CS8361 D

CS8361
5.0 V Dual Micropower
Low Dropout Regulator
with ENABLE and RESET
• 2 Regulated Outputs
− Standby Output 5.0 V ± 2%; 100 mA
− Tracking Output 5.0 V; 250 mA
• Low Dropout Voltage (0.4 V at Rated Current)
• RESET Option
• ENABLE Option
• Low Quiescent Current
• Protection Features
− Independent Thermal Shutdown
− Short Circuit
− 60 V Load Dump
− Reverse Battery
• Internally Fused Leads in SO−16L Package
• These are Pb−Free Devices
SO−16L
DW SUFFIX
CASE 751G
D2PAK−7
DPS SUFFIX
CASE 936AB
1
PIN CONNECTIONS AND
MARKING DIAGRAM
VIN
NC
1
VTRK
GND
GND
Adj
NC
ENABLE
CS8361
Features
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AWLYYWWG
The CS8361 is a precision Micropower dual voltage regulator with
ENABLE and RESET.
The 5.0 V standby output is accurate within ±2% while supplying
loads of 100 mA and has a typical dropout voltage of 400 mV.
Quiescent current is low, typically 140 mA with a 300 mA load. The
active RESET output monitors the 5.0 V standby output and is low
during power−up and regulator dropout conditions. The RESET
circuit includes hysteresis and is guaranteed to operate correctly with
1.0 V on the standby output.
The second output tracks the 5.0 V standby output through an
external adjust lead, and can supply loads of 250 mA with a typical
dropout voltage of 400 mV. The logic level ENABLE lead is used to
control this tracking regulator output.
Both outputs are protected against overvoltage, short circuit, reverse
battery and overtemperature conditions. The robustness and low
quiescent current of the CS8361 makes it not only well suited for
automotive microprocessor applications, but for any battery powered
microprocessor applications.
16
VSTBY
NC
NC
GND
GND
NC
NC
RESET
SO−16L
CS
8361
AWLYWWG
1
Pin 1. VSTBY
2. VIN
3. VTRK
4. GND
5. Adj
6. ENABLE
7. RESET
D2PAK−7
CS8361
A
WL
YY
WW
G
= Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2009
October, 2009 − Rev. 17
1
Publication Order Number:
CS8361/D
CS8361
VSTBY
5.0 V, 100 mA, 2.0%
VIN
Overvoltage
Shutdown
Current
Limit
Bandgap
RESET
BG
+
OVSD
BG
−
TSD OVSD
VIN
VTRK
250 mA
Current
Limit
Thermal
Shutdown
TSD
−
Adj
+
ENABLE
VSTBY
−
+
TSD OVSD
BG
RESET
+
GND
−
RESET
Figure 1. Block Diagram. Consult Your Local Sales Representative for Positive ENABLE Option
MAXIMUM RATINGS*
Rating
Value
Unit
−16 to 26
V
Positive Transient Input Voltage, tr > 1.0 ms
60
V
Negative Transient Input Voltage, T < 100 ms, 1.0 % Duty Cycle
−50
V
−0.3 to 10
V
Tracking Regulator (VTRK, Adj)
20
V
Standby Regulator (VSTBY)
10
V
Junction Temperature
−40 to +150
°C
Storage Temperature Range
−55 to +150
°C
2.0
kV
260 peak
230 peak
°C
°C
Supply Voltage, VIN
Input Voltage Range (ENABLE, RESET)
ESD Susceptibility (Human Body Model)
Lead Temperature Soldering
Wave Solder (through hole styles only) Note 1
Reflow (SMD styles only) Note 2
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. 10 seconds max.
2. 60 seconds max above 183°C
*The maximum package power dissipation must be observed.
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CS8361
ELECTRICAL CHARACTERISTICS (6.0 V ≤ VIN ≤ 26 V, IOUT1 = IOUT2 = 100 mA, −40°C ≤ TA ≤ +125°C,
−40°C ≤ TJ ≤ +150°C; unless otherwise stated.)
