BRD8075 D

Smart Building/Internet-of-Things
Energy
Harvester
Boost / Flyback
Converters & Battery Management
System Power
Management
Battery
Processor / MCU
Non-Volatile
Memory & Security
Connectivity
Wireless
Wired
•
•
•
•
•
•
•
ZigBee
S-FSK
KNX
M-BUS
HART
6loWPAN
Proprietary
Sensors
•
•
•
•
•
•
•
Image
Light
Moisture
Pressure
Proximity
Temperature
Touch
Motor Control
•Seamlessly connected intelligent devices that sense, analyze and
control the environment
•Connected smart lighting, surveillance/security systems, HVAC
systems, home appliances, energy management systems, vehicles,
traffic control
•Key building blocks include sensors/actuators, ultra low power
MCUs/DSPs, connectivity, power management, security and
software, chip integration and micro-packaging
Page 2
Internet of Things Solutions
ON Semiconductor offers advanced packaging and integration capabilities, ranging from chip scale packaging through multichip
modules. This extensive portfolio of packaging technology helps customers solve their unique design challenges related to thermal
performance, power density, and low profile. Shown below is a small sample from the company’s broad and deep package portfolio.
PIM
IPM
DPAK
6.0 x 6.5 mm
SO8-FL
5.0 x 6.0 x 1.0 mm
SOT-883
1.0 x 0.6 x 0.4 mm
XDFN-4
0.8 x 0.8 x 0.4 mm
Advanced 3D Packaging
Custom 3D packaging connects different silicon die and discrete components
together in the same package to dramatically save space and improve electrical
performance by decreasing signal distances.
•Stacking with or without wirebonds
•Modular, scalable architectures with high
degree of manufacturing testability
•Mature, robust technologies and structures
•RoHS-compliant and ISO-certified
AYRE SA3291 - Wireless DSP SiP for Hearing Aids
Capacitors
Top Substrate
Die
Interposer
Solder Connections
Main Substrate
Solder Pads
Flip Chip Connections
ON Semiconductor
Page 3
PACKAGING
Broad Packaging Portfolio
Wireless Connectivity Solutions
Features
•Easy to use radio link
•Best RX sensitivities in class
•Best TX PA efficiencies in class
•Optimized for lowest power consumption
Development Software Support
•AXRadioLAB configurator/application generator
•AXCode::Blocks IDE
CONNECTIVITY
Device
Page 4
Frequency Band
(MHz)
Type
Data Transmission Standard
Package
AX5031
RF Transmitter
4-FSK; ASK; FSK; GFSK; MSK; PSK
400-470
800-940
QFN-20
AX5042
RF Transceiver
ASK; FSK; GFSK; MSK; PSK
400-470
800-940
QFN-28
AX5043
RF Transceiver
4-FSK; AFSK; ASK; FM; FSK; GFSK; GMSK;
MSK; PSK
27-1050
QFN-28
AX5051
RF Transceiver
FSK; MSK; PSK; ASK
400-470
800-940
QFN-28
AX5243
RF Transceiver
4-FSK; AFSK; ASK; FM; FSK; GFSK; GMSK;
MSK; PSK
27-1050
QFN-20
Internet of Things Solutions
Wireless Connectivity Solutions
Features
•Easy to use radio link
•Best RX sensitivities in class
•Best TX PA efficiencies in class
•Optimized modules and development kits
Development Software Support
CONNECTIVITY
•AXRadioLAB configurator/application generator
•AXCode::Blocks IDE
Device
Data
Transmission
Standard
Frequency
Band
(MHz)
Carrier
Frequency
(MHz)
Package
Type
Description
AX8052F131
RF Microcontroller
Ultra-low Power RF Microcontroller
4-FSK; ASK; FSK;
GFSK; MSK; PSK
400-470
800-940
—
QFN-40
AX8052F151
RF Microcontroller
Ultra-low Power RF Microcontroller
FSK; MSK; PSK;
ASK
400-470
800-940
—
QFN-40
AX8052F143
RF Microcontroller
Ultra-low Power RF Microcontroller
4-FSK; AFSK; ASK;
FM; FSK; GFSK;
GMSK; MSK; PSK
27-1050
—
QFN-40
Sigfox™
Sigfox SoC for Up-Link and
Down-Link
RF
868.3
868.13 TX;
869.53 RX
QFN-40
Sigfox
Sigfox SoC for Up-Link and
Down-Link
RF
868.3
