CAT6243 D

CAT6243
1 Amp Adjustable CMOS
LDO Voltage Regulator
Description
The CAT6243 is a low dropout CMOS voltage regulator providing
up to 1000 mA of output current with fast response to load current and
line voltage changes. CAT6243 offers a user adjustable output voltage
from 0.8 V to 5.0 V and its low quiescent current make CAT6243 ideal
for energy conscious designs. CAT6243 is available in a DPAK−5
5−lead packages and in a space saving 3 mm x 3 mm WDFN−6
package with a power pad for heat sinking to the PCB.
www.onsemi.com
WDFN−6
3 x 3 mm
CASE 511AP
Features
•
•
•
•
•
•
•
•
•
•
•
•
DPAK−5
TO−252
CASE 369AE
Guaranteed 1000 mA Continuous Output Current
VOUT: 0.8 V to 5.0 V
Dropout Voltage of 350 mV Typical at 1000 mA
±2.0% Output Voltage Accuracy at Room Temperature
No−load Ground Current of 70 mA Typical
Full−load Ground Current of 140 mA Typical
“Zero” Current Shutdown Mode
Under Voltage Lockout
Stable with Ceramic Output Capacitors
Current Limit and Thermal Protection
4 and 5 Lead DPAK−5 and 3 mm x 3 mm WDFN−6 Power Packages
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
PIN CONNECTIONS
(Top Views)
1
EN
VIN
GND
ADJ
BYP
VOUT
GND
(Tab)
1
5
•
•
•
•
•
ADJ
VOUT
GND
VIN
EN
Typical Applications
DSP Core and I/O Voltages
FPGAs, ASICs
PDAs, Mobile Phones, GPS
Camcorders and Cameras
Hard Disk Drives
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 15 of this data sheet.
MARKING DIAGRAMS
6243
AXXX
YWW
G
1
6243
A
XXX
Y
WW
G
= Specific Device Code
= Assembly Location
= Last Three Digits of
= Assembly Lot Number
= Production Year
= Production Week (Two Digits)
= Pb−Free Package
x6243yG
ALYWW
G
A
L
Y
WW
*Pb−Free indicator, “G” or microdot “G”,
may or may not be present.
© Semiconductor Components Industries, LLC, 2016
March, 2016 − Rev. 10
x
6243
y
1
= P (CAT)
= Device Code
= Output Voltage
= W = Adjustable
= Pb−Free Package
= Assembly Location
= Wafer Lot
= Year
= Work Week
Publication Order Number:
CAT6243/D
CAT6243
VIN
VIN
VOUT
VOUT
ENABLE
CIN
1 mF
COUT
2.2 mF
CAT6243
BYP
CBYP
(Optional)
ADJ
GND
Figure 1. Application Schematic
VOUT
VIN
ISENSE
Thermal
Shutdown
+
ADJ
−
+
VREF −
Enable
Logic
EN
BYP
2.5 M
GND
Figure 2. Simplified Block Diagram
Table 1. PIN FUNCTION DESCRIPTION
Pin #
WDFN−6
Pin #
DPAK−5−5
Pin Name
1
5
EN
2, PAD
3, TAB
GND
Power Supply Ground; Device Substrate. The center pad is internally connected to Ground
and as such can cause short circuits to signal traces running beneath the IC. This pad is
intended for heat sinking the IC to the PCB and is typically connected to the PCB ground
plane.
3
NC
BYP
Bypass input. Placing a capacitor of 100 pF to 470 pF between BYP and ground reduces
noise on VOUT. This capacitor is optional and it increases the turn−on time.
4
2
VOUT
Regulated Output Voltage. A protection block eliminates any current flow from output to
input if VOUT > VIN.
5
1
ADJ
Output Voltage Adjust Input. This input ties to the common point of a resistor divider which
determines the regulator’s output voltage. See Applications section for details on selecting
resistor values.
6
4
VIN
Positive Power Supply Input. Supplies power for VOUT as well as the regulator’s internal
circuitry.