Test Conditions
Characteristic
Min
Typ
Max
Unit
−25
−
+25
mV
Tracking Output (VTRK)
VTRK Tracking Error (VSTBY − VTRK)
6.0 V ≤ VIN ≤ 26 V, 100 mA ≤ ITRK ≤ 250 mA.
Note 3
Adjust Pin Current, IAdj
Loop in Regulation
−
1.5
5.0
mA
Line Regulation
6.0 V ≤ VIN ≤ 26 V. Note 3
−
5.0
50
mV
Load Regulation
100 mA ≤ ITRK ≤ 250 mA. Note 3
−
5.0
50
mV
Dropout Voltage (VIN − VTRK)
ITRK = 100 mA.
ITRK = 250 mA
−
−
100
400
150
700
mV
mV
Current Limit
VIN = 12 V, VTRK = 4.5 V
275
500
−
mA
Quiescent Current
VIN = 12 V, ITRK = 250 mA, No Load on VSTBY
−
25
50
mA
Reverse Current
VTRK = 5.0 V, VIN = 0 V
−
200
1500
mA
Ripple Rejection
f = 120 Hz, ITRK = 250 mA, 7.0 V ≤ VIN ≤ 17 V
60
70
−
dB
Output Voltage, VSTBY
6.0 V ≤ VIN ≤ 26 V, 100 mA ≤ ISTBY ≤ 100 mA.
4.9
5.0
5.1
V
Line Regulation
6.0 V ≤ VIN ≤ 26 V.
−
5.0
50
mV
Load Regulation
100 mA ≤ ISTBY ≤ 100 mA.
−
5.0
50
mV
Dropout Voltage (VIN − VSTBY)
ISTBY = 100 mA.
ISTBY = 100 mA
−
−
100
400
150
600
mV
mV
Current Limit
VIN = 12 V, VSTBY = 4.5 V
125
200
−
mA
Short Circuit Current
VIN = 12 V, VSTBY = 0 V
10
100
−
mA
Quiescent Current
VIN = 12 V, ISTBY = 100 mA, ITRK = 0 mA
VIN = 12 V, ISTBY = 300 mA, ITRK = 0 mA
−
−
10
140
20
200
mA
mA
Reverse Current
VSTBY = 5.0 V, VIN = 0 V
−
100
200
mA
Ripple Rejection
f = 120 Hz, ISTBY = 100 mA, 7.0 V ≤ VIN ≤ 17 V
60
70
−
dB
−
0.8
1.2
2.0
V
Standby Output (VSTBY)
RESET ENABLE Functions
ENABLE Input Threshold
ENABLE Input Bias Current
VENABLE = 0 V to 10 V
−10
0
10
mA
RESET Threshold High (VRH)
VSTBY Increasing
4.59
4.87
VSTBY − 0.02
V
60
120
180
mV
4.53
4.75
VSTBY − 0.08
V
−
−
25
mA
RESET Hysteresis
RESET Threshold Low (VRL)
−
VSTBY Decreasing
RESET Leakage
−
Output Voltage, Low (VRLO)
1.0 V ≤ VSTBY ≤ VRL, RRST = 10 kW
−
0.1
0.4
V
Output Voltage, Low (VRPEAK)
VSTBY, Power Up, Power Down
−
0.6
1.0
V
150
150
180
165
−
−
°C
°C
30
34
38
V
Protection Circuitry (Both Outputs)
Independent Thermal Shutdown
Overvoltage Shutdown
VSTBY
VTRK
−
3. VTRK connected to Adj lead. VTRK can be set to higher values by using an external resistor divider.
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3
CS8361
PACKAGE PIN DESCRIPTION
PACKAGE PIN #
D2PAK, 7 Pin
SO−16L
PIN SYMBOL
1
16
VSTBY
2
1
VIN
3
3
VTRK
Tracking output voltage controlled by ENABLE delivering 250 mA.
4
4, 5, 12, 13
GND
Reference ground connection.
5
6
Adj
6
8
ENABLE
7
9
RESET
2, 7, 10, 11,
14, 15
NC
FUNCTION
Standby output voltage delivering 100 mA.
Input voltage.
Resistor divider from VTRK to Adj. Sets the output voltage on
VTRK. If tied to VTRK, VTRK will track VSTBY.
Provides on/off control of the tracking output, active LOW.
CMOS compatible output lead that goes low whenever VSTBY falls
out of regulation.
