MC100LVEL32 D

MC100LVEL32
3.3V ECL ÷2 Divider
Description
The MC100LVEL32 is an integrated ÷2 divider. The LVEL32 is
functionally identical to the EL32, but operates from a 3.3 V supply.
The reset pin is asynchronous and is asserted on the rising edge.
Upon power-up, the internal flip-flop will attain a random state; the
reset allows for the synchronization of multiple LVEL32’s in a system.
The VBB pin, an internally generated voltage supply, is available to
this device only. For single-ended input conditions, the unused
differential input is connected to VBB as a switching reference voltage.
VBB may also rebias AC coupled inputs. When used, decouple VBB
and VCC via a 0.01 mF capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, VBB should be left open.
Features
• 510 ps Propagation Delay
• 2.6 GHz Typical Maximum Frequency
• ESD Protection: Human Body Model; >4 kV,
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MARKING
DIAGRAMS*
8
8
1
KVL32
ALYW
G
SOIC−8
D SUFFIX
CASE 751
1
8
8
1
Machine Model; >200 V
The 100 Series Contains Temperature Compensation
TSSOP−8
DT SUFFIX
CASE 948R
•
• PECL Mode Operating Range:
1
KV32
ALYWG
G
VCC = 3.0 V to 3.8 V with VEE = 0 V
4E M G
G
• NECL Mode Operating Range:
VCC = 0 V with VEE = −3.0 V to −3.8 V
• Internal Input Pulldown Resistors
• Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
• Moisture Sensitivity Level 1
•
For Additional Information, see Application Note AND8003/D
Flammability Rating: UL 94 V−0 @ 0.125 in,
Oxygen Index: 28 to 34
Transistor Count = 111 devices
•
• Pb−Free Packages are Available
1
4
DFN8
MN SUFFIX
CASE 506AA
A
L
Y
W
M
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2008
August, 2008 − Rev. 10
1
Publication Order Number:
MC100LVEL32/D
MC100LVEL32
Table 1. PIN DESCRIPTION
Reset
CLK
1
8
R
2
VCC
7
Q
Pin
Function
CLK*, CLK**
Q, Q
Reset*
VBB
VCC
VEE
EP
÷2
CLK
3
6
Q
VBB
4
5
VEE
ECL Differential Clock Inputs
ECL Differential Data ÷2 Outputs
ECL Asynch Reset
Reference Voltage Output
Positive Supply
Negative Supply
(DFN8 only) Thermal exposed pad
must be connected to a sufficient
thermal conduit. Electrically connect to
the most negative supply (GND) or
leave unconnected, floating open.
*Pin will default low when left open, per internal 75 K pull−down to
VEE.
** Pin will default to VCC/2 when left open per internal 75 KW pulldown to VEE and 75 KW pull−up to VCC.
Figure 1. Logic Diagram and Pinout Assessment
Table 2. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
8 to 0
V
VEE
NECL Mode Power Supply
VCC = 0 V
−8 to 0
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI v VCC
VI w VEE
6 to 0
−6 to 0
V
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI v VCC
VI w VEE
6 to 0
−6 to 0
V
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
IBB
VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
SOIC−8
SOIC−8
190
130
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
SOIC−8
41 to 44 ± 5%
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−8
41 to 44 ± 5%
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
Tsol
Wave Solder
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
qJC
Thermal Resistance (Junction−to−Case)
35 to 40
°C/W
Pb
Pb−Free
(Note 1)
DFN8
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)
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2
MC100LVEL32
Table 3. LVPECL DC CHARACTERISTICS VCC = 3.3 V; VEE = 0.0 V (Note 1)
−40°C
Symbol
Min
Characteristic
25°C
Typ
Max
29
35
Min
85°C
Typ
Max
29
35
Min
Typ
Max
Unit
31
36
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 3)
2215
2295
2420
2275
2345
2420
2275
2345
2420
mV
VOL
Output LOW Voltage (Note 3)
1470
1605
1745
1490
1595
1680
1490
1595
1680
mV
VIH
Input HIGH Voltage (Single−Ended)
2135
2420
2135
2420
2135
2420
mV
VIL
Input LOW Voltage (Single−Ended)
1490
1825
1490
1825
1490
1825
mV
VBB
Output Voltage Reference
1.92
2.04
1.92
2.04
1.92
2.04
V
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration) (Note 7)
VPP < 500 mV
VPP y 500 mV
1.2
1.4
3.1
3.1
1.1
1.3
3.1
3.1
1.1
1.3
3.1
3.1
V
V
150
mA
IIH
Input HIGH Current
IIL
Input LOW Current
150
CLK
CLK
0.5
−600
150
0.5
−600
0.5
−600
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Input and output parameters vary 1:1 with VCC. VEE can vary ±0.3 V.
3. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
4. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal.
Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin and 1 V.
