GND
D+
VDD
10MIL
ADM1023
10MIL
D+
1000pF
10MIL
D–
2N3904
10MIL
3V
TO 5.5V
10k 10k 10k
IN
D–
I/O
SHIELD
OUT
ALERT
10MIL
GND
TO
CONTROL
CHIP
SET TO
REQUIRED
ADDRESS
ADD0
10MIL
GND
0.1F
ADD1
Figure 19. Arrangement of Signal Tracks
 Try to minimize the number of copper/solder joints,


The SCLK and SDATA pins of the ADM1023 can be
interfaced directly to the SMBus of an I/O chip. Figure 21
shows how the ADM1023 might be integrated into a system
using this type of I/O controller.
D–
ADM1023
PROCESSOR
SCLK
SDATA
D+
ALERT

Figure 20. Typical Application Circuit
which can cause thermocouple effects. Where
copper/solder joints are used, make sure that they are in
both the D+ and D− path and at the same temperature.
Thermocouple effects should not be a major problem as
1C corresponds to about 240 mV, and thermocouple
voltages are about 3 mV/C of temperature difference.
Unless there are two thermocouples with a big
temperature differential between them, thermocouple
voltages should be much less than 240 mV.
Place a 0.1 mF bypass capacitor close to the VDD pin
and 1000 pF input filter capacitors across D+, D− close
to the ADM1023.
If the distance to the remote sensor is more than 8
inches, the use of twisted pair cable is recommended.
This is effective up to approximately 6 to 12 feet.
For longer distances (up to 100 feet), use shielded,
twisted-pair cable such as Belden #8451 microphone
cable. Connect the twisted pair to D+ and D−, and
connect the shield to GND close to the ADM1023.
Leave the remote end of the shield unconnected to
avoid ground loops.
SYSTEM BUS
DISPLAY
SYSTEM
MEMORY
GMCH
DISPLAY
CACHE
HARD
CD ROM DISK
2 IDE PORTS
PCI SLOTS
ICH I/O
CONTROLLER
HUB
PCI BUS
SUPER I/O
SMBUS
USB USB
2 USB PORTS
Because the measurement technique uses switched
current sources, excessive cable and/or filter capacitance
FWH
(FIRMWARE
HUB)
Figure 21. System Using ADM1023 and I/O Controller
Table 13. ORDERING INFORMATION
Device Number
ADM1023ARQZ−REEL
Temperature Range
Package Type
Package Option
Shipping†
0C to +120C
16−Lead QSOP
RQ−16
2,500 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*The “Z’’ suffix indicates Pb-Free part.
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ADM1023
PACKAGE DIMENSIONS
QSOP16
CASE 492−01
ISSUE A
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH,
PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.005 PER SIDE. DIMENSION E1 DOES NOT
INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT
EXCEED 0.005 PER SIDE. D AND E1 ARE
DETERMINED AT DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
0.20 C D
D
16
L2
D
A
9
GAUGE
PLANE
SEATING
PLANE
E
E1
C
L
C
DETAIL A
2X
2X 10 TIPS
0.20 C D
1
8
16X
e
B
A2
0.10 C
0.10 C
16X
b
0.25
A1
C
0.25 C D
M
DIM
A
A1
A2
b
c
D
E
E1
e
h
L
L2
M
C A-B D
h x 45 _
H
A
SEATING
PLANE
DETAIL A
M
INCHES
MIN
MAX
0.053
0.069
0.004
0.010
0.049
---0.008
0.012
0.007
0.010
0.193 BSC
0.237 BSC
0.154 BSC
0.025 BSC
0.009
0.020
0.016
0.050
0.010 BSC
0_
8_
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
1.24
---0.20
0.30
0.19
0.25
4.89 BSC
6.00 BSC
3.90 BSC
0.635 BSC
0.22
0.50
0.40
1.27
0.25 BSC
0_
8_
SOLDERING FOOTPRINT
16X
16X
0.42
16
1.12
9
6.40
1
8
0.635
PITCH
DIMENSIONS: MILLIMETERS
Protected by U.S. Patents 5,195,827; 5,867,012; 5,982,221; 6,097,239; 6,133,753; 6,169,442; other patents pending.
Pentium is a registered trademark of Intel Corporation.
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