No connection.
CIRCUIT DESCRIPTION
ENABLE Function
VTRK Output Voltage
The ENABLE function switches the output transistor for
VTRK on and off. When the ENABLE lead voltage exceeds
1.4 V (Typ), VTRK turns off. This input has several hundred
millivolts of hysteresis to prevent spurious output activity
during power−up or power−down.
This output uses the same type of output device as VSTBY,
but is rated for 250 mA. The output is configured as a
tracking regulator of the standby output. By using the
standby output as a voltage reference, giving the user an
external programming lead (Adj lead), output voltages from
5.0 V to 20 V are easily realized. The programming is done
with a simple resistor divider (Figure 2), and following the
formula:
RESET Function
The RESET is an open collector NPN transistor,
controlled by a low voltage detection circuit sensing the
VSTBY (5.0 V) output voltage. This circuit guarantees the
RESET output stays below 1.0 V (0.1 V Typ) when VSTBY
is as low as 1.0 V to ensure reliable operation of
microprocessor− based systems.
B+
C1*
0.1 mF
VTRK + VSTBY
5.0 V, 100 mA
VSTBY
VIN
CS8361
(1 ) R1ńR2) ) IAdj
C2**
10 mF
ESR < 8.0 W
R3
RESET
VDD
MCU
RESET
I/O
ENABLE
R2
Adj
R1
GND
R1
If another 5.0 V output is needed, simply connect the Adj
lead to the VTRK output lead.
VTRK
SW 8.0 V,
250 mA
C3**
10 mF
ESR < 8.0 W
VTRK ∼ VSTBY(1 + R1/R2)
For VTRK ∼ 8.0 V, R1/R2 ∼ 0.6
*C1 is required if regulator is located far from power supply filter.
**C2 and C3 are required for stability.
Figure 2. Test and Application Circuit, 5.0 V, 8.0 V Regulator
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4
GND
CS8361
B+
C1*
0.1 mF
5.0 V, 100 mA
VSTBY
VIN
CS8361
VDD
C2**
10 mF
ESR < 8.0 W
R3
RESET
MCU
RESET
I/O
ENABLE
Adj
GND
SW 5.0 V,
250 mA
C3**
10 mF
ESR < 8.0 W
VTRK
GND
*C1 is required if regulator is located far from power supply filter.
**C2 and C3 are required for stability.
Figure 3. Test and Application Circuit, Dual 5.0 V Regulator
APPLICATION NOTES
External Capacitors
IOUT1(max) is the maximum output current, for the
application,
IOUT2(max) is the maximum output current, for the
application, and
IQ is the quiescent current the regulator consumes at both
IOUT1(max) and IOUT2(max).
Output capacitors for the CS8361 are required for
stability. Without them, the regulator outputs will oscillate.
Actual size and type may vary depending upon the
application load and temperature range. Capacitor effective
series resistance (ESR) is also a factor in the IC stability.
Worst−case is determined at the minimum ambient
temperature and maximum load expected.
Output capacitors can be increased in size to any desired
value above the minimum. One possible purpose of this
would be to maintain the output voltages during brief
conditions of negative input transients that might be
characteristic of a particular system.
Capacitors must also be rated at all ambient temperatures
expected in the system. To maintain regulator stability down
to −40°C, capacitors rated at that temperature must be used.
More information on capacitor selection for SMART
REGULATOR®s is available in the SMART REGULATOR
application note, “Compensation for Linear Regulators,”
document number SR003AN/D, available through the
Literature Distribution Center or via our website at
http://www.onsemi.com.
Once the value of PD(max) is known, the maximum
permissible value of RqJA can be calculated:
RQJA +
150° C * TA
PD
(2)
The value of RqJA can be compared with those in the
package section of the data sheet. Those packages with
RqJA’s less than the calculated value in equation 2 will keep
the die temperature below 150°C.
In some cases, none of the packages will be sufficient to
dissipate the heat generated by the IC, and an external
heatsink will be required.
