MC10EP56 D

MC10EP56, MC100EP56
3.3V / 5V ECL Dual
Differential 2:1 Multiplexer
Description
The MC10/100EP56 is a dual, fully differential 2:1 multiplexer. The
differential data path makes the device ideal for multiplexing low
skew clock or other skew sensitive signals. Multiple VBB pins are
provided.
The VBB pin, an internally generated voltage supply, is available to
this device only. For single−ended input conditions, the unused
differential input is connected to VBB as a switching reference voltage.
VBB may also rebias AC coupled inputs. When used, decouple VBB
and VCC via a 0.01 mF capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, VBB should be left open.
The device features both individual and common select inputs to
address both data path and random logic applications.
The 100 Series contains temperature compensation.
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MARKING DIAGRAMS*
20
MC100EP56
AWLYYWWG
SOIC−20
DW SUFFIX
CASE 751D
1
Features
• 360 ps Typical Propagation Delays
• Maximum Frequency > 3 GHz Typical
• PECL Mode Operating Range: VCC = 3.0 V to 5.5 V
TSSOP−20
DT SUFFIX
CASE 948R
with VEE = 0 V
• NECL Mode Operating Range: VCC = 0 V
•
•
•
•
•
•
XXXX
EP56
ALYWG
G
with VEE = −3.0 V to −5.5 V
Open Input Default State
Safety Clamp on Inputs
Separate and Common Select
Q Output Will Default LOW with Inputs Open or at VEE
VBB Outputs
These Devices are Pb−Free and are RoHS Compliant
20
1
QFN−20
MN SUFFIX
CASE 485E
XXXX
A
WL, L
YY, Y
WW, W
G, G
XXXX
EP56
ALYWG
G
= MC10 or 100
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
April, 2014 − Rev. 17
1
Publication Order Number:
MC10EP56/D
MC10EP56, MC100EP56
Q0
Q0
SEL0
20
19
18
17
1
1
D0a
2
D0a
COM_SEL
VCC
Table 1. PIN DESCRIPTION
SEL1
VCC
Q1
Q1
VEE
16
15
14
13
12
11
0
1
3
4
VBBO D0b
5
D0b
0
6
7
D1a D1a
8
VBB1
9
D1b
10
D1b
PIN
FUNCTION
D0a* − D1a*
ECL Input Data a
D0a* − D1a*
ECL Input Data a Invert
D0b* − D1b*
ECL Input Data b
D0b* − D1b*
ECL Input Data b Invert
SEL0* − SEL1*
ECL Indiv. Select Input
COM_SEL*
ECL Common Select Input
VBB0, VBB1
Output Reference Voltage
Q0 − Q1
ECL True Outputs
Q0 − Q1
ECL Inverted Outputs
VCC
Positive Supply
VEE
Negative Supply
EP
Exposed Pad
* Pins will default LOW when left open.
Warning: All VCC and VEE pins must be externally connected
to Power Supply to guarantee proper operation.
Table 2. TRUTH TABLE
Figure 1. 20−Lead Package (Top View) and Logic Diagram
SEL0
SEL1
COM_SEL
Q0,
Q0
Q1,
Q1
X
L
L
H
H
X
L
H
H
L
H
L
L
L
L
a
b
b
a
a
a
b
a
a
b
Exposed Pad
D0a
20
19
18
Q0
Q0
17
16
VBB0
1
15
SEL0
D0b
2
14
COM_SEL
D0b
3
D1a
4
12
VCC
D1a
5
11
Q1
MC10/100EP56
6
NOTE:
D0a VCC
7
8
9
13
SEL1
10
VBB1 D1b D1b VEE Q1
The Exposed Pad (EP) on package bottom must be attached to a heat−sinking conduit.
The Exposed Pad may only be electrically connected to VEE.