868.13 TX;
869.53 RX
QFN-40
DVK-BASE-2-GEVK
Evaluation Kit
DVK-2 Base Evaluation Kit
—
—
—
Kit
ADD5043-169-2-GEVK
Evaluation Kit
Add-on kit for DVK-2 Evaluation Kit
—
169
—
Kit
ADD5043-433-2-GEVK
Evaluation Kit
Add-on kit for DVK-2 Evaluation Kit
—
433
—
Kit
ADD5043-868-2-GEVK
Evaluation Kit
Add-on kit for DVK-2 Evaluation Kit
—
868
—
Kit
AX-SIGFOX
AX-SIGFOX-API
ON Semiconductor
Page 5
2.4 GHz IEEE 802.15.4-2006 Wireless Transceiver
Low power, fully integrated system-on-chip
for secure wireless connectivity
INTERRUPT
AND
WAKEUP
CONTROL
ARM
CORTEX −M3
Instruction
NCS36510
Data
BUS MATRIX
I−code
SWDIO
D−code
DMA
320 kB
FLASH A
CONNECTIVITY
320 kB
FLASH B
•Integrates ARM® Cortex-M3 32-bit µP, 640kB FLASH,
48 kB RAM, hardware accelerated MAC
•AES 256 / 128 encryption engine
•Peripherals: DMA, UART (x2), SPI (x2), I2C (x2), PWM,
RTC, WDT, 18 GPIO, 10-bit ADC, programmable timers
(x3), temperature sensor, supply voltage sensor
•Programmable transmit power (up to ~8 dBm)
•Receiver sensitivity less than –99 dBm
•Antennae diversity
•Supports external LNA & PA
•<0.5 µA Timed Coma Mode Current
•6.9 mW Transmit Mode Power Consumption
•6.6 mW Receive Mode Power Consumption
•VDD includes low voltage mode with operation down
to 1.0 V
Software Ecosystem
System Bus
16 kB
SRAM A
RFPWR
TX
RX
32KO
UART 2
MAC
SPI 1
DEMODULATOR
SPI 2
2
I C1
RF ANALOG
CONTROL
I2 C 2
CLOCK
CTRL
32 kHz
32 MHz
DIO[17:0]
SUPPLY
MONITOR
RTC
SAR ADC
RESET
CTRL
V3V
V1VO
FVDDHI
C
R
O
S
S
B
A
R
PWM
WATCH
DOG
RESETN
FVDDHO
TEST
GPIO
32KI
V1VI
RESETN
UART 1
32MO
32MI
DIO[11]
VDDIO
POWER SEQ
RADIO
DIO[12]
PAD CONTROL
TIMERS
MODULATOR
SWD_RESET
TEST MODES
FLASH
CONTROL
VPA
SWO
DIO[13]
AHB to APB
BRIDGE
16 kB
SRAM B
16 kB
SRAM C
NCS36510 Features
SERIAL
WIRE
DEBUG
SWDCLK
PMU
DVDDA
DVDD
AVDDn
FVDDL
RVDDn
MUX
A[3:0]
TEMP SENSOR
128 AES
RANDOM
NUMBER
GENERATOR
NCS36510 Block Diagram
•2.4 GHz IEEE 802.15.4-2006 certified MAC/PHY
•ZigBee® PRO support included (ZHA, ZSE 1.x, ZLL, etc.)
•ZigBee IP support included (SE 2.0)
•802.15.4-2006 compatible applications
•Partner program for design services & support
Page 6
Internet of Things Solutions
PLC Modems/Power Line Driver
Communication
Coupling
Application
PHY
MAC
NCN49599
NCS5651
NCS5651
MCU
NCN49597/AMIS49587
MCU(s) with Third Party SW Stack (G3-PLC, PRIME...)
CONNECTIVITY
OFDM
S-FSK
AC
G3-PLC™ Reference Board
Device
Smart
Grid
Modem
Smart
Metering
Modem
Power
Amplifier
Function
Features
Package(s)
PLC S-FSK Modem;
A - D Band
• ARM Cortex M0
• Baud rate: 4800 Bauds
• S-FSK modulation
• Hardware embedded MAC + PHY
• Embedded 1.2 A, 2-stage power amplifier
NCN49597
PLC S-FSK Modem;
A - D Band
• ARM Cortex M0
• Baud rate: 4800 Bauds
• S-FSK modulation
• Hardware embedded MAC + PHY
QFN-52
AMIS49587
PLC S-FSK Modem;
A & B Band
• ARM7TDMi, 24 MHz core
• Baud rate: 2400 Bauds
• S-FSK modulation
• Hardware embedded MAC + PHY
QFN-52
NCS5651
Power Line Driver;
Class AB
• Low distortion power line driver with
optimized interface for PLC modems
• Capability to drive 2.0 A peak into
reactive loads
• Current shutdown minimizes power
consumption during power down state
• Rail-to-Rail Drop of Only ±1 V with
Iout = 1.5 A
NCN49599
ON Semiconductor
QFN-56
with current limitation and thermal protection
QFN-20 EP
Page 7
KNX Transceivers
KNX is a standardized (EN 50090, ISO/IEC 14543), OSI-based
network communications protocol for intelligent buildings. KNX is
the successor to, and convergence of, three previous standards:
KNX Open Standards
the European Home Systems Protocol (EHS), BatiBUS, and the
European Installation Bus (EIB or Instabus).