Description
The Enable Input. An active HIGH input, turning ON the LDO. This input should be tied to
VIN if the LDO is not intended to be shut off during normal operation. A pull−down 2.5 MW
resistor maintains the circuit in the OFF state if the pin is left open.
www.onsemi.com
2
CAT6243
Table 2. ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VIN
−0.3 to 6.0
V
VOUT
−0.3 to 6.0
V
Enable Input Range
EN
−0.3 to 5.5 V or (VIN + 0.3),
whichever is lower
V
Adjust Input Range
ADJ
−0.3 to 5.5 V
V
Bypass Input Range
BYP
−0.3 to 5.5 V or (VIN + 0.3),
whichever is lower
V
Power Dissipation
PD
Internally Limited
mW
TJ(max)
150
°C
TSTG
−65 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2
kV
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
TSLD
260
°C
Input Voltage Range (Note 1)
Output Voltage Range
Maximum Junction Temperature
Storage Temperature Range
Lead Temperature Soldering
Reflow (SMD Styles Only), Pb−Free Versions (Note 3)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating range.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating: ≤150 mA per JEDEC standard: JESD78
3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
Table 3. THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
°C/W
Thermal Characteristics, WDFN6, 3x3 mm
Thermal Resistance, Junction−to−Air: 1 in2/1 oz. copper (Note 4)
Thermal Reference, Junction−to−Case (Note 4)
RqJA
RyJL
55
10
Thermal Characteristics, DPAK−5
Thermal Resistance, Junction−to−Air: 1 in2/1 oz. copper (Note 4)
Thermal Reference, Junction−to−Tab (Note 4)
RqJA
RyJT
60
4.3
°C/W
4. Values based on copper area of 650 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate.
Table 4. OPERATING RANGES (Note 5)
Rating
Symbol
Min
Max
Unit
VIN
1.8
1.8
5.0
5.5
V
Output Current
IOUT
0.1
1000
mA
Output Voltage
VOUT
0.8
5.0
V
TA
−40
85
°C
Input Voltage (Note 6)
CAT6243−ADJ
CAT6243DC
Ambient Temperature
5. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating range.
6. Minimum VIN_MIN = 1.8 V or (VOUT + VDO), whichever is higher.
www.onsemi.com
3
CAT6243
Table 5. ELECTRICAL CHARACTERISTICS (VIN = (VOUT + 1 V) or VIN_MIN, whichever is higher, CIN = 1 mF, COUT = 2.2 mF, for
typical values TA = 25°C, for Bold values TA = −40°C to 85°C; unless otherwise noted.)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
0.8
0.8
4.5
5.0
V
−2
−2
−3
+2
+2
+3
INPUT / OUTPUT
VOUT
VOUT−ACC
VADJ
TCOUT
Output Voltage Range
Output Voltage Accuracy
CAT6243−ADJ
CAT6243DC
CAT6243DC
Initial accuracy, IOUT = 1 mA
Voltage at ADJ input
%
0.784
Output Voltage Temp. Coefficient
CAT6243−ADJ
CAT6243DC
IOUT
Output Current
VR−LINE
Line Regulation
VR−LOAD
CAT6243−ADJ
CAT6243DC
VOUT = 1.2 V
VOUT = 2.5 V
CAT6243−ADJ
CAT6243DC
0.0001
1
VIN = VOUT + 1.0 V to
VIN(max), IOUT = 10 mA
−0.2
±0.05
VIN = VOUT + 1.0 V to
VIN(max), IOUT = 10 mA
−0.35
CAT6243−ADJ
CAT6243DC
VOUT = 2.5 V
CAT6243−ADJ
CAT6243DC
1.5
Ground Current
IOUT = 300 mA
TA = 25°C
%
mV
110
130
IOUT = 1 A
TA = 25°C
625
650
350
400
275
100
IOUT = 0 mA
nA
mA
70
100
IOUT = 1000 mA
140
IOUT = 1000 mA
ISC
2
600
IOUT = 0 mA
IGND−SD
