DF6A6.8FUT1 D

DF6A6.8FUT
Quad Array for
ESD Protection
This quad voltage suppressor is designed for applications requiring
transient overvoltage protection capability. It is intended for use in
voltage and ESD sensitive equipment such as computers, printers,
business machines, communication systems, medical equipment, and
other applications. Its quad junction common anode design protects
four separate lines using only one package. These devices are ideal for
situations where board space is at a premium.
Specification Features
•
•
•
•
•
•
SC−88 Package Allows Four Separate Unidirectional Configurations
Low Leakage < 1 mA @ 5 Volt
Breakdown Voltage: 6.4 − 7.2 Volt @ 5 mA
Low Capacitance (40 pF typical)
ESD Protection Meeting 61000−4−2 Level 4
and 16 kV Human Body Model
These are Pb−Free Devices
•
•
•
•
Void Free, Transfer−Molded, Thermosetting Plastic Case
Corrosion Resistant Finish, Easily Solderable
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
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1
6
2
5
3
4
MARKING
DIAGRAM
1
Mechanical Characteristics
SC−88
CASE 419B−02
Rating
Symbol
Value
Unit
Peak Power Dissipation @ 8 x 20 ms
(Note 1)
Ppk
75
Watts
Steady State Power Dissipation
(Note 2)
PD
385
mW
RqJA
Maximum Junction Temperature
Operating Junction and Storage
Temperature Range
ESD Discharge
MIL STD 883C − Method 3015−6
IEC61000−4−2, Air Discharge
IEC61000−4−2, Contact Discharge
Lead Solder Temperature
(10 seconds duration)
328
3.0
°C/W
mW/°C
TJmax
150
°C
TJ, Tstg
−55 to
+150
°C
VPP
TL
68 MG
G
1
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Thermal Resistance −
Junction−to−Ambient
Derate Above 25°C
6
kV
68 = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location.)
ORDERING INFORMATION
Device
Package
Shipping†
DF6A6.8FUT1G
SC−88
(Pb−Free)
3000/Tape & Reel
DF6A6.8FUT2G
SC−88
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
16
16
8
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Per Waveform Figure 1
2. Mounted on FR−5 Board = 1.0 X 0.75 X 0.062 in.
© Semiconductor Components Industries, LLC, 2012
October, 2012 − Rev. 2
1
Publication Order Number:
DF6A6.8FUT1/D
DF6A6.8FUT
I
IF
VBR VRWM
V
IR VF
IT
V−I Curve
ELECTRICAL CHARACTERISTICS
Breakdown Voltage
VBR @ 5 mA (Volts)
Leakage Current
IRM @ VRWM = 5 V
Typical
Capacitance
@ 0 V Bias
Max
VF @ IF = 10 mA
Max
ZZ @
5 mA
Max
ZZK @
0.5 mA
Device
Device
Marking
Min
Nom
Max
(mA)
(pF)
(V)
(W)
(W)
DF6A6.8FUT1G
68
6.4
6.8
7.2
1.0
40
1.25
30
300
DF6A6.8FUT2G
68
6.4
6.8
7.2
1.0
40
1.25
30
300
4
5
90
50
PEAK VALUE IRSM @ 8 ms
tr
TYPICAL CAPACITANCE (pF)
1 MHz FREQUENCY
% OF PEAK PULSE CURRENT
100
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
80
70
60
HALF VALUE IRSM/2 @ 20 ms
50
40
30
tP
20
10
0
0
20
40
t, TIME (ms)
60
45
40
35
30
25
20
15
10
80
0
2
3
BIAS VOLTAGE (VOLTS)
1
Figure 2. Capacitance
Figure 1. 8 × 20 ms Pulse Waveform
Ipp , PEAK PULSE CURRENT (AMPS)
IF, FORWARD CURRENT (A)
1
0.1
0.01
0.001
0.0001
0.6
0.7
0.8
0.9
1.0
1.1
1.2
10
8 x 20 ms per Figure 1
1
8
9
10
11
VF, FORWARD VOLTAGE (VOLTS)
VC, CLAMPING VOLTAGE (VOLTS)
Figure 3. Forward Voltage
Figure 4. Clamping Voltage versus Peak
Pulse Current
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2
12
DF6A6.8FUT
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
e
6
5
4
HE
DIM
A
A1
A3
b
C
D
E
e
L
HE
−E−
1
2
3
b 6 PL
0.2 (0.008)
M
E
M
MILLIMETERS
MIN
NOM MAX
0.80
0.95
1.10
0.00
0.05
0.10
0.20 REF
0.10
0.21
0.30
0.10
0.14
0.25
1.80
2.00
2.20
1.15
1.25
1.35
0.65 BSC
0.10
0.20
0.30
2.00
2.10
2.20
INCHES
NOM MAX
0.037 0.043
0.002 0.004
0.008 REF
0.004 0.008 0.012
0.004 0.005 0.010
0.070 0.078 0.086
0.045 0.049 0.053
0.026 BSC
0.004 0.008 0.012
0.078 0.082 0.086
MIN
0.031
0.000
A3
A
C
A1
L
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
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PUBLICATION ORDERING INFORMATION
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DF6A6_8FUT1/D
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