CM1242 07CP D

CM1242-07CP
1-Channel Ultra Small 0201
Package ESD Protection
Device in 0201
Description
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The CM1242−07CP is a 2−bump ESD protection device in 0201
form factor. It is fully compliant with IEC 61000−4−2. The
CM1242−07CP is also RoHS II compliant and has a pure tin finish.
Features
•
•
•
•
•
•
•
•
Low Capacitance < 5.8 pF
Low Clamping Voltage
Small Body Outline Dimensions:0.60 mm x 0.30 mm
Low Body Height: 0.275 mm
Stand−off Voltage: ±5.0 V
Low Dynamic Resistance: < 1.5 W
IEC61000−4−2 Level 4 ESD Protection
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
WLCSP2
CP SUFFIX
CASE 567AV
BLOCK DIAGRAM
A
Table 1. PIN DESCRIPTIONS
B
Description
A
ESD Channel Pin 1
B
ESD Channel Pin 2
MARKING DIAGRAM
A
Pin
PACKAGE / PINOUT DIAGRAMS
Top View
(Bumps Down)
A
A
= Specific Device Code
ORDERING INFORMATION
Device
Package
CM1242−07CP
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
B
© Semiconductor Components Industries, LLC, 2012
July, 2012 − Rev. 5
10,000/Tape & Reel
(Pb−Free)
Bottom View
(Bumps Up)
A
Shipping
1
Publication Order Number:
CM1242−07CP/D
CM1242−07CP
SPECIFICATIONS
Table 2. STANDARD OPERATING CONDITIONS
Parameter
Rating
Units
Storage Temperature Range
−55 to +150
°C
Operating Temperature Range
−40 to +85
°C
±5.5
V
Maximum Input Voltage
Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Parameter
Symbol
VB
ILEAK
CIN
VESD
VCL
RDYN
Conditions
Breakdown Voltage
IF = +1.0 mA
IF = −1.0 mA
Channel Leakage Current
VIN = ±5.0 V
Channel Input Capacitance
At 1 MHz, VIN = 0 V
ESD Protection Peak Discharge Voltage at any
channel input
a) Contact Discharge per IEC 61000−4−2 standard
b) Air Discharge per IEC 61000−4−2 standard
(Note 2)
Channel Clamp Voltage
Positive Transients
Negative Transients
IPP = 1 A, tp = 8/20 ms
Dynamic Resistance
Positive Transients
Negative Transients
IPP = 1 A, tp = 8/20 ms
Min
Typ
Max
Units
6.0
−9.0
7.6
−7.6
9.0
−6.0
V
±1.0
±100
nA
5.8
7.0
pF
4.6
kV
±17
±17
+9.8
−9.8
V
1.5
1.5
W
1. TA = 25°C unless otherwise specified.
2. Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W.
Figure 1. ESD Clamping Voltage Screenshot
Positive 8 kV Contact per IEC61000−4−2
Figure 2. ESD Clamping Voltage Screenshot
Negative 8 kV Contact per IEC61000−4−2
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2
CM1242−07CP
20
1.00E−02
16
1.00E−03
12
1.00E−04
8
1.00E−05
1.00E−06
1.00E−07
I1 (A)
Ipk (A)
4
0
1.00E−08
−4
1.00E−09
−8
1.00E−10
−12
−20
−32
1.00E−11
CM1242 u1
CM1242 u2
CM1242 u3
−16
−24
−16
−8
0
Vpk (V)
8
12
20
1.00E−12
32
1.00E−13
−9 −8 −7 −6 −5 −4 −3 −2 −1 0 1 2 3 4 5 6 7 8 9
V1 (V)
Vpk (V)
Figure 3. TLP Characteristics
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Figure 4. IV Characteristics
u1
u2
u3
0
0.5
1
1.5
2
Ipk (A)
2.5
3
3.5
Figure 6. Typical Insertion Loss (S21)
Figure 5. 80 x 20 Surge Characteristics
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3
CM1242−07CP
MECHANICAL SPECIFICATIONS
CM1242−07CP Mechanical Specifications
The CM1242−07CP is supplied in a 2−bump custom package. Dimensions are presented below.
Table 4. TAPE AND REEL SPECIFICATIONS
Pocket Size (mm)
Tape Width
Part Number
Chip Size (mm)
B0 X A0 X K0
W
Reel Diameter
Qty per
Reel
P0
P1
CM1242−07CP
0.60 X 0.30 X 0.275
0.67 X 0.37 X 0.35
8 mm
178 mm (7″)
10,000
4 mm
2 mm
10 Pitches Cumulative Tolerance
on Tape ±0.2 mm
P0
Top Cover Tape
+
+
A0
B0
K0
W
P1
User Direction of Feed
Center Lines
of Gravity
Figure 7. Tape and Reel Mechanical Data
CM1242−07CP Board Level Application.
Refer to Application Note AND8398/D − Board Level Application Note for 0201 DSN2 Package.
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4
CM1242−07CP
PACKAGE DIMENSIONS
WLCSP2, 0.6x0.3
CASE 567AV
ISSUE O
D
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
A B
0.02 C
2X
DIM
A
A1
b
D
E
e
L
E
0.02 C
TOP VIEW
0.02 C
A
0.02 C
A1
C
SIDE VIEW
e
2X
MILLIMETERS
MIN
MAX
0.25
0.30
0.00
0.05
0.14
0.17
0.60 BSC
0.30 BSC
0.36 BSC
0.19
0.24
SEATING
PLANE
RECOMMENDED
SOLDER FOOTPRINT*
L
2X
0.33
2X b
0.05 C A B
BOTTOM VIEW
2X
0.28
0.81
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
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Sales Representative
CM1242−07CP/D
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