%/V
3
VOUT = 3.3 V
ADJ Input Current
0.2
85
VOUT = 1.2 V
IADJ
A
0.35
VOUT = 3.3 V
IGND
V
ppm/°C
IOUT = 100 mA to 1000 mA
VDO
0.816
25
50
IOUT = 100 mA to 1000 mA
Load Regulation
0.8
200
250
mA
Shutdown Ground Current
CAT6243−ADJ
CAT6243DC
VEN < 0.4 V
Output short circuit current limit
VOUT = 0 V
900
mA
f = 1 kHz, BYP = 470 pF,
IOUT = 10 mA
54
dB
f = 20 kHz, BYP = 470 pF,
IOUT = 10 mA
42
BW = 10 Hz to 100 kHz
BYP = 470 pF, IOUT = 10 mA
45
2
5
PSRR AND NOISE
PSRR
eN
Power Supply Rejection Ratio
CAT6243
Output Noise Voltage for 1.8 V output
mVrms
UVLO, ROUT AND ESR
VUVLO
ROUT−SH
ESR
Under voltage lockout threshold
1.65
ON resistance of Discharge Transistor
150
COUT equivalent series resistance
5
1.75
V
W
500
mW
7. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25_C. Low
duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
www.onsemi.com
4
CAT6243
Table 5. ELECTRICAL CHARACTERISTICS (VIN = (VOUT + 1 V) or VIN_MIN, whichever is higher, CIN = 1 mF, COUT = 2.2 mF, for
typical values TA = 25°C, for Bold values TA = −40°C to 85°C; unless otherwise noted.)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
ENABLE INPUT
VHI
Logic High Level
VIN = 1.8 to 5.5 V
VLO
Logic Low Level
VIN = 1.8 to 5.5 V
IEN
Enable Input Current
VEN = 0.4 V
VEN = VIN = 2.5 V
REN
Enable pull−down resistor
1.6
V
0.4
V
0.15
1
mA
1
3
2.5
MW
CBYP = 0 pF
230
ms
CBYP = 470 pF
1600
TIMING
TON
Turn−On Time
THERMAL PROTECTION
TSD
Thermal Shutdown
145
°C
THYS
Thermal Hysteresis
10
°C
7. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25_C. Low
duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
www.onsemi.com
5
CAT6243
TYPICAL CHARACTERISTICS
(shown for VOUT = 2.5 V, VIN = 3.5 V, IOUT = 1 mA, CIN = 1 mF, COUT = 4.7 mF, CBYP = 0, and TA = 25°C unless otherwise specified.)
2.55
2.52
2.53
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
2.54
2.52
2.51
2.50
2.49
2.48
2.47
2.46
2.45
2.49
100 200 300 400 500 600 700 800 900 1000
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
OUTPUT LOAD CURRENT (mA)
INPUT VOLTAGE (V)
Figure 3. Output Voltage vs. Load Current
Figure 4. Output Voltage vs. Input Voltage
150
100
140
90
GROUND CURRENT (mA)
GROUND CURRENT (mA)
2.50
2.48
0
130
120
110
100
90
80
70
60
50
5.5
80
70
60
50
40
30
20
10
0
0
100 200 300 400 500 600
0
700 800 900 1000
0.5
1.0 1.5 2.0
2.5 3.0
3.5 4.0
4.5 5.0 5.5
OUTPUT LOAD CURRENT (mA)
INPUT VOLTAGE (V)
Figure 5. Ground Current vs. Load Current
Figure 6. Ground Current vs. Input Voltage
3.0
400
350
2.5
OUTPUT VOLTAGE (V)
DROPOUT VOLTAGE (mV)
2.51
300
250
200
150
100
IOUT = 1 mA
2.0
IOUT = 1000 mA
1.5
1.0
0.5
50
0
0
0
100 200 300 400 500 600 700 800 900 1000
0
0.5
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
OUTPUT LOAD CURRENT (mA)
INPUT VOLTAGE (V)
Figure 7. Dropout Voltage vs. Load Current
Figure 8. Dropout Characteristics
www.onsemi.com
6
CAT6243
TYPICAL CHARACTERISTICS
1.2
1.2
1.0
1.0
ENABLE THRESHOLD (V)
ENABLE THRESHOLD (V)
(shown for VOUT = 2.5 V, VIN = 3.5 V, IOUT = 1 mA, CIN = 1 mF, COUT = 4.7 mF, CBYP = 0, and TA = 25°C unless otherwise specified.)