Figure 1. QFN−20 Pinout (Top View)
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2
MC10EP56, MC100EP56
Table 3. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
Value
75 kW
Internal Input Pullup Resistor
ESD Protection
N/A
Human Body Model
Machine Model
Charged Device Model
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
SOIC
TSSOP
QFN
Flammability Rating
Oxygen Index: 28 to 34
> 2 kV
> 150 V
> 2 kV
Pb Pkg
Pb−Free Pkg
Level 1
Level 1
N/A
Level 3
Level 3
Level 1
UL 94 V−0 @ 0.125 in
Transistor Count
140 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
6
V
VEE
NECL Mode Power Supply
VCC = 0 V
−6
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
6
−6
V
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
IBB
VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
20 TSSOP
20 TSSOP
140
100
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
20 TSSOP
23 to 41
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
20 SOIC
20 SOIC
90
60
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
20 SOIC
33 to 35
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
QFN−20
QFN−20
47
33
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
QFN−20
18
°C/W
Tsol
Wave Solder
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
Pb
Pb−Free
VI VCC
VI VEE
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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3
MC10EP56, MC100EP56
Table 5. 10EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 2)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
45
61
75
45
63
75
45
65
75
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 3)
2165
2290
2415
2230
2355
2480
2290
2415
2540
mV
VOL
Output LOW Voltage (Note 3)
1365
1490
1615
1430
1555
1680
1490
1615
1740
mV
VIH
Input HIGH Voltage (Single−Ended)
2090
2415
2155
2480
2215
2540
mV
1690
1460
1755
1490
1815
mV
1990
1855
2055
1915
2115
mV
3.3
2.0
3.3
2.0
3.3
V
150
mA
VIL
Input LOW Voltage (Single−Ended)
1365
VBB
Output Voltage Reference
1790
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 4)
IIH
Input HIGH Current
IIL
Input LOW Current
1890
2.0
1955
150
−150
2015
150
−150
mA
−150
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V.
3. All loading with 50 W to VCC − 2.0 V.
4. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 6. 10EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 5)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
45
61
75
45
63
75
45
65
75
mA
Output HIGH Voltage (Note 6)
3865
3990
4115
3930
4055
4180
3990
4115
4240
mV
VOL
Output LOW Voltage (Note 6)
3065
3190
3315
3130
3255
3380
3190
3315
3440
mV
VIH
Input HIGH Voltage (Single−Ended)
3790
4115
3855
4180
3915
4240
mV
VIL
Input LOW Voltage (Single−Ended)
3065
3390
3130
3455
3190
3515
mV
VBB
Output Voltage Reference
3490
3690
3555
3755
3615
3815
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 7)
5.0
2.0
5.0
2.0
5.0
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
IEE
Power Supply Current
VOH
3590
2.0
150
−150
3655
150
−150
−150
3715
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V.
6. All loading with 50 W to VCC − 2.0 V.
7. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
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MC10EP56, MC100EP56
Table 7. 10EP DC CHARACTERISTICS, NECL VCC = 0 V, VEE = −5.5 V to −3.0 V (Note 8)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
45
61
75
45
63
75
45
65
75
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 9)
−1135
−1010
−885
−1070
−945
−820
−1010
−885
−760
mV
VOL
Output LOW Voltage (Note 9)
−1935
−1810
−1685
−1870
−1745
−1620
−1810
−1685
−1560
mV
VIH
Input HIGH Voltage (Single−Ended)
−1210
−885
−1145
−820
−1085
−760
mV
VIL
Input LOW Voltage (Single−Ended)
−1935
−1610
−1870
−1545
−1810
−1485
mV
VBB
Output Voltage Reference
−1510
−1310
−1445
−1245
−1385
−1185
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 10)
0.0
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
−1410
VEE+2.0
0.0
−1345
VEE+2.0
0.0
150
−150
−1285
VEE+2.0
150
−150
mA
−150
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
8. Input and output parameters vary 1:1 with VCC.
9. All loading with 50 W to VCC − 2.0 V.
10. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 8. 100EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 11)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
50
61
75
50
63
77
55
66
80
mA
Output HIGH Voltage (Note 12)
2155
2280
2405
2155
2280
2405
2155
2280
2405
mV
VOL
Output LOW Voltage (Note 12)
1305
1480
1605
1305
1480
1605
1305
1480
1605
mV
VIH
Input HIGH Voltage (Single−Ended)
2075
2420
2075
2420
2075
2420
mV
VIL
Input LOW Voltage (Single−Ended)
1305
1675
1305
1675
1305
1675
mV
VBB
Output Voltage Reference
1775
1975
1775
1975
1775
1975
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 13)
3.3
2.0
3.3
2.0
3.3
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
IEE
Power Supply Current
VOH
1875
2.0
150
−150
1875
150
−150
−150
1875
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
11. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V.
