MC74HC1G14 D

MC74HC1G14
Single Inverter with
Schmitt-Trigger Input
The MC74HC1G14 is a high speed CMOS inverter with
Schmitt−Trigger input fabricated with silicon gate CMOS technology.
The internal circuit is composed of multiple stages, including a
buffer output which provides high noise immunity and stable output.
The MC74HC1G14 output drive current is 1/2 compared to
MC74HC series.
•
MARKING
DIAGRAMS
High Speed: tPD = 7.0 ns (Typ) at VCC = 5.0 V
Low Power Dissipation: ICC = 1.0 mA (Max) at TA = 25_C
High Noise Immunity
5
Balanced Propagation Delays (tPLH = tPHL)
Symmetrical Output Impedance (IOH = IOL = 2.0 mA)
Chip Complexity: FET = 101
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
NC
1
IN A
2
GND
3
5
M
•
•
•
•
•
•
•
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SC−88A / SOT−353 / SC−70
DF SUFFIX
CASE 419A
HA M G
G
1
5
HA M G
G
TSOP−5 / SOT−23 / SC−59
DT SUFFIX
CASE 483
HA
M
G
VCC
1
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
4
OUT Y
PIN ASSIGNMENT
Figure 1. Pinout (Top View)
IN A
1
1
OUT Y
NC
2
IN A
3
GND
4
OUT Y
5
VCC
FUNCTION TABLE
Figure 2. Logic Symbol
Inputs
Outputs
L
H
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
March, 2014 − Rev. 12
1
Publication Order Number:
MC74HC1G14/D
MC74HC1G14
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
*0.5 to )7.0
V
VIN
DC Input Voltage
*0.5 to VCC )0.5
V
VOUT
DC Output Voltage
*0.5 to VCC )0.5
V
IIK
DC Input Diode Current
$20
mA
IOK
DC Output Diode Current
$20
mA
IOUT
DC Output Sink Current
$12.5
mA
ICC
DC Supply Current per Supply Pin
$25
mA
TSTG
Storage Temperature Range
*65 to )150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
_C
TJ
Junction Temperature Under Bias
qJA
Thermal Resistance
PD
Power Dissipation in Still Air at 85_C
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ESD Withstand Voltage
ILATCHUP
Latchup Performance
)150
_C
SC70−5/SC−88A/SOT−353 (Note 1)
SOT23−5/TSOP−5/SC59−5
350
230
_C/W
SC70−5/SC−88A/SOT−353
SOT23−5/TSOP−5/SC59−5
150
200
mW
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
u2000
u200
N/A
V
Above VCC and Below GND at 125_C (Note 5)
$500
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage
2.0
6.0
V
VIN
DC Input Voltage
0.0
VCC
V
VOUT
DC Output Voltage
0.0
VCC
V
TA
Operating Temperature Range
tr , tf
Input Rise and Fall Time
*55
)125
_C
−
−
No Limit
No Limit
ns/V
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
TJ = 80_C
117.8
TJ = 90_C
1,032,200
TJ = 100_C
80
TJ = 110_C
Time, Years
TJ = 120_C
Time, Hours
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 130_C
Junction
Temperature °C
NORMALIZED FAILURE RATE
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
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2
MC74HC1G14
DC ELECTRICAL CHARACTERISTICS
VCC
Symbol
(V)
Min
Typ
Max
3.0
4.5
5.5
1.85
2.86
3.50
2.0
3.0
3.6
2.20
3.15
3.85
VT−
Negative Threshold
Voltage
3.0
4.5
5.5
0.9
1.35
1.65
1.5
2.3
2.9
1.65
2.46
3.05
0.9
1.35
1.65
VH
Hysteresis Voltage
3.0
4.5
5.5
0.30
0.40
0.50
0.57
0.67
0.74
1.20
1.40
1.60
0.30
0.40
0.50
2.0
3.0
4.5
6.0
1.9
2.9
4.4
5.9
2.0
3.0
4.5
6.0
1.9
2.9
4.4
5.9
1.9
2.9
4.4
5.9
4.5
6.0
4.18
5.68
4.31
5.80
4.13
5.63
4.08
5.58
VIN = VIH or VIL
IOH = −20 mA
VIN v VT *Min
IOH = *2 mA
IOH = *2.6 mA
VOL
Maximum Low−Level
Output Voltage
VIN ≥ VT )Max
IOL = 20 mA
Min
*55_C v TA v 125_C
Positive Threshold
Voltage
Minimum High−Level
Output Voltage
Test Conditions
TA v 85_C
VT+
VOH
Parameter
TA = 25_C
Max
Min
2.20
3.15
3.85
Max
Unit
2.20
3.15
3.85
V
0.9
1.35
1.65
1.20
1.40
1.60
0.30
0.40
0.50
V
1.20
1.40
1.60
V
V
2.0
3.0
4.5
6.0
0.0
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
VIN = VIH or VIL
IOL = 2 mA
IOL = 2.6 mA
4.5
6.0
0.17
0.18
0.26
0.26
0.33
0.33
0.40
0.40
V
IIN
Maximum Input
Leakage Current
VIN = 6.0 V or GND
6.0
$0.1
$1.0
$1.0
mA
ICC
Maximum Quiescent
Supply Current
VIN = VCC or GND
6.0
1.0
10
40
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 6.0 ns)
TA = 25_C
TA v 85_C
*55_C v TA v 125_C
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Symbol
Parameter
Typ
Max
Max
Unit
VCC = 5.0 V
Test Conditions
CL = 15 pF
3.5
15
20
25
ns
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
CL = 50 pF
19
10.5
7.5
6.5
100
27
20
17
125
35
25
21
155
90
35
26
VCC = 5.0 V
CL = 15 pF
3
10
15
20
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
CL = 50 pF
25
16
11
9
125
35
25
21
155
45
31
26
200
60
38
32
5
10
10
10
tPLH,
tPHL
Maximum
Propagation Delay,
Input A or B to Y
tTLH,
tTHL
Output Transition
Time
CIN
Maximum Input
Capacitance
CPD
Power Dissipation Capacitance (Note 6)
Min
Min
Max
Min
ns
pF
Typical @ 25_C, VCC = 5.0 V
10
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
MC74HC1G14
tr
tf
INPUT A
OUTPUT Y
CL*
GND
tPHL
tPLH
90%
50%
10%
tTHL
OUTPUT
INPUT
VCC
90%
50%
10%
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended for
propagation delay tests.
tTLH
Figure 4. Switching Waveforms
Figure 5. Test Circuit
ORDERING INFORMATION
Device
Package
Shipping†
MC74HC1G14DFT1G
NLVHC1G14DFT1G*
MC74HC1G14DFT2G
SC70−5/SC−88A/SOT−353
(Pb−Free)
3000 / Tape & Reel
NLVHC1G14DFT2G*
MC74HC1G14DTT1G
NLV74HC1G14DTT1G*
SOT23−5/TSOP−5/SC59−5
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
MC74HC1G14
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
J
C
K
H
SOLDER FOOTPRINT
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
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5
SCALE 20:1
mm Ǔ
ǒinches
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
MC74HC1G14
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE K
D 5X
NOTE 5
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
0.20 C A B
0.10 T
M
2X
0.20 T
B
5
1
4
2
B
S
3
K
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
SIDE VIEW
C
SEATING
PLANE
END VIEW
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
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MC74HC1G14/D