Table 4. LVNECL DC CHARACTERISTICS VCC = 0.0 V; VEE = −3.3 V (Note 5)
−40°C
Symbol
Min
Characteristic
25°C
Typ
Max
29
35
Min
85°C
Typ
Max
29
35
Min
Typ
Max
Unit
31
36
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 6)
−1085
−1005
−880
−1025
−955
−880
−1025
−955
−880
mV
VOL
Output LOW Voltage (Note 6)
−1830
−1695
−1555
−1810
−1705
−1620
−1810
−1705
−1620
mV
VIH
Input HIGH Voltage (Single−Ended)
−1165
−880
−1165
−880
−1165
−880
mV
VIL
Input LOW Voltage (Single−Ended)
−1810
−1475
−1810
−1475
−1810
−1475
mV
VBB
Output Voltage Reference
−1.38
−1.26
−1.38
−1.26
−1.38
−1.26
V
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 7)
VPP < 500 mV
VPP y 500 mV
−2.1
−1.9
−0.2
−0.2
−2.1
−1.9
−0.2
−0.2
−2.1
−1.9
−0.2
−0.2
V
V
150
mA
IIH
Input HIGH Current
IIL
Input LOW Current
150
CLK
CLK
0.5
−600
150
0.5
−600
0.5
−600
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Input and output parameters vary 1:1 with VCC. VEE can vary ±0.3 V.
6. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
7. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal.
Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin and 1 V.
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3
MC100LVEL32
Table 5. AC CHARACTERISTICS VCC = 3.3 V; VEE = 0.0 V or VCC = 0.0 V; VEE = −3.3 V (Note 8)
−40°C
Characteristic
Min
Typ
fmax
Maximum Toggle Frequency
2.2
2.5
tPLH
tPHL
Propagation Delay CLK to Q (Differential)
CLK to Q (Single−Ended)
Reset to Q
350
300
440
500
500
555
tRR
Reset Recovery
175
tPW
Minimum Pulse Width Reset
500
tJITTER
Random Clock Jitter (RMS)
VPP
Input Swing (Differential Swing) (Note 9)
150
tr
tf
Output Rise/Fall Times Q
(20% − 80%)
120
Symbol
25°C
Max
Min
Typ
2.4
2.6
370
320
450
510
510
540
50
175
300
500
530
580
640
2.0
225
85°C
Max
Min
Typ
2.6
2.8
410
360
480
540
540
580
50
175
50
ps
300
500
300
ps
2.0
ps
550
600
650
2.0
1000
150
320
120
225
1000
150
320
120
225
Max
Unit
GHz
590
640
680
ps
1000
mV
320
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
8. VEE can vary ±0.3 V.
9. VPP(min) is input swing measured single−ended on each input in differential configuration.
CLK
RESET
Q
Figure 1. Timing Diagram
Q
Zo = 50 W
D
Receiver
Device
Driver
Device
Q
D
Zo = 50 W
50 W
50 W
VTT
VTT = VCC − 2.0 V
Figure 2. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
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4
MC100LVEL32
ORDERING INFORMATION
Package
Package†
SOIC−8
98 Units / Rail
MC100LVEL32DG
SOIC−8
(Pb−Free)
98 Units / Rail
MC100LVEL32DR2
SOIC−8
2500 / Tape & Reel
MC100LVEL32DR2G
SOIC−8
(Pb−Free)
2500 / Tape & Reel
MC100LVEL32DT
TSSOP−8
100 Units / Rail
MC100LVEL32DTG
TSSOP−8
(Pb−Free)
100 Units / Rail
MC100LVEL32DTR2
TSSOP−8
2500 / Tape & Reel
MC100LVEL32DTR2G
TSSOP−8
(Pb−Free)
2500 / Tape & Reel
MC100LVEL32MNR4
DFN8
1000 / Tape & Reel
DFN8
(Pb−Free)
1000 / Tape & Reel
Device
MC100LVEL32D
MC100LVEL32MNR4G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPS I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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5
MC100LVEL32
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AH
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
MC100LVEL32
PACKAGE DIMENSIONS
TSSOP−8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R−02
ISSUE A
8x
0.15 (0.006) T U
0.10 (0.004)
S
2X
L/2
L
8
5
1
PIN 1
IDENT
0.15 (0.006) T U
K REF
M
T U
V
S
0.25 (0.010)
B
−U−
4
M
A
−V−
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
S
F
DETAIL E
C
0.10 (0.004)
−T− SEATING
PLANE
D
−W−
G
DETAIL E
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7
DIM
A
B
C
D
F
G
K
L
M
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
0.80
1.10
0.05
0.15
0.40
0.70
0.65 BSC
0.25
0.40
4.90 BSC
0_
6_
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
0.031
0.043
0.002
0.006
0.016
0.028
0.026 BSC
0.010
0.016
0.193 BSC
0_
6_
MC100LVEL32
PACKAGE DIMENSIONS
DFN8
CASE 506AA−01
ISSUE D
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
PIN ONE
REFERENCE
2X
0.10 C
2X
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
TOP VIEW
0.10 C
0.08 C
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.10
1.30
2.00 BSC
0.70
0.90
0.50 BSC
0.20
−−−
0.25
0.35
A
0.10 C
8X
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
E
(A3)
SIDE VIEW
A1
C
D2
e
e/2
4
1
8X
L
E2
K
8
5
8X
b
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
ECLinPS are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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MC100LVEL32/D