Applications
•EN 50090: European Standard
•ISO/IEC 14543-3: International Standard
•GB/Z 20965: Chinese Standard
•ANSI/ASHRAE 135: US Standard
•Connects appliances and sensors, especially for climate
and light control – wired or wireless – to the 9600 Baud
KNX twisted pair (TP) bus inside a building
CONNECTIVITY
Data
TP bus provides data communication
and power supply
RF
Power
TP
Seamless KNX radio connectivity
between application and target
Application
RF
AX8052F143
Twisted Pair
Multi/Ready
4
Efficiency Increase
High Sensitivity
4
10/20 mA Bus Current Consumption
Ultra Low Receive and Standby Current
4
5 to 40 mA Bus Current Consumption
4
KNX Bus Current Limitation
PHY + MAC
PHY + MAC Layer (TPUART Compatible)
NCN5120
4
NCN5121
NCN5110
NCN5130
4
4
4
4
4
4
4
4
4
4
4
3.3 V Fixed DC/DC
4
4
4
4
Adjustable DC/DC
4
4
4
4
20 V LDO
4
4
4
4
PHY Layer (Analog Only)
Analog Monitor Output
Page 8
4
4
4
4
Internet of Things Solutions
Wired M-BUS Transceiver
Features
CVDD
μC
VS
VIO
VDD
TXI
TX
RX
RXI
PFb
RIS
RIS
NCN5150
BUSL2
VB
BUSL1
SC
GND RIDD
CSC
CONNECTIVITY
•Satisfies physical requirements for M-BUS, described in EN 13757-2 and EN 1434-3
•UART communication speeds up to 38400 baud
•Integrated 3.3 V VDD LDO regulator (extended peak current of 15 mA)
•Supports powering slave device from the bus or from external power supply
•SOIC-16 and QFN-20 packages
RBUS1
TVS1
MBUS
RBUS2
STC
RIDD
CSTC
General Application Diagram
ON Semiconductor
Page 9
Modems
AMIS-49200 & AMIS-49250 Fieldbus Physical Layer Medium Access Units
•Compatible to both FOUNDATION Fieldbus H1 (Type 111 and Type 112
per FF-816) and PROFIBUS PA standards
•Enables Fieldbus to completely power field devices using the
integrated power supply block
•Data rate: 31.25 kbps voltage mode
•Low current consumption 500 μA typ
•LQFP-44 and NQFP-44 packages
CONNECTIVITY
Process
Sensor
Microprocessor
with RAM and ROM
Industrial HART Protocol Modems
Link
Controller
Fieldbus
Segment
Fieldbus
MAU
VDDA
1.8 V − 3.5 V
•Single-chip, half-duplex 1200 bps FSK modem
•Bell 202 shift frequencies of 1200 Hz and 2200 Hz
•Transmit-signal wave shaping
•Receive band-pass filter
VDD
VDDA
RxAFI
RxAF
RxAP
RESET
VPOR
HART IN
RxAN
KICK
RxD
HART Modems
Device
NCN5193
NCN5192
A5191HRT
Page 10
TxD
Input
Frequency
DAC
460.8 kHz,
920 kHz,or
1.8 MHz
Integrated
16-bit
Sigma-Delta
460.8 kHz,
920 kHz,or
1.8 MHz
460.8 kHz
VDDA
CD
Integrated
16-bit
Sigma-Delta
External
Temp Range
(°C)
Package
μC
RTS
AREF
NCN5193
CDREF
CS
DATA
–40 to +85
QFN-32
CLK1
DAC
CLK2
JUMP
–40 to +85
QFN-32
–40 to +85
QFN-32,
LQFP-32,
PLCC-28
VDDA
DACREF
XOUT
3.6864 MHz
HART &
4 – 20 mA OUT
TxA
SCLK
TEST2
TEST1
XIN
CBIAS
VSS
MODE
Internet of Things Solutions
CAN Transceivers for Long Networks, >500 m
CAN
BUS 1
VBAT
5 V−reg
CD
100 nF
EN2
Rx0
Tx0
Text
Rint
Features
•ISO 11898-2 compliant
•Up to 1 Mb/s communication speed
•Delivers low transmit data rate in networks
exceeding 1 km
•Functional in 12 V and 24 V systems
10
Vref
8 13 CANH1
12
2
7
4
14
AMIS–42770
19
3
9
5
18
6 15 16 17
CANL1
RLT
60
CANH2
CANL2
RLT
60
