ESD7554 D

ESD7554
4­Channel Low Capacitance
Dual­Voltage ESD
Protection Array
Features
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• 3 Channels of Low Voltage ESD Protection
• 1 Channel of High Voltage ESD Protection
• Provides ESD Protection to IEC61000−4−2 Level 4:
•
•
•
•
•
•
±8 kV Contact Discharge (Pins 1−3)
±15 kV Contact Discharge (Pin 4)
Low Channel Input Capacitance
Minimal Capacitance Change with Temperature and Voltage
High Voltage Zener Diode Protects Supply Rail
No Need for External Bypass Capacitors
Each I/O Pin Can Withstand Over 1000 ESD Strikes*
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MARKING
DIAGRAM
8
1
1
30V MG
G
WDFN8
CASE 517BC
30V
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
PINOUT
5
6
7
8
ÏÏÏÏ
ÏÏÏÏ
ÏÏÏÏ
DAP
4
3
2
1
Bottom View
(Pins up View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
NOTE:
Note: Pins 5, and 6 to 8 are connected to a common
substrate.
Figure 1. Electrical Schematic
*Standard test condition is IEC61000−4−2 level 4 test circuit with each pin subjected to ±8 kV contact discharge for 1000 pulses. Discharges
are timed at 1 second intervals and all 1000 strikes are completed in one continuous test run. The part is then subjected to standard production
test to verify that all of the tested parameters are within spec after the 1000 strikes.
© Semiconductor Components Industries, LLC, 2010
November, 2010 − Rev. 0
1
Publication Order Number:
ESD7554/D
ESD7554
Figure 2. Typical Application
PIN DESCRIPTIONS
4−CHANNEL, 8−LEAD, uDFN−8 PACKAGE
Pin
Name
Type
Description
1
CH1
I/0
LV Low−capacitance ESD Channel
2
CH2
I/0
LV Low−capacitance ESD Channel
3
CH3
I/0
LV Low−capacitance ESD Channel
4
VCC
HV VDD
5
GND
6
VN
Negative Voltage Supply Rail
7
VN
Negative Voltage Supply Rail
8
VN
Negative Voltage Supply Rail
DAP
GND
HV ESD Channel
Ground
Die Attach Pad (Ground)
ORDERING INFORMATION
Device (Note 1)
ESD7554MUT2G
# of Channels
Leads
Part Marking
Package
Shipping†
4
8
30V
uDFN−8, 0.4 mm
(Pb−Free)
Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
1. Parts are shipped in Tape and Reel form unless otherwise specified.
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2
ESD7554
SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
Rating
Unit
DC Voltage on Low−voltage Pins
6
V
DC Voltage on High−voltage Pins (VCC pin)
29
V
Operating Temperature Range
–40 to +85
°C
Storage Temperature Range
–65 to +150
°C
Parameter
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
STANDARD OPERATING CONDITIONS
Rating
Unit
–40 to +85
°C
Parameter
Operating Temperature Range
ELECTRICAL OPERATING CHARACTERISTICS (See Note 2)
Symbol
VF
Parameter
Conditions
Min
Typ
Max
6.8
8.2
9.2
–1.05
–0.9
–0.6
Unit
LV Diode Reverse Voltage
(Positive Voltage)
IF = 10 mA; TA = 25°C
LV Diode Forward Voltage
(Negative Voltage)
IF = 10 mA; TA = 25°C
LV Channel Leakage Current
(Pins 1 and 2)
TA = −30°C to 65°C; VIN = 3.3V,
VN =0V
100
nA
LV Channel Leakage Current
(Pin 3 only)
TA = −30°C to 65°C; VIN = 3.3 V,
VN = 0 V
100
nA
CIN
LV Channel Input Capacitance
At 1 MHz, VN = 0 V, VIN = 1.65 V
1.2
1.5
pF
DCIN
LV Channel Input Capacitance
Matching
At 1 MHz, VN = 0 V, VIN = 1.65 V
0.02
ILEAK_HV
ILEAK
HV Channel Leakage Current
TA = 25°C; VCC = 28 V, VN = 0 V
0.1
CIN_HV
HV Channel Input Capacitance
At 1 MHz, VN = 0V , VIN = 2.5 V
30
VF_HV
HV Diode Breakdown Voltage
Positive Voltage
IF = 10 mA; TA = 25°C
VESD
ESD Protection
Peak Discharge Voltage at any channel
input, in system
Contact discharge per
IEC 61000−4−2 standard
VCL
RDYN
TA = 25°C
30
LV Channel Clamp Voltage (Pin 1−3)
Positive Transients
Negative Transients
TA = 25°C, IPP = 1 A,
tP = 8/20 mS
Dynamic Resistance
LV Channel Positive Transients
LV Channel Negative Transients
HV Channel Positive Transients
HV Channel Negative Transients
IPP = 1 A, tP = 8/20 mS
Any I/O pin to Ground
2. All parameters specified at TA = –40°C to +85°C unless otherwise noted.
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3
V
pF
1.0
mA
pF
35
±8 (Pin 1−3)
±15 (Pin 4)
V
V
kV
+9.64
–1.75
0.72
0.59
4.00
0.20
V
V
W
ESD7554
PERFORMANCE INFORMATION
Input channel capacitance performance curves for low voltage pins
Figure 3. Typical Variation of CIN vs. VIN
(Low Voltage Inputs, f = 1 MHz, VN = 0 V)
Figure 4. Typical Variation of CIN vs. Temp
(Low Voltage Inputs, f = 1 MHz, VN = 0 V)
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4
ESD7554
PERFORMANCE INFORMATION
Typical filter performance for low voltage pins
Nominal conditions unless specified; otherwise, 50 W environment
Figure 5. Channel 1 vs. All GND Pins (0 V DC Bias)
Figure 6. Channel 2 vs. All GND Pins (0 V DC Bias)
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5
ESD7554
PERFORMANCE INFORMATION
Typical filter performance for low voltage pins
Nominal conditions unless specified; otherwise, 50 W environment
Figure 7. Channel 3 vs. All GND Pins (0 V DC Bias)
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6
ESD7554
PACKAGE DIMENSIONS
UDFN8, 1.7x1.35, 0.4P
CASE 517BC−01
ISSUE O
A
B
D
2X
0.10 C
PIN ONE
REFERENCE
2X
ÉÉÉ
ÉÉÉ
ÇÇ
ÉÉ
MOLD CMPD
EXPOSED Cu
A1
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A3
DETAIL B
ALTERNATE
CONSTRUCTIONS
0.10 C
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
TOP VIEW
A
DETAIL B
0.05 C
8X
L1
DETAIL A
0.05 C
NOTE 4
SIDE VIEW
DETAIL A
8X
L
L
(A3)
L
A1
C
SEATING
PLANE
ALTERNATE TERMINAL
CONSTRUCTIONS
RECOMMENDED
SOLDERING FOOTPRINT*
D2
1
E2
1.40
8X
8
K
e
e/2
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.70 BSC
1.10
1.30
1.35 BSC
0.30
0.50
0.40 BSC
0.15
−−−
0.20
0.30
−−−
0.05
8X
0.40
8X b
PACKAGE
OUTLINE
0.10 C A B
0.05 C
NOTE 3
1.55
BOTTOM VIEW
0.50
8X
1
0.25
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
ESD7554/D
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