12. All loading with 50 W to VCC − 2.0 V.
13. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
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MC10EP56, MC100EP56
Table 9. 100EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 14)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
50
61
75
50
63
77
55
66
80
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 15)
3855
3980
4105
3855
3980
4105
3855
3980
4105
mV
VOL
Output LOW Voltage (Note 15)
3005
3180
3305
3005
3180
3305
3005
3180
3305
mV
VIH
Input HIGH Voltage (Single−Ended)
3775
4120
3775
4120
3775
4120
mV
VIL
Input LOW Voltage (Single−Ended)
3005
3375
3005
3375
3005
3375
mV
VBB
Output Voltage Reference
3475
3675
3475
3675
3475
3675
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 16)
5.0
2.0
5.0
2.0
5.0
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
3575
2.0
3575
150
3575
150
−150
−150
mA
−150
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
14. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V.
15. All loading with 50 W to VCC − 2.0 V.
16. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 10. 100EP DC CHARACTERISTICS, NECL VCC = 0 V, VEE = −5.5 V to −3.0 V (Note 17)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
50
61
75
50
63
77
55
66
80
mA
Output HIGH Voltage (Note 18)
−1145
−1020
−895
−1145
−1020
−895
−1145
−1020
−895
mV
VOL
Output LOW Voltage (Note 18)
−1995
−1820
−1695
−1995
−1820
−1695
−1995
−1820
−1695
mV
VIH
Input HIGH Voltage (Single−Ended)
−1225
−880
−1225
−880
−1225
−880
mV
VIL
Input LOW Voltage (Single−Ended)
−1995
−1625
−1995
−1625
−1995
−1625
mV
VBB
Output Voltage Reference
−1525
−1325
−1525
−1325
−1525
−1325
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 19)
0.0
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
IEE
Power Supply Current
VOH
−1425
VEE+2.0
0.0
150
−150
−1425
VEE+2.0
0.0
150
−150
−1425
VEE+2.0
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
17. Input and output parameters vary 1:1 with VCC.
18. All loading with 50 W to VCC − 2.0 V.
19. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
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MC10EP56, MC100EP56
Table 11. AC CHARACTERISTICS VCC = 0 V; VEE = −3.0 V to −5.5 V or VCC = 3.0 V to 5.5 V; VEE = 0 V (Note 20)
−40°C
Symbol
Characteristic
Min
fmax
Maximum Frequency
(See Figure 2 Fmax/JITTER)
tPLH,
tPHL
Propagation Delay to
Output Differential
25°C
Typ
Max
Min
>3
85°C
Typ
Max
Min
>3
Typ
Max
>3
Unit
GHz
ps
D to Q, Q
SEL to Q, Q
COM_SEL to Q, Q
250
250
250
340
340
350
450
450
450
270
270
270
360
340
360
470
470
470
300
300
300
400
400
400
500
500
500
tSKEW
Within−Device Skew (Note 21)
Device to Device Skew
50
100
200
50
100
200
50
100
200
ps
tJITTER
Random Clock Jitter
(See Figure 2 Fmax/JITTER)
0.2
<1
0.2
<1
0.2
<1
ps
VPP
Input Voltage Swing
(Differential Configuration)
150
800
1200
150
800
1200
150
800
1200
mV
tr
tf
Output Rise/Fall Times
(20% − 80%)
70
120
170
80
130
180
100
150
230
ps
Q, Q
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
20. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V.
21. Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays
are measured from the cross point of the inputs to the cross point of the outputs.