CONNECTIVITY
VCC
EN1
CAN
BUS 2
GND
CAN Transceivers
Device
ON Semiconductor
Type
Description
Package
AMIS42770
Dual
High-Speed CAN Repeater
SOIC-20
AMIS42670
Single
High-Speed CAN Transceiver for Long Networks
SOIC-8
AMIS42671
Single
High-Speed CAN Transceiver for Long Networks
SOIC-8
AMIS42673
Single
High-Speed CAN Transceiver for Long Networks
SOIC-8
AMIS42675
Single
High-Speed CAN Transceiver for Long Networks
SOIC-8
Page 11
Motion Detector Passive Infrared Controller (PIR) — NCS36000
•Passive infrared controller circuit for the lighting and occupancy sensing market
•Amplifies and conditions signal from PIR sensor
CONNECTIVITY
Features
Benefits
•3.0 – 5.75 V operation
•Integrated low noise 2-stage amplifiers
•Internal voltage reference to drive sensor
•Internal oscillator with external RC
•Single or dual pulse detection
•Digital filter to minimize false alarms
•Direct drive of LED and relay
•Lower BOM cost than comparable discrete solutions
•Extremely flexible solution
•Customer can customize digital filtering
•Customer can customize analog processing
•Designed for wide range of occupancy sensors
VSS VDD
VREF
LDO &
Voltage
References
OP1_P
OP1_N
OP1_O
OP2_N
OP2_O
Amplifier
Circuit
OSC
System
Oscillator
Page 12
2
MODE
Window 2
Comparator
Digital
Control
Circuit
xLED_EN
LED
OUT
NCS36000
Old Solution
NCS36000 Solution
Internet of Things Solutions
Power-Over-Ethernet (PoE ) Controllers
Features – NCP1083
NCP1083, consisting of fully compliant PoE functionality and DC-DC controller, may be used to drive LED lamps. Additionally, lamps may
be controlled remotely through PoE.
•Emits white color of ~2700°K
•LED lamp overall maximum power output 33 W
•Peak efficiency ~89%
•LED lamp powered by PSE directly over NCP1083 load
switch circuitry; DC-DC controller can provide 3.3 V, 5 V or
15 V power supply
•LED drivers operate in buck operation mode, switching
frequency about 1.05 MHz, PWM dimming frequency 16
kHz
•DC-DC controller working frequency up to 500 kHz, flyback topology used
•Under-voltage startup level set to 38 V, or programmble
down to 8.5 V; current limit 970 mA
•Auxiliary input voltage range from 9.0 V to 57 V
•Integrated DC-DC converter controller implements highly efficient
power conversion at low output voltages in conjunction with
auxiliary voltage input
CONNECTIVITY
IEEE 802.3at + Auxiliary, 40 W
•Delivers 25.5 W for PoE+ IEEE 802.3at and up to 40 W in
proprietary applications
•Supports IEEE two event classification
•Best-in-class cable ESD and thermal characteristics
VAUX(+)
1SMA58A
MBRS1100
Data
Pairs
VOUT
VPORTP
CLASS
VDDL
INRUSH
NCP1083
ILIM1
MBRS1100
nCLASS_AT
UVLO
GATE
AUX
Spare
Pins
VPORTIN
RTN
COMP
TL431
VAUX(–)
Device
Description
Topology
Control
Mode
VCC Min
(V)
VCC Max
(V)
NCP1080
PoE-PD Controller and DC-DC Converter
Flyback
Current
0
NCP1081
PoE-PD Controller and DC-DC Converter
Flyback
Current
0
NCP1082
PoE-PD Controller and DC-DC Converter, with Auxiliary Supply Support
Flyback
Current
NCP1083
PoE-PD Controller and DC-DC Converter, with Auxiliary Supply Support
