CM1263 06DE D

CM1263-06DE
Low Capacitance ESD
Protection for High-Speed
Serial Interfaces
Features
•
•
•
•
•
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6 Channels of ESD Protection
1 pF Loading Capacitance per Channel Typical
±8 kV ESD Protection (IEC 61000−4−2, Contact Discharge)
±15 kV ESD Protection (IEC 61000−4−2, Air Discharge)
These Devices are Pb−Free and are RoHS Compliant
UDFN12
DE SUFFIX
CASE 517BD
Applications
• LCD and Camera Data Lines in Wireless Handsets that Use
•
•
•
•
High−Speed Serial Interfaces such as MDDI, MIPI, MVI and MPL
I/O Port Protection for Mobile Handsets, Notebook Computers,
PDAs, etc.
Wireless Handsets
Handheld PCs/PDAs
LCD and Camera Modules
BLOCK DIAGRAM
CH6
VP1 CH5
CH1
VN
VN
CH4
VP2 CH3
CH2
VN
VN
MARKING DIAGRAM
JK12 MG
G
1
JK12
M
G
= Specific Device Code
= Month Code
= Pb−Free Package
(*Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping†
CM1263−06DE
UDFN
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
September, 2013 − Rev. 5
1
Publication Order Number:
CM1263−06DE/D
CM1263−06DE
PACKAGE / PINOUT DIAGRAM
Table 1. PIN DESCRIPTIONS
Pin
Description
1
VN*
2
(CH1) ESD Channel #1
3
VN*
4
VN*
5
(CH2) ESD Channel #2
6
VN*
7
(CH3) ESD Channel #3
8
VP2 for Channels 2, 3, and 4
9
(CH4) ESD Channel #4
10
(CH5) ESD Channel #5
11
VP1 for Channels1, 5, and 6
12
(CH6) ESD Channel #6
DAP*
Backside, GND Pad, VN*
Top View
(Pins Down View)
12 11 10 9 8 7
Pin 1
Marking
JK12
1 2 3 4 5 6
Bottom View
(Pins Up View)
1 2 3 4 5 6
GND
PAD
12 11 10 9 8 7
12−Lead UDFN Package
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2
CM1263−06DE
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
6.0
V
Operating Temperature Range
−40 to +85
°C
Storage Temperature Range
−65 to +150
°C
(VN − 0.5) to (VP + 0.5)
V
Operating Supply Voltage (VP − VN)
DC Voltage at any channel input
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
3.3
5.5
V
8.0
mA
VP
Operating Supply Voltage (VP−VN)
IP
Operating Supply Current
VP = 3.3 V, VN = 0 V (per VP pin)
VF
Diode Forward Voltage
Top Diode
Bottom Diode
TA = 25°C, IF = 8 mA, VP = 3.3 V,
VN = 0 V
Channel Leakage Current
TA = 25°C; VP = 3.3 V, VN = 0 V
(Channel 1)
250
nA
VP = 3.3 V, VN = 0 V
(Channels 1−6)
1000
nA
1000
nA
1.2
pF
ILEAK
0.60
0.60
0.80
0.80
0.95
0.95
V
IR
Reverse (Leakage Current)
VP = floating; VN = 0 V
(per channel)
CIN
Channel Input Capacitance
At 1 MHz, VP = 3.3 V, VN = 0 V,
VIN = 0 V
0.88
Channel Input Capacitance Matching
At 1 MHz, VP = 3.3 V, VN = 0 V,
VIN = 0 V
0.02
pF
Mutual Capacitance between signal pin
and adjacent signal pin
At 1 MHz, VP = 3.3 V, VN = 0 V,
VIN = 0 V
0.11
pF
DCIN
CMUTUAL
VESD
VCL
RDYN
ESD Protection
Peak Discharge Voltage at any channel
input, in system
a) Contact discharge per
IEC 61000−4−2 standard
b) Air discharge per
IEC 61000−4−2 standard
kV
TA = 25°C (Notes 2 and 3)
±8
±15
Channel Clamp Voltage
Positive Transients
Negative Transients
TA = 25°C, IPP = 1 A, tP = 8/20 mS
(Note 3)
Dynamic Resistance
Positive Transients
Negative Transients
TA = 25°C, IPP = 1 A, tP = 8/20 mS
Any I/O pin to Ground (Note 3)
1. All parameters specified at TA = –40°C to +85°C unless otherwise noted.
2. Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W, VP = 3.3 V, VN grounded.
3. These measurements performed with no external capacitor on VP (VP floating).
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3
+9.96
–1.6
0.96
0.5
V
W
CM1263−06DE
PACKAGE DIMENSIONS
UDFN12, 2.5x1.35, 0.4P
CASE 517BD
ISSUE O
A
B
D
2X
0.10 C
PIN ONE
REFERENCE
2X
L1
ÉÉÉ
ÉÉÉ
0.10 C
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
TOP VIEW
DETAIL B
(A3)
A1
0.05 C
NOTE 4
12X
A1
SIDE VIEW
6
1
K
12
C
SEATING
PLANE
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MOLD CMPD
A3
DETAIL B
OPTIONAL
CONSTRUCTION
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
2.50 BSC
1.90
2.10
1.35 BSC
0.30
0.50
0.40 BSC
0.15
−−−
0.20
0.30
−−−
0.05
DETAIL A
D2
L
ÇÇ
ÇÇ
ÉÉ
EXPOSED Cu
A
0.05 C
12X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L
7
e
RECOMMENDED
SOLDERING FOOTPRINT*
E2
12X
PACKAGE
OUTLINE
b
BOTTOM VIEW
2.20
12X
0.40
0.10 C A B
0.05 C
NOTE 3
1.55
0.50
12X
0.40
PITCH
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
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CM1263−06DE/D
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