0.8
0.6
0.4
0.2
0
2.0
2.5
3.0
3.5
4.0
4.5
0.4
0.2
5.5
5.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.5
5.0
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 9. Rising Enable Threshold vs. Supply
Voltage
Figure 10. Falling Enable Threshold vs. Supply
Voltage
1400
80
1200
70
1000
60
VOUT = 0
PSRR (dB)
CURRENT LIMIT (mA)
0.6
0
1.5
800
600
400
50
40
30
20
200
10
0
0
0
1
2
3
4
1E+01 1E+02
5
1E+03
1E+04
1E+05
INPUT VOLTAGE (V)
FREQUENCY (Hz)
Figure 11. Current Limit on Output vs. Supply
Voltage
Figure 12. PSRR @ 10 mA
1E+06
80
GROUND CURRENT (mA)
820
ADJUSTABLE VOLTAGE (mV)
0.8
810
800
790
780
−40 −20
0
20
40
60
80
100
70
60
50
40
−40 −20
120
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 13. Adjustable Voltage vs. Temperature
Figure 14. Ground Current vs. Temperature
www.onsemi.com
7
CAT6243
TRANSIENT CHARACTERISTICS
(shown for VOUT = 2.0 V, VIN = 3.0 V, IOUT = 1 mA, CIN = 1 mF, COUT = 4.7 mF, CBYP = 0, and TA = 25°C unless otherwise specified.)
Figure 15. Enable Turn−On (1 mA Load)
Figure 16. Enable Turn−Off (1 mA Load)
Figure 17. Enable Turn−On (1000 mA Load)
Figure 18. Enable Turn−Off (1000 mA Load)
Figure 19. Enable Turn−On (1 mA Load)
CBYP = 470 pF
Figure 20. Enable Turn−On (1000 mA Load)
CBYP = 470 pF
www.onsemi.com
8
CAT6243
TRANSIENT CHARACTERISTICS
(shown for VOUT = 2.0 V, VIN = 3.0 V, IOUT = 1 mA, CIN = 1 mF, COUT = 4.7 mF, CBYP = 0, and TA = 25°C unless otherwise specified.)
Figure 21. Slow Enable Operation (1 mA Load)
Figure 22. Slow Enable Operation
(1000 mA Load)
Figure 23. Load Transient Response
(1 mA to 1000 mA)
Figure 24. Enable Turn−On (1 mA Load)
(VOUT = 0.8 V and VIN = 1.8 V)
Figure 25. Load Transient Response (1 mA to
400 mA) (VOUT = 0.8 V and VIN = 1.8 V)
Figure 26. Load Transient Response (1 mA to
800 mA) (VOUT = 0.8 V and VIN = 1.8 V)
www.onsemi.com
9
CAT6243
PIN FUNCTIONS
VIN
100 pF to 470 pF. Values larger than this will provide no
additional improvement and will further extend CAT6243’s
startup time.
A bypass capacitor is not required for operation and BYP
may be left open or floating if no capacitor is used but DO
NOT ground BYP as this will interfere with the error
amplifier’s functioning.
Positive Power Input. Power is supplied to the device
through the VIN pin. A bypass capacitor is required on this
pin if the device is more than six inches away from the main
input filter capacitor. In general it is advisable to include a
small bypass capacitor adjacent to the regulator. In
battery−powered circuits this is particularly important
because the output impedance of a battery rises with
frequency, so a bypass capacitor in the range of 1 mF to 10 mF
is recommended.
ADJ
ADJ = Adjust and is the voltage control input. ADJ
connects to the center point of a resistor divider which
determines the CAT6243’s output voltage. See Applications
Section for resistor selection guidelines.
GND
Ground. The negative voltage of the input power source.
The center pad on the back of the package is also electrically
ground. This pad is used for cooling the device by making
connection to the buried ground plane through solder filled
vias or by contact with a topside copper surface exposed to
free flowing air.
VOUT
VOUT is the regulator’s output and supplies power to the
load. VOUT can be shut off via the ENABLE input. All
CAT6243 members are designed to block reverse current,
meaning anytime VOUT becomes greater than VIN the pass
FET will be shut off so there is no reverse current flow from
output to input. CAT6243 is also equipped with an output
discharge transistor that is turned ON anytime ENABLE is
at a logic Low. This transistor ensures VOUT discharges to
0 V when the regulator is shutdown. This is especially
important when powering digital circuitry because if VOUT
fails to reach 0 V their POR (power−ON reset) circuitry may
not trigger and scrambled data or unpredictable operations
may result.
A minimum output capacitor of 2.2 mF should be placed
between VOUT and GND to insure stable operation.
Increasing the size of COUT, up to 22 mF, will improve
transient response to large changes in load current.