Flyback
Current
NCP1090
PoE-PD Interface Controller
—
NCP1091
PoE-PD Interface Controller with Programmable UVLO
—
NCP1092
PoE-PD Interface Controller with Vaux Support
NCP1093
PoE-PD Interface Controller
NCP1094
PoE-PD Interface Controller with Vaux Support
ON Semiconductor
Pd Typ
(W)
Ron Typ
(Ω)
Package
57
15
0.6
TSSOP-20
57
40
0.6
TSSOP-20
0
57
15
0.6
TSSOP-20
0
57
40
0.6
TSSOP-20
—
0
57
15
0.5
SOIC-8, TSSOP-8
—
0
57
15
0.5
SOIC-8, TSSOP-8
—
—
0
57
15
0.5
SOIC-8, TSSOP-8
—
—
0
57
25
0.5
DFN-10
—
—
0
57
25
0.5
DFN-10
Page 13
Smart Card Interfaces
VDDP
10 uF
VDD
100 nF
100 uF
VDDP
VDD
Microcontroller
R1
VDD
R2
Features
CONTROL
DATAPORT
CONNECTIVITY
•ISO & EMV compliance
•ESD protection on card pins up to
+8kV (Human Body Model)
INT
NCN8024R
CRD_PRES
PORADJ
CRD_PRES
CMDVCC
5V/3V
CRD_VCC
CRD_RST
CLKDIV1
CLKIN
CRD_CLK
CRD_AUX1
CRD_AUX2
CRD_IO
RSTIN
CRD_GND
CLKDIV2
I/Ouc
SMART CARD
100
nF
220
GND nF
GND
1
2
3
4
DET
DET
Vcc
RST
CLK
C4
GND
Vpp
I/O
C8
5 GND
6
7
8
GNDP
AUX1uc
AUX2uc
GND
GND
Ports
Control
Interface
Card
Type
VDD mC Interface
(V)
Power
Supply
NCN6001
1
SPI
A, B, C
2.7 – 5.5
NCN8024R
1
Parallel
A, B
1/3
Parallel
NCN8026
1
NCN4555
1
Device
Smart
Card NCN8025/A
(SAM/SIM)
(SAM/SIM)
SAM
Sequencer
Card
Detect
Clock
Divider
Standards
Package(s)
Inductive
DC-DC
Yes
Yes
Yes
ISO7816; EMV4.3
TSSOP-20,
TLLGA-20
2.7 – 5.5
LDO
Yes
Yes
Yes
ISO7816; EMV4.3
SOIC-28W
A, B, C
2.7 – 5.5
LDO
Yes
Yes
Yes
ISO7816; EMV4.3;
UICC
QFN-16,
QFN-24
Parallel
A, B, C
1.6 – 5.5
LDO
Yes
Yes
Yes
ISO7816; EMV4.3;
UICC; SIM
QFN-24
Parallel
B, C
1.8 – 5.5
LDO
No
No
No
UICC; SIM
QFN-16
NCN8024R Demo Board
Page 14
Internet of Things Solutions
MatrixCam™ Video Development Kit
The MatrixCam Video Development Kit (VDK) enables fast time-to-market for IoT developers and innovators by providing vision and
connectivity based on an open source platform solution.
Features
•1080p @ 30 fps video-on-demand, streaming over Ethernet & Wi-Fi®
•Configurable resolution for HDR and linear video and still images
•Live streaming and recording on local storage and over the cloud on wake-up
from standby
•Bluetooth® Low Energy (BLE) and PIR wake-up from standby
•Android™ and iOS® app for device control and watching the stream remotely
•AR023Z: 2 MP, 1/2.7-inch, 3 mm pixel, HDR CMOS Image Sensor with
superior low light performance
ON Semiconductor
Description
ON Semiconductor AR023Z
2 MP/1080p CMOS image sensor with superior low light performance
Gainspan Wi-Fi Module
GS2011M module streams data over Wi-Fi
Bluetooth Module
Noridc BLE nRF51822
TI DM368
ARM9 core, high performance digital media system on chip
PIR Motion Sensor
Triggers camera functions on motion detection
Microphone
Omnidirectional microphones
LEDs
For power, video streaming
USB Port
Provides power to board, firmware upgrades
Battery
4200 mAH Lithium-ion battery
Storage
Micro SD card slot
SENSING
Major Components
Page 15
Mainstream CMOS Image Sensors
CFA
Operating
Temp
(°C)
ERS
Color
-30 to +70
ERS
Color
-30 to +70
3.8
ERS
Color
-40 to +105
5.6
ERS
Color
-40 to +105
60 fps
5.6
