ESD7383 D

ESD7383
USB-OTG 3-Line Protection
Product Description
The ESD7383 is a 4−bump very low capacitance ESD protection
device in 0.4 mm CSP form factor. It is fully compliant with IEC
61000−4−2. The ESD7383 is RoHS II compliant.
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Features
ELECTRICAL SCHEMATIC
• These Devices are Pb−Free and are RoHS Compliant
Applications
• ESD protection for USB (including USB OTG)
♦
USB compliance
High Speed USB port
Up to 480 Mb/s according to USB 2.0 high speed specification
CH1 (A1)
CH2 (B1)
CH3 (B2)
GND (A2)
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Peak Pulse Power Dissipation, 8 x 20 ms
Ppk
50
W
Maximum Peak Pulse Current, 8 x 20 ms
IPP
2.5
A
Operating Junction Temperature Range
TJ
−40 to +85
°C
Storage Temperature Range
Tstg
−55 to +150
°C
IEC 61000−4−2 Contact (ESD)
ESD
±8000
V
MARKING
DIAGRAM
WLCSP4
CASE 567CB
7M
7 = Specific Device Code
M = Date Code
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
PINOUT
B
B1
B2
A
A1
A2
1
2
BOTTOM VIEW
PIN DESCRIPTIONS
Pin
Description
A1
ESD Channel 1
A2
Device Ground
B1
ESD Channel 2
B2
ESD Channel 3
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
September, 2011 − Rev. 0
1
Publication Order Number:
EMD7383/D
ESD7383
ELECTRICAL SPECIFICATIONS AND CONDITIONS
ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Parameter
Symbol
Min
Conditions
Typ
Max
Unit
3.0
5.5
V
VIN
Input Operating Supply Voltage
VBR
Breakdown Voltage
IT = 8 mA
IR
Reverse Leakage Current
VRM = 3 V
100
nA
CIN
Channel Input Capacitance
At 1 MHz, VIN = 0 V
1.5
pF
DCIN
Channel Input Capacitance Matching
At 1 MHz, VIN = 0 V
VCL
Channel Clamp Voltage
Positive Transients
Negative Transients
IPP = 1 A, tP = 8/20 ms
Dynamic Resistance
Positive Transients
Negative Transients
IPP = 1 A, tP = 8/20 ms
Any I/O pin to Ground
RDYN
6
V
0.02
+10
−1.5
0.6
0.5
pF
V
W
W
1. All parameters specified at TA = 25°C unless otherwise noted.
ORDERING INFORMATION
Part Number
ESD7383
Bumps
Variation
Part Marking
Package
Shipping†
4
WLCSP4
7
CSP
(Pb−Free)
5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Figure 1. ESD Clamping Voltage Screenshot
Positive 8 kV Contact per IEC61000−4−2
Figure 2. ESD Clamping Voltage Screenshot
Negative 8 kV Contact per IEC61000−4−2
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2
ESD7383
IEC61000−4−2 Waveform
IEC61000−4−2 Spec.
Ipeak
Level
Test
Voltage
(kV)
First Peak
Current
(A)
Current at
30 ns (A)
Current at
60 ns (A)
1
2
7.5
4
2
2
4
15
8
4
3
6
22.5
12
6
4
8
30
16
8
100%
90%
I @ 30 ns
I @ 60 ns
10%
tP = 0.7 ns to 1 ns
Figure 3. IEC61000−4−2 Spec
ESD Gun
Oscilloscope
TVS
50 W
Cable
50 W
Figure 4. Diagram of ESD Clamping Voltage Test Setup
The following is taken from Application Note
AND8308/D − Interpretation of Datasheet Parameters
for ESD Devices.
systems such as cell phones or laptop computers it is not
clearly defined in the spec how to specify a clamping voltage
at the device level. ON Semiconductor has developed a way
to examine the entire voltage waveform across the ESD
protection diode over the time domain of an ESD pulse in the
form of an oscilloscope screenshot, which can be found on
the datasheets for all ESD protection diodes. For more
information on how ON Semiconductor creates these
screenshots and how to interpret them please refer to
AND8307/D.
ESD Voltage Clamping
For sensitive circuit elements it is important to limit the
voltage that an IC will be exposed to during an ESD event
to as low a voltage as possible. The ESD clamping voltage
is the voltage drop across the ESD protection diode during
an ESD event per the IEC61000−4−2 waveform. Since the
IEC61000−4−2 was written as a pass/fail spec for larger
% OF PEAK PULSE CURRENT
100
PEAK VALUE IRSM @ 8 ms
tr
90
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
80
70
60
HALF VALUE IRSM/2 @ 20 ms
50
40
30
tP
20
10
0
0
20
40
t, TIME (ms)
60
Figure 5. 8 x 20 ms Pulse Waveform
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3
80
ESD7383
Figure 6. Positive TLP I−V Curve
Figure 7. Negative TLP I−V Curve
Transmission Line Pulse (TLP) Measurement
L
Transmission Line Pulse (TLP) provides current versus
voltage (I−V) curves in which each data point is obtained
from a 100 ns long rectangular pulse from a charged
transmission line. A simplified schematic of a typical TLP
system is shown in Figure 8. TLP I−V curves of ESD
protection devices accurately demonstrate the product’s
ESD capability because the 10s of amps current levels and
under 100 ns time scale match those of an ESD event. This
is illustrated in Figure 9 where an 8 kV IEC61000−4−2
current waveform is compared with TLP current pulses at
8 A and 16 A. A TLP I−V curve shows the voltage at which
the device turns on as well as how well the device clamps
voltage over a range of current levels. A typical TLP I−V
curve for the ESD7383 is shown in Figures 6 and 7.
S Attenuator
÷
50 W Coax
Cable
10 MW
IM
50 W Coax
Cable
VM
DUT
VC
Oscilloscope
Figure 8. Simplified Schematic of a Typical TLP
System
Figure 9. Comparison Between 8 kV IEC61000−4−2 and 8 A and 16 A TLP Waveforms
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4
ESD7383
Figure 10. 480 Mb/s USB Source
Clears USB 2.0 Hi Speed Mask
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5
ESD7383
PACKAGE DIMENSIONS
WLCSP4, 0.8x0.8
CASE 567CB
ISSUE O
ÈÈ
ÈÈ
A
D
PIN A1
REFERENCE
2X
0.05 C
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
DIM
A
A1
A2
b
D
E
e
0.05 C
TOP VIEW
A2
0.05 C
A
RECOMMENDED
SOLDERING FOOTPRINT*
0.05 C
NOTE 3
4X
A1
0.05 C A B
0.03 C
C
SIDE VIEW
e
b
MILLIMETERS
MIN
MAX
0.63
0.57
0.17
0.24
0.41 REF
0.24
0.29
0.80 BSC
0.80 BSC
0.40 BSC
A1
SEATING
PLANE
0.40
PITCH
e
B
A
PACKAGE
OUTLINE
4X
0.40
PITCH
0.25
DIMENSIONS: MILLIMETERS
1
2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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USA/Canada
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Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
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6
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
ESD7383/D
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