ESD5384 5-Line HDMI Control Line ESD Protection Functional Description The ESD5384 chip is a low capacitance ESD protection for HDMI control pins. It also integrates pull−up resistor for I2C bus and pull−down resistor for hot plug detect and pull−up resistor for CEC line. The ESD protection circuitry prevents damage to the protected device when subjected to ESD surges up to 15 kV. The ESD5384 is available in 9 bump CSP package. http://onsemi.com MARKING DIAGRAM WLCSP9 CASE 567CX Features • Line Capacitance: 12 pF max • IEC 61000−4−2 Level 4 53 M ±15 kV (air discharge) ±8 kV (contact discharge) This is a Pb−Free Device ♦ • 53M = Specific Device Code = Date Code ♦ PINOUT 3 2 1 A SCL CEC 5V B SDA GND RPU2 C HPD GND RPU Applications • HDMI Control Line Interfaces ♦ ♦ ♦ Smart Phones Tablets Consumer Electronics (Bump Side) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. A1 C3 HPD 5V B3 SDA A3 SCL A2 CEC 1.75KW C1 1.75KW 100KW B1 27KW B2, C2 ESD5384 Figure 1. Electrical Schematic © Semiconductor Components Industries, LLC, 2011 October, 2011 − Rev. 0 1 Publication Order Number: EMD5384/D ESD5384 ABSOLUTE MAXIMUM RATINGS Symbol VPP Parameter Value External pins (A1, A2, A3, B3 and C3): ESD IEC 61000−4−2, level 4 – air discharge ESD IEC 61000−4−2, level 4 – contact discharge Internal pins (B1, C1): ESD IEC 61000−4−2, level 1 – air discharge ESD IEC 61000−4−2, level 1 – contact discharge Unit kV ± 15 ±8 ±2 ±2 Top Operating Temperature Range −30 to +85 °C Tstg Storage Temperature Range −55 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS (Note 1) Symbol Test Condition Min VBR Breakdown Voltage (Ir = 1mA) IRM Leakage Current @ Vrm (Vrm = 3 V per line), excluding HPD line IRM Leakage Current @ Vrm (Vrm = 3 V per line), HPD line R1, R2 Typ Max 20 V 50 200 nA 32 mA 6 Resistance Unit 1575 1750 1925 W R3 Pull−up Resistance 80 100 120 kW R4 Pull−up Resistance 22 27 32 kW Vline = 0 V, Vosc = 30 mV, F = 1 MHz, A2 with B1 not connected 14 17 pF Vline = 0 V, Vosc = 30 mV, F = 1 MHz, A3, B3 with C1 not connected. 24 29 Vline = 0 V, Vosc = 30 mV, F = 1 MHz, A2, A3, B3 with C1 and B1 grounded 10 12 Cline 1. All parameters specified at TA = 25°C unless otherwise noted. TYPICAL CHARACTERISTICS Figure 2. Crosstalk Measurements http://onsemi.com 2 ESD5384 TYPICAL CHARACTERISTICS Figure 3. ESD Clamping Voltage Screenshot Positive 8 kV Contact per IEC61000−4−2, CEC line Figure 4. ESD Clamping Voltage Screenshot Negative 8 kV Contact per IEC61000−4−2, CEC line Figure 5. ESD Clamping Voltage Screenshot Positive 8 kV Contact per IEC61000−4−2, SCL line Figure 6. ESD Clamping Voltage Screenshot Negative 8 kV Contact per IEC61000−4−2, SCL line Figure 7. ESD Clamping Voltage Screenshot Positive 8 kV Contact per IEC61000−4−2, SDA line Figure 8. ESD Clamping Voltage Screenshot Negative 8 kV Contact per IEC61000−4−2, SDA line http://onsemi.com 3 ESD5384 TYPICAL CHARACTERISTICS Figure 9. ESD Clamping Voltage Screenshot Positive 8 kV Contact per IEC61000−4−2, HPD line Figure 10. ESD Clamping Voltage Screenshot Negative 8 kV Contact per IEC61000−4−2, HPD line Figure 11. ESD Clamping Voltage Screenshot Positive 8 kV Contact per IEC61000−4−2, 5 V line Figure 12. ESD Clamping Voltage Screenshot Negative 8 kV Contact per IEC61000−4−2, 5 V line http://onsemi.com 4 ESD5384 IEC61000−4−2 Waveform IEC61000−4−2 Spec. Ipeak Level Test Voltage (kV) First Peak Current (A) Current at 30 ns (A) Current at 60 ns (A) 1 2 7.5 4 2 2 4 15 8 4 3 6 22.5 12 6 4 8 30 16 8 100% 90% I @ 30 ns I @ 60 ns 10% tP = 0.7 ns to 1 ns Figure 13. IEC61000−4−2 Spec ESD Gun Oscilloscope TVS 50 W Cable 50 W Figure 14. Diagram of ESD Clamping Voltage Test Setup The following is taken from Application Note