ERS
Color
-30 to +70
60 fps
6.0
ERS
Color
-40 to +105
1/3”
60 fps
6.0
GS
Color, Mono, RCCC
-40 to +105
WVGA
1/3”
60 fps
6.0
GS
Color, Mono
-30 to +70
0.5
1/5”
66 fps
3.8
ERS
Color, RCCC
-40 to +105
Sensor
1.2
1/4”
1.2 45 fps, 720p60
3.0
ERS
Color
-30 to +85
AR0140AT
Sensor
1.0
1/4”
60 fps
3.0
ERS
Color
-40 to +105
AR0141CS
Sensor
1.0
1/4”
1.2 45 fps, 720p60
3.0
ERS
Color, Mono, RGB-IR
-30 to +85
AR0130CS
Sensor
1.2
1/3”
1.2 45 fps, 720p60
3.8
ERS
Color, Mono
-30 to +70
AR0132AT
Sensor
1.2
1/3”
1.2 45 fps, 720p 60 fps
3.8
ERS
Color, Mono, RCCC
-40 to +105
AR0134CS
Sensor
1.2
1/3”
1.2 54 fps, 720p60
3.8
GS
Color, Mono
-30 to +70
MT9M021/31
Sensor
1.2
1/3”
1.2 45 fps, 720p60
3.8
GS
Mono
-30 to +70
MT9M024/34
Sensor
1.2
1/3”
1.2 45 fps, 720p60
3.8
ERS
Color, Mono
-30 to +70
MT9M114
SOC
1.3
1/6”
1.3 30 fps, VGA 75 fps
1.9
ERS
Color
-30 to +70
MT9M001
Sensor
1.3
1/2”
30 fps
5.2
ERS
Mono
0 to +70
MT9D131
SOC
1.9
1/3.2”
1.9 15 fps, SVGA 30 fps
2.8
ERS
Color
-30 to +70
AR023Z
Sensor
2.1
1/2.7”
1080p 60 fps
3.0
ERS, GRR
RGB Bayer
-30 to +85
AR0237
Sensor
2.1
1/2.7”
1080p60
3.0
ERS
Color
-30 to +85
AR0261
Sensor
2.1
1/6”
1080p60
1.4
ERS
Color
-30 to +70
AS0260
SOC
2.1
1/6”
30 fps
1.4
ERS
Color
-30 to +70
AR0231AT
Sensor
2.3
—
40 fps
3.0
—
RGB
—
AR0331
Sensor
3.1
1/3”
1080p60
2.2
ERS, GRR
Color
-30 to +85
AR0333
Sensor
3.1
1/3”
1080p30
2.2
ERS
Color
-30 to +85
AR0330
Sensor
3.5
1/3”
1080p60
2.2
ERS, GRR
Color
-30 to +70
AR0543
Sensor
5.0
1/4”
5 15 fps, 1080P 30fps
1.4
ERS
Color
-30 to +70
MT9P006
Sensor
5.0
1/2.5”
5 15 fps, 720p60
2.2
ERS, GRR
Color
-30 to +70
MT9P031
Sensor
5.0
1/2.5”
5 15 fps, 720p60
2.2
ERS, GRR
Color, Mono
-30 to +70
AR0833
Sensor
8.0
1/3.2”
8 30 fps, 1080P 30fps
1.4
ERS, GRR
Color
-30 to +70
AR0835
Sensor
8.0
1/3.2”
8 42 fps, 1080P 60fps
1.4
ERS, GRR
Color
-30 to +70
MT9J003
Sensor
10
1/2.3”
10 15 fps, 1080p60
1.7
ERS, GRR
Color, Mono
-30 to +70
AR1011HS
Sensor
10
1”
60 fps
3.4
ERS
Color
-30 to +70
AR1335
Sensor
13
1/3.2”
13 30 FPS, 1080p 60 fps
1.1
ERS
Color
-30 to +70
MT9F002
Sensor
14
1/2.3”
14 13 fps
1.4
ERS, GRR
Color
-30 to +70
AR1820HS
Sensor
18
1/2.3”
18 24 fps, 1080p 120 fps
1.3
ERS, GRR
Color
-30 to +70
Sensor/
SOC
Resolution
(MP)
Optical
Format
Frame Rate
MT9V115
SOC
VGA
1/13”
30 fps
1.8
MT9V124
SOC
VGA
1/13”
30 fps
1.8
ASX350AT
SOC
VGA
1/5”
60 fps digital, 30 fps analog
ASX340AT
SOC
VGA
1/4”
60 fps digital, 30 fps analog
ASX340CS
SOC
VGA
1/4”
MT9V128
SOC
VGA
1/3”
MT9V024
Sensor
WVGA
MT9V034
Sensor
ARX550AT
Sensor
AR0140CS
Device
Pixel Size
(mm)
Shutter Type1
SENSING
1. ERS = Electronic Rolling Shutter, GRR = Global Reset Release, GS = Global Shutter
Page 16
Internet of Things Solutions
Co-Processors for Mainstream CMOS Image Sensors
Available Features
Device
Resoution
(MP)
Frame Rate
(fps)
Video
Output Format
Package
AP0100AT
1
45
720p/60 fts, NTSC/PAL
YUV
VFBGA-100
AP0100CS
1
45
1.2 MP/45 fps; 720p/60 fps
NTSC/PAL; YUV
VFBGA-100
AP0101AT
1
45
1.2 MP/45 fts; 720p/60 fps
SMPTE 296M; YUV
VFBGA-81
AP0101CS
1
45
1.2 MP/45 fps; 720p/60 fps
SMPTE 296M; YUV
VFBGA-81
AP0102AT
