CM1263-02SE Low Capacitance ESD Protection for High-Speed Serial Interfaces Features • 2 Channels of ESD Protection • 0.85 pF Loading Capacitance per Channel Typical • Provides ESD Protection to IEC61000−4−2 Level 4: • ±8 kV Contact Discharge • ±15 kV Air Discharge • 5−Pin SOT−553 Package • These Devices are Pb−Free and are RoHS Compliant http://onsemi.com Applications BLOCK DIAGRAM SOT−553 SE SUFFIX CASE 463B • LCD and Camera Data Lines in Wireless Handsets that Use • • • • High−speed Serial Interfaces such as MDDI, MIPI, MVI and MPL I/O Port Protection for Mobile Handsets, Notebook Computers, PDAs, etc. Wireless Handsets Handheld PCs/PDAs LCD and Camera Modules VP CH1 CH2 VN MARKING DIAGRAM L63 M L63 M = Specific Device Code = Date Code ORDERING INFORMATION Device Package Shipping† CM1263−02SE SOT−553 (Pb−Free) 5000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2011 March, 2011 − Rev. 3 1 Publication Order Number: CM1263−02SE/D CM1263−02SE PACKAGE / PINOUT DIAGRAM Table 1. PIN DESCRIPTIONS 5−Pin, SOT−553 Package Pin Description 1 VP 2 VN 3 NC 4 (CH1) ESD Channel #1 5 (CH2) ESD Channel #2 5 4 L63 1 1 2 3 SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Operating Supply Voltage (VP − VN) Operating Temperature Range Storage Temperature Range DC Voltage at any channel input Rating Units 6.0 V –40 to +85 °C –65 to +150 °C (VN − 0.5) to (VP + 0.5) V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 2 CM1263−02SE Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions VP Operating Supply Voltage (VP − VN) IP Operating Supply Current (VP − VN) = 3.3 V VF Diode Forward Voltage Top Diode Bottom Diode IF = 8 mA; TA = 25°C Channel Leakage Current Min Max Units 3.3 5.5 V 8.0 mA V 0.80 0.80 0.95 0.95 TA = 25°C; VP = 5 V, VN = 0 V, VTEST = 0 to 5 V 0.1 1.0 mA Channel Input Capacitance At 1 MHz, VP = 3.3 V, VN = 0 V, VIN = 1.65 V 0.85 1.2 pF ΔCIN Channel Input Capacitance Matching At 1 MHz, VP = 3.3 V, VN = 0 V, VIN = 1.65 V 0.02 VESD ESD Protection Peak Discharge Voltage at any channel input, in system: a) Contact Discharge per IEC 61000−4−2 standard b) Air Discharge per IEC 61000−4−2 standard ILEAK CIN VCL RDYN 0.60 0.60 Typ pF kV TA = 25°C; (Notes 2 and 3) ±8 TA = 25°C; (Note 3) ±15 Channel Clamp Voltage Positive Transients Negative Transients TA = 25°C, IPP = 1 A, tP = 8/20 mS (Note 3) Dynamic Resistance Positive Transients Negative Transients IPP = 1 A, tP = 8/20 mS Any I/O pin to Ground; (Note 3) 1. All parameters specified at TA = –40°C to +85°C unless otherwise noted. 2. Standard IEC 61000−4−2 with CDischarge = 150pF, RDischarge = 330 W, VP = 3.3 V, VN grounded. 3. These measurements performed with no external capacitor on VP (VP floating). http://onsemi.com 3 +9.96 –1.6 0.96 0.5 V W CM1263−02SE PACKAGE DIMENSIONS SOT−553, 5 LEAD CASE 463B−01 ISSUE B D −X− 5 A 4 1 2 b e L E −Y− 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. HE DIM A b c D E e L HE c 5 PL 0.08 (0.003) M X Y MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.70 1.20 1.30 0.50 BSC 0.10 0.20 0.30 1.50 1.60 1.70 MIN 0.50 0.17 0.08 1.50 1.10 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.004 0.008 0.059 0.063 MIN 0.020 0.007 0.003 0.059 0.043 MAX 0.024 0.011 0.007 0.067 0.051 0.012 0.067 SOLDERING FOOTPRINT* STYLE 8: PIN 1. CATHODE 2. COLLECTOR 3. N/C 4. BASE 5. EMITTER 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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