10
9
5V
8
800
7
3.3 V
6
600
5
JITTEROUT ps (RMS)
VOUTamplitude (mVpp)
1000
ÉÉ
ÉÉ
ÉÉ
4
3
400
2
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
1
(JITTER)
200
1.0
0
1.5
2.0
2.5
FREQUENCY (GHz)
3.0
Figure 2. Fmax/Jitter @ 255C
Q
Zo = 50 W
D
Receiver
Device
Driver
Device
Q
Zo = 50 W
D
50 W
50 W
VTT
VTT = VCC − 2.0 V
Figure 3. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
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MC10EP56, MC100EP56
ORDERING INFORMATION
Package
Shipping†
MC10EP56DTG
TSSOP−20
(Pb−Free)
75 Units / Rail
MC10EP56DTR2G
TSSOP−20
(Pb−Free)
2500 / Tape & Reel
MC10EP56MNG
QFN−20
(Pb−Free)
92 Units / Rail
MC10EP56MNTXG
QFN−20
(Pb−Free)
3000 / Tape & Reel
MC100EP56DWG
SOIC−20
(Pb−Free)
38 Units / Rail
MC100EP56DWR2G
SOIC−20
(Pb−Free)
1000 / Tape & Reel
MC100EP56DTG
TSSOP−20
(Pb−Free)
75 Units / Rail
MC100EP56DTR2G
TSSOP−20
(Pb−Free)
2500 / Tape & Reel
MC100EP56MNG
QFN−20
(Pb−Free)
92 Units / Rail
MC100EP56MNTXG
QFN−20
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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MC10EP56, MC100EP56
PACKAGE DIMENSIONS
SOIC−20 WB
CASE 751D−05
ISSUE G
q
A
20
X 45 _
h
1
10
20X
B
B
0.25
M
T A
S
B
S
A
L
H
M
E
0.25
10X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
11
B
M
D
18X
e
A1
SEATING
PLANE
C
T
http://onsemi.com
9
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
MC10EP56, MC100EP56
PACKAGE DIMENSIONS
TSSOP−20
CASE 948E−02
ISSUE C
20X
0.15 (0.006) T U
2X
K REF
0.10 (0.004)
S
L/2
20
M
T U
S
V
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
K
K1
S
J J1
11
B
−U−
L
PIN 1
IDENT
SECTION N−N
0.25 (0.010)
N
1
10
M
0.15 (0.006) T U
S
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
N
F
DETAIL E
−W−
C
G
D
H
DETAIL E
0.100 (0.004)
−T− SEATING
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
PLANE
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
10
MILLIMETERS
MIN
MAX
6.40
6.60
4.30
4.50
--1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.252
0.260
0.169
0.177
--0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
MC10EP56, MC100EP56
PACKAGE DIMENSIONS
QFN20, 4x4, 0.5P
CASE 485E
ISSUE B
A
B
D
PIN ONE
REFERENCE
2X
0.15 C
ÉÉ
ÉÉ
ÉÉ
ÇÇ
ÉÉ
EXPOSED Cu
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
ÉÉ
ÉÉ
ÇÇ
A3
MOLD CMPD
A1
DETAIL B
OPTIONAL CONSTRUCTIONS
2X
0.15 C
L
L
TOP VIEW
(A3)
DETAIL B
L1
A
0.10 C
DETAIL A
OPTIONAL CONSTRUCTIONS
0.08 C
A1
SIDE VIEW
C
MILLIMETERS
MIN
MAX
0.80
1.00
--0.05
0.20 REF
0.20
0.30
4.00 BSC
2.60
2.90
4.00 BSC
2.60
2.90
0.50 BSC
0.20 REF
0.35
0.45
0.00
0.15
SEATING
PLANE
SOLDERING FOOTPRINT*
4.30
0.10 C A B
20X
0.58
D2
DETAIL A
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
20X
L
6
2.88
0.10 C A B
11
1
E2
1
2.88 4.30
20
K
20X
e
b
0.10 C A B
0.05 C
PKG
OUTLINE
NOTE 3
BOTTOM VIEW
20X
0.35
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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11
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MC10EP56/D