ENABLE
ENABLE is an active high logic input which controls the
regulator’s the output state. If ENABLE < 0.4 V the
regulator is shutdown and VOUT = 0 V. If ENABLE > 1.6 V
the regulator is active and supplying power to the load.
If the regulator is intended to operate continuously and
won’t be shut down from time to time ENABLE should be
tied to VIN.
BYP
The Bypass Capacitor input is used to decrease output
voltage noise by placing a capacitor between BYP and
ground. The recommended range of capacitance is from
www.onsemi.com
10
CAT6243
APPLICATIONS INFORMATION
Input Decoupling (CIN)
VIN
A ceramic or tantalum 1 mF capacitor is recommended and
should be connected close to the CAT6243’s package.
Higher capacitance and lower ESR will improve the overall
line and load transient response.
VOUT
ENABLE
CIN
BYP
CBYP
The minimum output decoupling value is 2.2 mF and can
be augmented to fulfill stringent load transient
requirements. The regulator works with ceramic chip
capacitors. Larger values, up to 22 mF, improve noise
rejection and load regulation transient response. The
CAT6243 is a highly stable regulator and performs well over
a wide range capacitor Equivalent Series Resistances (ESR).
As power in the CAT6243 increases, it may become
necessary to provide thermal relief. The maximum power
dissipation supported by this device is dependent upon
board design and layout. Mounting pad configuration on the
PCB, the board material, and the ambient temperature affect
the rate of junction temperature rise for the part. When the
CAT6243 has good thermal conductivity through the PCB,
the junction temperature will be relatively low even with
high power applications. The maximum dissipation the
CAT6243 can handle is given by:
P D(MAX) +
The output voltage can be adjusted from 0.8 V to 5.0 V
using resistors between the output and the ADJ input. The
output voltage and resistors are chosen using Equation 1 and
Equation 2.
0.8 V
I DIV
ǒ
R1 ^ R2
Ǔ
V OUT
*1
0.8 V
R 1Ǔ
ƪTJ(MAX) * TAƫ
R qJA
(eq. 4)
Since TJ is not recommended to exceed 125°C, then with
CAT6243 soldered to 645 mm2 (1 sq inch), 1 oz copper area,
FR4 PCB material can dissipate in excess of 1 W when the
ambient temperature (TA) is 25°C. Note that this assumes the
pad in the center of the package is soldered to the dissipating
copper foil. See Figure below for RqJA versus PCB area for
heat dissipating areas smaller than 645 mm2. Power
dissipation can be calculated from the following equations:
(eq. 1)
(eq. 2)
Ǔ
R2
Thermal Considerations
Output Voltage Adjust
R2 ^
GND
Input bias current, IADJ, for all practical designs can be
ignored (IADJ = 0). Considering that the lowest
recommended IOUT value is 100 mA, then, when there is no
load on VOUT, IDIV must be 100 mA to keep CAT6243 in
regulation. This then sets R2’s value using Equation 2 to
8 KW, which minimizes output noise. Use Equation 3 to find
the required value for R1. If needed, lower values for IDIV
can be considered, but not lower than 10 mA. The price will
be worse values for both load regulation and TCOUT.
The CAT6243 adjustable regulator will operate properly
under conditions where the only load current is through the
resistor divider that sets the output voltage. However, in the
case where the CAT6243 is configured to provide a 0.8 V
output, there is no resistor divider and the ADJ pin is
connected to VOUT. If the part is enabled under no−load
conditions, leakage current through the pass transistor at
junction temperatures above 85°C can approach several
microamperes, especially as junction temperature
approaches 150°C. If this leakage current is not directed into
a load, the output voltage will rise above nominal until a load
is applied. For this reason it is recommended that a minimum
load of 100 mA be present at all times. Normally the voltage
setting resistor divider will serve this function but if no
divider is used (VOUT = 0.8 V) then an external load of 8 KW
should be provided.
