CM1242 33CP D

CM1242-33CP
1-Channel ESD Protection
Device in 0201 CSP
Description
The CM1242−33CP is a 2−bump ESD protection device in 0201
CSP form factor. It is fully compliant with IEC 61000−4−2. The
CM1242−33CP is also RoHS II compliant and has a pure tin finish.
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Table 1. PIN DESCRIPTIONS
Pin
Description
A
ESD Channel Pin 1
B
ESD Channel Pin 2
WLCSP2
CP SUFFIX
CASE 567AV
BLOCK DIAGRAM
A
PACKAGE / PINOUT DIAGRAMS
Top View
(Bumps Down)
Y
B
MARKING DIAGRAM
A
Y
Bottom View
(Bumps Up)
Y
B
= Specific Device Code
ORDERING INFORMATION
Device
CM1242−33CP
Package
Shipping
CSP
10,000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 6
1
Publication Order Number:
CM1242−33CP/D
CM1242−33CP
SPECIFICATIONS
Table 2. STANDARD OPERATING CONDITIONS
Rating
Units
Storage Temperature Range
Parameter
−55 to +150
°C
Operating Temperature Range
−40 to +85
°C
±5.5
V
Maximum Input Voltage
Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
VB
ILEAK
CIN
VESD
VCL
RDYN
Parameter
Conditions
Breakdown Voltage
IF = +10 mA
IF = −10 mA
Channel Leakage Current
VIN = ±3.3 V
Channel Input Capacitance
At 1 MHz, VIN = 0 V
ESD Protection Peak Discharge Voltage
at any channel input
a) Contact Discharge per IEC 61000−4−2 standard
b) Air Discharge per IEC 61000−4−2 standard
(Note 2)
Channel Clamp Voltage
Positive Transients
Negative Transients
IPP = 1 A, tp = 8/20 ms
Dynamic Resistance
Positive Transients
Negative Transients
IPP = 1 A, tp = 8/20 ms
Min
Typ
Max
Units
6.0
−9.0
7.6
−7.6
9.0
−6.0
V
±0.1
±0.5
mA
55
66
pF
45
kV
±30
±30
1. TA = 25°C unless otherwise specified.
2. Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W.
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2
+8.6
−8.6
0.4
0.4
V
W
CM1242−33CP
MECHANICAL SPECIFICATIONS
CM1242−33CP Mechanical Specifications
The CM1242−33CP is supplied in a 2−bump Chip Scale Package (CSP). Dimensions are presented below.
Table 4. CSP TAPE AND REEL SPECIFICATIONS
Pocket Size (mm)
Tape Width
Part Number
Chip Size (mm)
B0 X A0 X K0
W
Reel Diameter
Qty per
Reel
P0
P1
CM1242−33CP
0.60 X 0.30 X 0.275
0.67 X 0.37 X 0.35
8 mm
178 mm (7″)
10,000
4 mm
2 mm
10 Pitches Cumulative Tolerance
on Tape ±0.2 mm
P0
Top Cover Tape
+
+
A0
B0
K0
W
P1
User Direction of Feed
Center Lines
of Gravity
Figure 1. Tape and Reel Mechanical Data
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3
CM1242−33CP
PACKAGE DIMENSIONS
WLCSP2, 0.6x0.3
CASE 567AV
ISSUE O
D
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
A B
0.02 C
2X
DIM
A
A1
b
D
E
e
L
E
0.02 C
TOP VIEW
0.02 C
A
0.02 C
A1
C
SIDE VIEW
e
2X
MILLIMETERS
MIN
MAX
0.25
0.30
0.00
0.05
0.14
0.17
0.60 BSC
0.30 BSC
0.36 BSC
0.19
0.24
SEATING
PLANE
RECOMMENDED
SOLDER FOOTPRINT*
L
2X
0.33
2X b
0.05 C A B
BOTTOM VIEW
2X
0.28
0.81
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CM1242−33CP/D
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