1
—
1.2 MP/45 fps; 720p/60 fps; 1080p/30 fps
RGB; YUV
VFBGA-100
AP0200AT
2
30
1.2 MP/45 fps; 720p/60 fps; 1080p/30 fps
H.264; MJPEG
VFBGA-100
AP0201AT
2
30
1.2 MP/45 fps; 720p/60 fps; 1080p/30 fps
H.264; MJPEG
VFBGA-100
AP0202AT
2
30
1.2 MP/45 fps; 720p/60 fps; 1080p/30 fps
RGB565; RGB888; YUV
VFBGA-100
AP1302
13
30
13 MP/30 fps; 1080p/120 fps
JPEG; RAW; RGB565; RGB888; YUV
VFBGA-120
ON Semiconductor
Page 17
SENSING
•HDR with ALTM
•Dewarp, up to 165 degrees
•Spatial Transform Engine Software Add-on
•Overlays
•GPIOs, up to 5
•Color Pipe
• Noise reduction
• Demosaic
• Auto exposure
• Gamma correction
• Auto white balance • Flicker detection
• Defect correction
High Performance CMOS Image Sensors
VITA image sensors combine flexibility in configuration and resolution with high speed and high sensitivity, addressing a wide range of
customer requirements in a cost-effective family of rolling/global shutter CMOS image sensors. A flexible read-out architecture makes
them well suited for machine vision, intelligent transportation systems and surveillance, and other applications that demand high
functionality, while delivering excellent image quality.
Features
•1.3 to 25 Megapixels
•Pipelined and triggered global shutter
with dual readout
•Rolling shutter with CDS
•Quadratic speed increase with ROI
windowing
•Multiple regions of interest
VITA 5000
VITA 25K
Device
SENSING
VITA 1300
VITA 2000
VITA 5000
VITA 12K
VITA 16K
VITA 25K
Resolution
(MPix)
Pixel Count
(H x V)
Pixel
(mm)
Diagonal
(mm)
Lens
CFA1
FPS Max
Evaluation
Kit
1.3
2.3
5.3
12.6
16.8
26.2
1280 x 1024
1920 x 1200
2592 x 2048
4096 x 3072
4096 x 4096
5120 x 5120
4.8
4.8
4.8
4.5
4.5
4.5
7.9
10.9
15.9
23.0
26.1
32.6
1/2”
2/3”
1”
4/3”
APS-H
APS-H
C/M
C/M
C/M
C/M
C/M
C/M
150
90
75
160
125
80
3
3
3
3
3
3
1. CFA Options – Bayer Color (C), Monochrome (M).
KAC image sensors provide both global shutter and low noise rolling shutter modes, combined with programmable bit depth (8 to 14
bit) with a flexible readout architecture that supports interspersed video streams. These features enable the use of multiple regions of
interest that can simultaneously monitor both wide areas and local regions, making these devices ideal for machine vision, surveillance,
ITS, and analytical microscopy.
Features
•Global shutter, low noise rolling shutter
•Programmable bit depth
•Interspersed video streams
•Multiple regions of interest
•High frame rates
•High NIR sensitivity
KAC-12040
KAC-06040
Resolution
(MPix)
Pixel Count
(H x V)
Pixel
(mm)
Diagonal
(mm)
Lens
CFA1
FPS Max
Evaluation
Kit
KAC-06040
6
2832 x 2128
4.7
16.7
1”
C/M
160
3
KAC-12040
12
4000 x 3000
4.7
23.5
4/3”
C/M
70
3
Device
1. CFA Options – Bayer Color (C), Monochrome (M).
Page 18
Internet of Things Solutions
High Speed CMOS Image Sensors
LUPA devices offer resolution as high as 2048 x 2048 and frame rates up to 500 fps. These features, combined with a power consumption
as low as 150 mW with absolutely no blooming or lag, create a perfect foundation for highly reliable, high sensitivity image sensors.