VIN
Calculating Power Dissipation in a
Dual Output Linear Regulator
IIN
SMART
REGULATOR
Control
Features
The maximum power dissipation for a dual output
regulator (Figure 4) is
PD(max) + NJVIN(max) * VOUT1(min)NjIOUT1(max) )
NJVIN(max) * VOUT2(min)NjIOUT2(max) ) VIN(max)IQ (1)
IOUT1
IOUT2
VOUT1
VOUT2
IQ
where:
VIN(max) is the maximum input voltage,
VOUT1(min) is the minimum output voltage from VOUT1,
VOUT2(min) is the minimum output voltage from VOUT2,
Figure 4. Dual Output Regulator With Key
Performance Parameters Labeled.
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CS8361
Heat Sinks
where:
RqJC = the junction−to−case thermal resistance,
RqCS = the case−to−heatsink thermal resistance, and
RqSA = the heatsink−to−ambient thermal resistance.
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of RqJA:
RQJA + RQJC ) RQCS ) RQSA
RqJC appears in the package section of the data sheet. Like
RqJA, it too is a function of package type. RqCS and RqSA are
functions of the package type, heatsink and the interface
between them. These values appear in heat sink data sheets
of heat sink manufacturers.
(3)
ORDERING INFORMATION*
Package
Shipping†
CS8361YDPS7G
D2PAK−7
(Pb−Free)
50 Units/Rail
CS8361YDPSR7G
D2PAK−7
(Pb−Free)
750 / Tape & Reel
CS8361YDWF16G
SO−16L
(Pb−Free)
46 Units/Rail
CS8361YDWFR16G
SO−16L
(Pb−Free)
1000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
*Contact your local sales representative for other package options including PSOP−20, TO−220−7, DIP−16, and SO−20L.
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6
CS8361
PACKAGE DIMENSIONS
SO−16L
DWF SUFFIX
CASE 751G−03
ISSUE C
A
D
9
1
8
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
16X
M
14X
e
T A
S
B
h X 45 _
DIM
A
A1
B
C
D
E
e
H
h
L
q
S
L
A
0.25
B
B
A1
H
E
0.25
8X
M
B
M
16
q
SEATING
PLANE
T
C
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
10.15
10.45
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
PACKAGE THERMAL DATA
SO−16L
Parameter
D2PAK, 7−Pin
Unit
RqJC
Typical
18
3.5
°C/W
RqJA
Typical
75
10−50*
°C/W
*Depending on thermal properties of substrate. RqJA = RqJC + RqCA.
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CS8361
PACKAGE DIMENSIONS
D2PAK−7 (SHORT LEAD)
DPS SUFFIX
CASE 936AB−01
ISSUE B
A
E
L1
B
A
0.10
A
E/2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH AND GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.005 MAXIMUM PER SIDE. THESE DIMENSIONS
TO BE MEASURED AT DATUM H.
4. THERMAL PAD CONTOUR OPTIONAL WITHIN
DIMENSIONS E, L1, D1, AND E1. DIMENSIONS
D1 AND E1 ESTABLISH A MINIMUM MOUNTING
SURFACE FOR THE THERMAL PAD.
SEATING
PLANE
M
B A
M
E1
c2
D1
D
7X
H
e
b
0.13
M
B A
DETAIL C
VIEW A−A
c
A
M
B
H
SEATING
PLANE
A1
RECOMMENDED
SOLDERING FOOTPRINT*
0.424
DIM
A
A1
b
c
c2
D
D1
E
E1
e
H
L
L1
L3
M
INCHES
MIN
MAX
0.170
0.180
0.000
0.010
0.026
0.036
0.017
0.026
0.045
0.055
0.325
0.368
0.270
−−−
0.380
0.420
0.245
−−−
0.050 BSC
0.539
0.579
0.058
0.078
−−−
0.066
0.010 BSC
0°
8°
MILLIMETERS
MIN
MAX
4.32
4.57
0.00
0.25
0.66
0.91
0.43
0.66
1.14
1.40
8.25
9.53
6.86
−−−
9.65
10.67
6.22
−−−
1.27 BSC
13.69
14.71
1.47
1.98
−−−
1.68
0.25 BSC
0°
8°
L
M
0.310
L3
0.584
GAUGE
PLANE
DETAIL C
0.136
7X
0.040
0.050
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SMART REGULATOR is a registered trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
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8
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CS8361/D
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