R1
) ǒI ADJ
R2
COUT
ADJ
Figure 27. Adjustable Output Resistor Divider
No−Load Regulation Considerations
ǒ
R1
CAT6243
Output Decoupling (COUT)
V OUT + 0.8 1 )
VOUT
VIN
P D [ V IN(I GND ) I OUT) ) I OUT(V IN * V OUT) (eq. 5)
(eq. 3)
or
V IN(MAX) [
www.onsemi.com
11
P D(MAX) ) (V OUT
I OUT ) I GND
I OUT)
(eq. 6)
CAT6243
300
1 oz C.F
250
Theta JA (°C/W)
2 oz C.F
1 oz Sim
200
2 oz Sim
150
100
50
0
0
25
50
75
100
125
150
175
200
225
250
275
300
650
Copper heat spreading area (mm2)
Figure 28. Thermal Resistance vs. PCB Copper Area for 3 mm x 3 mm WDFN Package
PCB Layout Top Layer and
connections to heat spreading plane
Close−up of pad area
Figure 29. Topside Copper Foil Pattern for Heat Dissipation
Design Hints
VIN and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is high
due to narrow trace width or long length, there is a chance
to pick up noise or cause the regulator to malfunction. Place
external components, especially the input and output
capacitors, as close as possible to the CAT6243, and keep
traces between power source and load as short as possible.
www.onsemi.com
12
CAT6243
PACKAGE DIMENSIONS
WDFN6 3x3, 0.95P
CASE 511AP
ISSUE O
A
D
B
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
L1
PIN 1
REFERENCE
2X
0.15 C
2X
0.15 C
0.10 C
DETAIL A
E
ALTERNATE TERMINAL
CONSTRUCTIONS
ÇÇ
ÇÇ
ÉÉ
EXPOSED Cu
TOP VIEW
DETAIL B
MOLD CMPD
ÉÉÉ
ÉÉÉ
ÇÇÇ
A3
A1
DETAIL B
ALTERNATE
CONSTRUCTIONS
A
7X
0.08 C
(A3)
SIDE VIEW
DETAIL A
6X
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMESNION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30
MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L
A1
C
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.35
0.45
3.00 BSC
2.40
2.60
3.00 BSC
1.50
1.70
0.95 BSC
0.20
−−−
0.30
0.50
−−−
0.15
SEATING
PLANE
D2
L
e
1
4X
3
SOLDERING FOOTPRINT*
6X
E2
6X
K
6
2.60
PKG
OUTLINE
0.63
4
6X
BOTTOM VIEW
b
0.10 C A B
0.05 C
1.70
3.30
NOTE 3
1
0.95
PITCH
6X
0.45
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
13
CAT6243
PACKAGE DIMENSIONS
DPAK−5 (TO−252, 5 LEAD)
CASE 369AE
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. THERMAL PAD CONTOUR OPTIONAL, WITHIN
DIMENSIONS SHOWN.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.15mm PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
C
A
E
b2
A
B
c2
D1
D
H
DETAIL A
1
2 3
4
E1
5
DIM
A
A1
b
b2
c
c2
D
D1
E
E1
e
H
L
L1
L2
c
e
SIDE VIEW
b
TOP VIEW
0.12
M
BOTTOM VIEW
C A B
H
C
A1
L2
GUAGE
PLANE
5.04
REF
2.74
REF
0.10 C
L
MILLIMETERS
MIN
MAX
2.10
2.50
0.00
0.13
0.40
0.60
5.14
5.54
0.40
0.60
0.40
0.60
5.40
6.30
4.80
5.10
6.35
6.80
4.75
5.05
1.27 BSC
9.50
10.20
1.39
1.78
2.50
2.90
0.51 BSC
L1
DETAIL A
BOTTOM VIEW
ALTERNATE
CONSTRUCTION
RECOMMENDED
SOLDERING FOOTPRINT*
5.70
6.00
10.50
5X
2.10
5X
1.27
PITCH
0.80
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
14
CAT6243
Table 6. ORDERING INFORMATION (Notes 8 − 11)
Output Voltage
Package
Shipping
CAT6243−ADJMT5T3
Adjustable
WDFN−6, 3 mm x 3 mm (Pb−Free)
3,000 / Tape & Reel
CAT6243DCADJ−RKG
Adjustable
DPAK 5 5−Lead (Pb−Free)
2,500 / Tape & Reel
Device
8. The standard lead finish is Matte−Tin.
9. For additional package and temperature options, contact your nearest ON Semiconductor Sales office.
10. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
11. For detailed information and a breakdown of device nomenclature and numbering systems, please see the ON Semiconductor Device
Nomenclature document, TND310/D, available at www.onsemi.com
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
www.onsemi.com
15
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CAT6243/D
Similar pages