ESD5Z2.5T1 D

ESD5Z2.5T1G Series,
SZESD5Z2.5T1G Series
Transient Voltage
Suppressors
Micro−Packaged Diodes for ESD Protection
http://onsemi.com
The ESD5Z Series is designed to protect voltage sensitive
components from ESD and transient voltage events. Excellent
clamping capability, low leakage, and fast response time, make these
parts ideal for ESD protection on designs where board space is at a
premium. Because of its small size, it is suited for use in cellular
phones, portable devices, digital cameras, power supplies and many
other portable applications.
SOD−523
CASE 502
STYLE 1
Specification Features:
• Low Clamping Voltage
• Small Body Outline Dimensions:
•
0.047″ x 0.032″ (1.20 mm x 0.80 mm)
Low Body Height: 0.028″ (0.7 mm)
Stand−off Voltage: 2.5 V − 12 V
Peak Power up to 240 Watts @ 8 x 20 ms Pulse
Low Leakage
Response Time is Typically < 1 ns
ESD Rating of Class 3 (> 16 kV) per Human Body Model
IEC61000−4−2 Level 4 ESD Protection
IEC61000−4−4 Level 4 EFT Protection
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free and are RoHS Compliant*
2
Anode
MARKING DIAGRAM
XX
1
M
G
•
•
•
•
•
•
•
•
•
1
Cathode
G
2
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary
depending upon manufacturing location.
ORDERING INFORMATION
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
Device
Package
Shipping†
SZ/ESD5ZxxxT1G
SOD−523
Pb−Free
3000 /
Tape & Reel
ESD5ZxxxT5G
SOD−523
Pb−Free
8000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 3 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2014
December, 2014 − Rev. 13
1
Publication Order Number:
ESD5Z2.5T1/D
ESD5Z2.5T1G Series, SZESD5Z2.5T1G Series
MAXIMUM RATINGS
Rating
Symbol
Value
IEC 61000−4−2 (ESD)
Contact
Air
±30
±30
IEC 61000−4−4 (EFT)
40
ESD Voltage
Per Human Body Model
Per Machine Model
16
400
Total Power Dissipation on FR−4 Board (Note 1) @ TA = 25°C
Junction and Storage Temperature Range
Unit
kV
A
kV
V
°PD°
500
mW
TJ, Tstg
−55 to +150
°C
TL
260
°C
Lead Solder Temperature − Maximum (10 Second Duration)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm2.
See Application Note AND8308/D for further description of survivability specs.
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
Symbol
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
IR
VBR
IF
Working Peak Reverse Voltage
VC VBR VRWM
Maximum Reverse Leakage Current @ VRWM
IR VF
IT
Breakdown Voltage @ IT
IT
Test Current
IF
Forward Current
VF
Forward Voltage @ IF
Ppk
Peak Power Dissipation
C
I
Parameter
IPP
Uni−Directional TVS
Max. Capacitance @VR = 0 and f = 1 MHz
*See Application Note AND8308/D for detailed explanations of
datasheet parameters.
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2
V
ESD5Z2.5T1G Series, SZESD5Z2.5T1G Series
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 1.1 V Max. @ IF = 10 mA for all types)
VRWM
(V)
IR (mA)
@ VRWM
VBR (V)
@ IT
(Note 2)
IT
VC (V)
@ IPP =
5.0 A†
VC (V) @
Max IPP†
IPP
(A)†
Ppk
(W)†
C
(pF)
VC
Per
IEC61000−4−2
(Note 3)
Device*
Device
Marking
Max
Max
Min
mA
Typ
Max
Max
Max
Typ
ESD5Z2.5T1G/T5G
ZD
2.5
6.0
4.0
1.0
6.5
10.9
11.0
120
145
ESD5Z3.3T1G/T5G
ZE
3.3
0.05
5.0
1.0
8.4
14.1
11.2
158
105
ESD5Z5.0T1G/T5G
ZF
5.0
0.05
6.2
1.0
11.6
18.6
9.4
174
80
ESD5Z6.0T1G/T5G
ZG
6.0
0.01
6.8
1.0
12.4
20.5
8.8
181
70
ESD5Z7.0T1G/T5G
ZH
7.0
0.01
7.5
1.0
13.5
22.7
8.8
200
65
ESD5Z12T1G/T5G
ZM
12
0.01
14.1
1.0
17
25
9.6
240
55
Figures 1 and 2
See Below
(Note 4)
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
* Includes SZ-prefix devices where applicable.
†Surge current waveform per Figure 5.
2. VBR is measured with a pulse test current IT at an ambient temperature of 25°C.
3. For test procedure see Figures 3 and 4 and Application Note AND8307/D.
4. ESD5Z5.0T1G shown below. Other voltages available upon request.
Figure 1. ESD Clamping Voltage Screenshot
Positive 8 kV contact per IEC 61000−4−2
Figure 2. ESD Clamping Voltage Screenshot
Negative 8 kV contact per IEC 61000−4−2
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3
ESD5Z2.5T1G Series, SZESD5Z2.5T1G Series
IEC61000−4−2 Waveform
IEC 61000−4−2 Spec.
Ipeak
Level
Test Voltage (kV)
First Peak
Current
(A)
Current at
30 ns (A)
Current at
60 ns (A)
1
2
7.5
4
2
2
4
15
8
4
3
6
22.5
12
6
4
8
30
16
8
100%
90%
I @ 30 ns
I @ 60 ns
10%
tP = 0.7 ns to 1 ns
Figure 3. IEC61000−4−2 Spec
ESD Gun
Oscilloscope
TVS
50 W
Cable
50 W
Figure 4. Diagram of ESD Test Setup
The following is taken from Application Note
AND8308/D − Interpretation of Datasheet Parameters
for ESD Devices.
systems such as cell phones or laptop computers it is not
clearly defined in the spec how to specify a clamping voltage
at the device level. ON Semiconductor has developed a way
to examine the entire voltage waveform across the ESD
protection diode over the time domain of an ESD pulse in the
form of an oscilloscope screenshot, which can be found on
the datasheets for all ESD protection diodes. For more
information on how ON Semiconductor creates these
screenshots and how to interpret them please refer to
AND8307/D.
ESD Voltage Clamping
For sensitive circuit elements it is important to limit the
voltage that an IC will be exposed to during an ESD event
to as low a voltage as possible. The ESD clamping voltage
is the voltage drop across the ESD protection diode during
an ESD event per the IEC61000−4−2 waveform. Since the
IEC61000−4−2 was written as a pass/fail spec for larger
% OF PEAK PULSE CURRENT
100
PEAK VALUE IRSM @ 8 ms
tr
90
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
80
70
60
HALF VALUE IRSM/2 @ 20 ms
50
40
30
tP
20
10
0
0
20
40
t, TIME (ms)
60
Figure 5. 8 X 20 ms Pulse Waveform
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4
80
ESD5Z2.5T1G Series, SZESD5Z2.5T1G Series
PACKAGE DIMENSIONS
SOD−523
CASE 502
ISSUE E
−X−
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
−Y−
E
2X
b
0.08
1
M
2
X Y
DIM
A
b
c
D
E
HE
L
L2
TOP VIEW
A
c
MILLIMETERS
MIN
NOM
MAX
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
1.10
1.20
1.30
0.70
0.80
0.90
1.50
1.60
1.70
0.30 REF
0.15
0.20
0.25
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
HE
SIDE VIEW
2X
RECOMMENDED
SOLDERING FOOTPRINT*
L
2X
1.80
0.48
2X
0.40
2X
L2
BOTTOM VIEW
PACKAGE
OUTLINE
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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5
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ESD5Z2.5T1/D
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