ENA1983 D

Ordering number : ENA1983B
LV56831P
Monolithic Linear IC
Multi Voltage Regulator IC
for Car Audio Systems
http://onsemi.com
Overview
The LV56831P has 4 system regulator, VDD 5V(3.3V), AUDIO(8.5V), AMP remote(12V) and REG(3.3V/5V select).
About protection circuits, it has Over-current-protection, Over-voltage-protection and Thermal-shut-down. AMP
remote and REG supply is independent terminal from VCC.,
Features
• 4 system regulator
VDD(LCD micon) : VOUT 5.0V(3.3V), IO max 300mA, reverse current prevention.
Audio
: VOUT 8.5V, IO max 400mA
AMP remote
: VOUT 12V, IO max 500mA
REG3.3/5V
: VOUT 3.3V(5V), IO max 500mA
• Over-current-protection
• Over-voltage-protection: Typ 21V(except VDD)
• Thermal-shut-down Typ 175ºC
• Applied Pch-LDMOS for output stages.
(Warning)The protector functions only improve the IC’s tolerance and they do not guarantee the safety of the IC if used under the conditions out of
safety range or ratings. Use of the IC such as use under overcurrent protection range or thermal shut down state may degrade the IC’s reliability and
eventually damage the IC.
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Conditions
Conditions
Ratings
Unit
Supply voltage
VCC max
36
V
Allowable Power dissipation
Pd max
IC unit
1.3
W
(*Ta ≤ 25°C)
With Al heatsink(50×50×1.5mm3)
5.3
W
Infinite heat rediation
26
W
Peak supply voltage
VCC peak
See below pulse wave.
50
V
Operating ambient temperature
Topr
-40 to +85
°C
Storage temperature
Tstg
-55 to +150
°C
Junction temperature
Tj max
150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Semiconductor Components Industries, LLC, 2013
August, 2013
52312 SY/30712 SY/O2611 SY 20111014-S00007 No.A1983-1/9
LV56831P
Peak voltage testing pulse wave
50V
90%
10%
16V
5msec
100msec
Recommended Operating condition at Ta = 25°C
Parameter
Conditions
Ratings
Unit
Power supply voltage rating 1
VDD output(5V/3.3V)
7 to 16
V
Power supply voltage rating 2
REG output(5V3.3V): VCC=VCC1
7 to 16
V
Power supply voltage rating 3
AUDIO output
11 to 16
V
Power supply voltage rating 4
AMP remote output: VCC=VCC1
13 to 16
V
Electrical Characteristics at Ta = 25°C, VCC = VCC1 =14.4V (*1)
Parameter
Symbol
Ratings
Conditions
min
Quiescent current
ICC
typ
VDD no load, ALL EN terminal = ⎡L⎦
Unit
max
50
100
μA
0.5
V
AUDIO_EN Input
Low input voltage
VIL1
0
High input voltage
VIH1
2.0
Input impedance
RIH1
280
400
5.5
V
520
kΩ
AMP_EN Input
Low input voltage
VIL2
0
0.5
V
High input voltage
VIH2
2.0
5.5
V
Input impedance
RIH2
280
520
kΩ
400
REG_EN input
Low input voltage
VIL3
0
0.5
V
High input voltage
VIH3
2.0
5.5
V
Input impedance
RIH3
280
400
520
kΩ
5.0
5.25
VDD (5V/3.3V)output(reverse current prevention diode implemented)
VDD output voltage 1
VO11
IO11 = 200mA, IKVDD is connected to 5PIN.