AND8308/D − Interpretation of Datasheet Parameters for ESD Devices. systems such as cell phones or laptop computers it is not clearly defined in the spec how to specify a clamping voltage at the device level. ON Semiconductor has developed a way to examine the entire voltage waveform across the ESD protection diode over the time domain of an ESD pulse in the form of an oscilloscope screenshot, which can be found on the datasheets for all ESD protection diodes. For more information on how ON Semiconductor creates these screenshots and how to interpret them please refer to AND8307/D. ESD Voltage Clamping For sensitive circuit elements it is important to limit the voltage that an IC will be exposed to during an ESD event to as low a voltage as possible. The ESD clamping voltage is the voltage drop across the ESD protection diode during an ESD event per the IEC61000−4−2 waveform. Since the IEC61000−4−2 was written as a pass/fail spec for larger % OF PEAK PULSE CURRENT 100 PEAK VALUE IRSM @ 8 ms tr 90 PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms 80 70 60 HALF VALUE IRSM/2 @ 20 ms 50 40 30 tP 20 10 0 0 20 40 t, TIME (ms) 60 Figure 15. 8 x 20 ms Pulse Waveform http://onsemi.com 5 80 ESD5384 Figure 16. Positive TLP I−V Curve Figure 17. Negative TLP I−V Curve Transmission Line Pulse (TLP) Measurement L Transmission Line Pulse (TLP) provides current versus voltage (I−V) curves in which each data point is obtained from a 100 ns long rectangular pulse from a charged transmission line. A simplified schematic of a typical TLP system is shown in Figure 18. TLP I−V curves of ESD protection devices accurately demonstrate the product’s ESD capability because the 10s of amps current levels and under 100 ns time scale match those of an ESD event. This is illustrated in Figure 19 where an 8 kV IEC61000−4−2 current waveform is compared with TLP current pulses at 8 A and 16 A. A TLP I−V curve shows the voltage at which the device turns on as well as how well the device clamps voltage over a range of current levels. A typical TLP I−V curve for the ESD7383 is shown in Figures 16 and 17. 50 W Coax Cable S Attenuator ÷ 50 W Coax Cable 10 MW IM VM DUT VC Oscilloscope Figure 18. Simplified Schematic of a Typical TLP System Figure 19. Comparison Between 8 kV IEC61000−4−2 and 8 A and 16 A TLP Waveforms http://onsemi.com 6 ESD5384 TYPICAL APPLICATION SCHEMATIC ESD7484 ESD7484 HDMI Type C Connector Data2 Shield 1 Data2 + 2 A3 A1 C3 C1 B2 A3 A1 C3 C1 B2 D3 D1 F3 F1 E2 D3 D1 F3 F1 E2 Data2 + Data2 − Data2 − 3 Data1 Shield 4 Data1 + 5 Data1 + Data1 − 6 Data1 − Data0 Shield 7 Data0 + 8 Data0 + Data0 − 9 Data0 − CLK Shield 10 CLK + 11 CLK + CLK − 12 CLK − DDC GROUND 13 CEC CEC 14 SCL 15 SCL SDA 16 SDA +5 Power Reserved 17 HPD +5 Power 18 HPD A1 19 C3 HPD 5V B3 SDA A3 SCL A2 CEC 1.75KW C1 5V 1.75KW 100KW B1 VDD_CEC 27KW B2, C2 ESD5384 Figure 20. Typical Application Schematic ORDERING INFORMATION Part Number ESD5384 Chip Size (mm) Package Shipping† 1.14 x 1.14 x 0.605 WLCSP9 (Pb−Free) 5000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 7 ESD5384 PACKAGE DIMENSIONS WLCSP9, 1.14x1.14 CASE 567CX−01 ISSUE O D PIN A1 REFERENCE 2X 0.05 C 2X 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. A B ÈÈ ÈÈ E DIM A A1 A2 b D E e TOP VIEW A2 0.05 C RECOMMENDED SOLDERING FOOTPRINT* A A1 0.05 C NOTE 3 9X A1 0.03 C SEATING PLANE PACKAGE OUTLINE 9X e b 0.05 C A B C SIDE VIEW MILLIMETERS MIN MAX 0.57 0.63 0.17 0.24 0.41 REF 0.24 0.29 1.14 BSC 1.14 BSC 0.40 BSC e 0.40 PITCH C B 0.25 0.40 PITCH DIMENSIONS: MILLIMETERS A 1 2 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 3 BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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