4.75
VDD output current 1
IO11
VO11 ≥ 4.7V
300
VDD output voltage 2
VO12
IO12 = 200mA, IKVDD=GND
3.13
VDD output current 2
IO12
VO12 ≥ 3.1V
300
Line regulation
ΔVOLN1
7V < VCC < 16V, IO1 = 200mA
Load regulation
ΔVOLD1
Dropout voltage 1
VDROP1
VCC ripple rejection
RREJ1
f=120Hz, IO1=200mA
VDD reverse current
IREV
VO11=5.0V, VCC=0V
V
mA
3.3
3.47
V
mA
50
100
mV
1mA < IO11, IO12 < 200mA
80
150
mV
IO1 = 200mA (implemented diode)
1.5
2.5
40(*2)
50(*2)
V
dB
10
100
μA
12
12.6
V
50
100
mV
AMP remote output ; AMP_EN = High
USB output voltage 1
VO2
IO2 = 400mA
11.4
USB output current 1
IO2
VO2 ≥ 11.3V
500
Line regulation
ΔVOLN2
13V < VCC1 < 16V, IO2 = 400mA
Load regulation
ΔVOLD2
10mA < IO2 < 400mA
80
160
mV
Dropout voltage 1
VDROP2
IO2 = 400mA
0.4
0.8
V
VCC1 ripple rejection
RREJ2
f=120Hz, IO2=400mA
40(*2)
mA
50(*2)
dB
Continued on next page.
No.A1983-2/9
LV56831P
Continued from preceding page.
Parameter
Symbol
Ratings
Conditions
min
typ
Unit
max
AUDIO output ; AUDIO_EN = High
AUDIO output voltage
VO3
IO3 = 300mA
8.1
AUDIO output current
IO3
VO3 ≥ 8V
400
8.5
8.9
V
Line regulation
ΔVOLN3
10V < VCC < 16V, IO3 = 300mA
30
100
mV
Load regulation
ΔVOLD3
1mA < IO3 < 300mA
70
140
mV
Dropout voltage
VDROP3
IO3 = 300mA
0.6
1.05
V
VCC ripple rejection
RREJ3
f = 120Hz, IO3=300mA
mA
40(*2)
50(*2)
5
dB
REG (3.3V/5V) Output ; REG_EN = High
REG output voltage 1
VO41
IO41 = 400mA, IKREG is connected to 10PIN.
4.75
REG output current 1
IO41
VO41 ≥ 4.7V
500
REG output voltage 2
VO42
IO42 = 400mA, IKREG=GND
3.13
REG output current 2
IO42
VO42 ≥ 3.1V
500
Line regulation
ΔVOLN4
7V < VCC1 < 16V, IO4 = 400mA
Load regulation
ΔVOLD4
Dropout voltage
VDROP4
5.25
V
mA
3.3
3.47
V
mA
30
100
mV
1mA < IO4 < 400mA
80
150
mV
IO4 = 400mA
1.0
1.5
V
VCC1 ripple rejection
RREJ4
f = 120Hz, IO4=400mA
40(*2)
50(*2)
dB
*1: The entire specification has been defined based on the tests performed under the conditions where Tj and Ta(=25°C) are almost equal. There tests were
performed with pulse load to minimize the increase of junction temperature(Tj).
*2 : design certification
Package Dimensions
unit : mm (typ)
3336
21.6
HEAT SPREADER
(20.0)
3.0
(11.0)
(11.0)
3.35
12.4
(9.05)
(14.55)
17.9
(8.6)
(R1.75)
1
0.4
15
(1.91)
1.27
2.54 2.54
0.7
SANYO : HZIP15
1
3
5
7
9
11
13
14
REG3.3V/5V
GND
AMP_EN
12
AMP12V
10
IKREG
REG_EN
VCC
8
VCC 1
6
(NC)
IKVDD
(NC)
4
VDD
2
LV56831P
AUDIO
AUDIO_EN
(NC)
Pin assignment
15
No.A1983-3/9
LV56831P
Allowable power dissipation derating curve
Pd max -- Ta
Allowable power dissipation, Pd max - W
8
7
6
5.3
(a) IC unit(HZIP15)
(b) With Al heatsink(50×50×1.5mm3)
Al heatsink mounting conditions
Tightening torque: 39N·cm, using silicone
grease
5
Al heat sink (50 × 50 × 1.5mm3)
4
3
2
1.3
IC unit
1
0
0
50
25
75
100
125
150
Ambient temperature, Ta - C
Block Diagram
B+
VCC
+
8
Start
up
OverVoltage
Protection
+
AUDIO(8.5V)
3
+ 400mA
Vref
+
5
AUDIO_EN 2
6
VDD(5V/3.3V)
+ 300mA
IKVDD: VDD(3.3/5.0V) select
IKVDD=5PIN(VDD :5.0V)
IKVDD=GND: 3.3V
OUTPUT
REG_EN 10
9
Control
+
AMP_EN 12
Thermal
VCC1
+
ex.) DC-DC
13
AMP remote(12V)
+
500mA
11
IKREG: REG(3.3/5V) select
IKREG=10PIN(REG_EN): 5V
IKREG=GND: 3.3V
Shut Down
+
GND
14
15
REG(3.3V/5V)
+ 500mA
No.A1983-4/9
LV56831P
Pin Function
Pin No.
Pin name
Description
1
N.C.
-
2
AUDIO_EN
AUDIO output CTRL
Equivalent Circuit
-
VCC
8
2
14
3
AUDIO
AUDIO output when AUDIO_EN = High, ON
8.5V/0.4A
GND
VCC
8
3
14
4
N.C.
-
5
VDD
VDD output
5.0V, 3.3V/0.3A
GND
-
VCC
8
5
14
6
IKVDD
VDD output voltage select
OPEN : VDD = 5.0V
GND
VCC
8
GND : VDD = 3.3V
6
14
7
N.C.
-
8
VCC
VCC
9
VCC1
VCC1
GND
-
8
VCC
9
14
GND
Continued on next page.
No.A1983-5/9
LV56831P
Continued from preceding page.
Pin No.
10
Pin name
REG_EN
Description
Equivalent Circuit
REG output CTRL
9
VCC1
10
14
11
IKREG
GND
REG output voltage select
9
OPEN : REG = 3.3V
VCC1
GND : REG = 5.0V
11
12
AMP_EN
14
GND
9
VCC1
AMP output CTRL
12
14
13
AMP
GND
AMP output when AMP_EN = High, ON
9
12V, 0.5A
VCC1
13
14
14
GND
15
REG
GND
GND
REG output when REG_EN = High, ON
5.0V, 3.3V/0.5A
9
VCC1
15
14
GND
No.A1983-6/9
LV56831P
Timing Chart
21V
VCC
(8PIN)
VCC1
(9PIN)
VDD
(5PIN)
AMP_EN
(12PIN)
AMP
(13PIN)
AUDIO_EN
(2PIN)
AUDIO
(3PIN)
REG_EN
(10PIN)
REG
(15PIN)
No.A1983-7/9
LV56831P
HZIP15 Heat sink attachment
Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to
the outer environment and dissipating that heat.
a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be
applied to the heat sink or tabs.
b.
Heat sink attachment
· Use flat-head screws to attach heat sinks.
· Use also washer to protect the package.
· Use tightening torques in the ranges 39-59Ncm(4-6kgcm) .
· If tapping screws are used, do not use screws with a diameter larger
than the holes in the semiconductor device itself.
· Do not make gap, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Take care a position of via hole .
· Do not allow dirt, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Verify that there are no press burrs or screw-hole burrs on the heat sink.
· Warping in heat sinks and printed circuit boards must be no more than
0.05 mm between screw holes, for either concave or convex warping.
· Twisting must be limited to under 0.05 mm.
· Heat sink and semiconductor device are mounted in parallel.
Take care of electric or compressed air drivers
· The speed of these torque wrenches should never exceed 700 rpm, and
should typically be about 400 rpm.
Binding head
machine screw
Countersunk head
mashine screw
Heat sink
gap
Via hole
c.
Silicone grease
· Spread the silicone grease evenly when mounting heat sinks.
· Our company recommends YG-6260 (Momentive Performance Materials Japan LLC)
d.
Mount
· First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board.
· When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening
up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin
doesn't hang.
e.
When mounting the semiconductor device to the heat sink using jigs, etc.,
· Take care not to allow the device to ride onto the jig or positioning dowel.
· Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device.
f.
Heat sink screw holes
· Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used.
· When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used.
A hole diameter about 15% larger than the diameter of the screw is desirable.
· When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about
15% smaller than the diameter of the screw is desirable.
g.
There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not
recommended because of possible displacement due to fluctuation of the spring force with time or vibration.
No.A1983-8/9
LV56831P
ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number
of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at
www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no
warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the
application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual
performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical
experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use
as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in
which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for
any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors
harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or
death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the
part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PS No.A1983-9/9
Similar pages