Features
•Frame rates up to 500 fps at several
megapixel resolutions
•Unprecedented sensitivity
•Pipelined global shutter
•Low power dissipation
•High resolution
•No blooming or image lag
•Mono and color variants
LUPA 4000
Device
Resolution
(MPix)
Pixel Count
(H x V)
Pixel
(mm)
Diagonal
(mm)
Lens
CFA1
FPS Max
Evaluation
Kit
LUPA 300
0.3
640 x 480
9.9
7.9
1/2”
C/M
250
3
LUPA 1300-2
1.3
1280 x 1024
14
22.9
1”
C/M
500
3
LUPA 3000
3
1696 x 1710
8
19.3
1”
C/M
485
3
LUPA 4000
4
2048 x 2048
12
34.8
35 mm
C/M
15
3
1. CFA Options – Bayer Color (C), Monochrome (M).
ON Semiconductor
Page 19
SENSING
LUPA 3000
PYTHON CMOS Image Sensors
With resolutions from VGA to 25 megapixels, the PYTHON family of image sensors addresses the needs of general purpose industrial
imaging applications such as machine vision inspection and motion monitoring, security, surveillance, and intelligent transportation
systems (ITS). Combining flexibility in configuration and resolution with high speed and high sensitivity, these devices capture fast
moving scenes without distortion by combining low read noise and high sensitivity with frame rates up to 815 fps.
Features
•CDS global shutter technology with low noise performance
•True HW scalable family concept
•High configurability and fast adaptability
•Quadratic speed increase with ROI windowing
•Multiple regions of interest
•High dynamic range
•Color, Monochrome, and Enhanced NIR configurations
•Standard and protective tape configurations
Device
PYTHON 300
Resolution
(MPix)
Pixel Count
(H x V)
Pixel
(mm)
Diagonal
(mm)
Lens
CFA1
FPS Max
Evaluation
Kit
0.3
640 x 480
4.8
3.8
1/4”
C/M/NIR
815
3
SENSING
PYTHON 500
0.5
800 x 600
4.8
4.8
1/3.6”
C/M/NIR
545
3
PYTHON 1300
1.3
1280 x 1024
4.8
7.9
1/2”
C/M/NIR
210
3
PYTHON 2000
2.3
1920 x 1200
4.8
10.9
2/3”
C/M/NIR
225
3
PYTHON 5000
5.3
2592 x 2048
4.8
15.9
1”
C/M/NIR
100
3
PYTHON 10K
11.1
3840 x 2896
4.5
21.6
4/3
C/M/NIR
175
3
PYTHON 12K
12.5
4096 x 3072
4.5
23.0
4/3
C/M/NIR
160
3
PYTHON 16K
16.8
4096 x 4096
4.5
26.1
APS-H
C/M/NIR
120
3
PYTHON 25K
26.2
5120 x 5120
4.5
32.6
APS-H
C/M/NIR
80
3
1. CFA Options – Bayer Color (C), Monochrome (M), Enhanced NIR (NIR).
Page 20
Internet of Things Solutions
Full Frame CCD Image Sensors
From the intricacies of microscopy to the far reaches of astrophotography, Full Frame CCD image sensors deliver high performance
results. With high quantum efficiency across the entire visible spectrum, these sensors are ideal for demanding imaging applications
that can accommodate a mechanical shutter or strobe illumination, such as electronic still photography, medical X-ray, and inspection.
Features
•High resolution
•Support for large sensor formats
•Simple, two-phase clocking
•Very low dark current for long exposures
•Vertical and horizontal binning
Full Frame CCD Image Sensors
Pixel Count
Pixel
(mm)
Diagonal
(mm)
Lens
CFA1
FPS Max
Evaluation
Kit
KAF-0261
VGA
512 x 512
20.0
14.5
1”
M
15.0
3
KAF-0402
WVGA
768 x 512
9.0
8.3
1/2"
M
20.0
3
KAF-1001
1.0
1024 x 1024
24.0
34.8
APS-H
M
3.0
3
KAF-1603
1.6
1536 x 1024
9.0
16.6
1”
M
2.2
3
KAF-3200
3.3
2184 x 1510
6.8
18.0
4/3”
M
2.5
3
KAF-4320
4.3
2084 x 2084
24.0
70.7
645
M
2.0
3
KAF-6303
6.3
3088 x 2056
9.0
33.4
APS-H
M
0.6
3
KAF-8300
8.3
3326 x 2504
5.4
22.5
4/3”
C/M
2.9
3
KAF-09000
9.3
3056 x 3056
12.0
51.9
645 1.3x
M
0.4
KAF-16200
16.2
4500 x 3600
6.0
34.6
APS-H
C/M
1.5
KAF-16801
16.8
4096 x 4096
9.0
52.1
645 1.3x
M
0.4
KAF-16803
16.8
4096 x 4096
9.0
52.1
645 1.3x
M
0.2
KAF-40000
40.0
7304 x 5478
6.0
54.8
645 1.3x
C
1.3
KAF-50100
50.1
8176 x 6132
6.0
61.3
645 1.1x
C/M
1.0
SENSING
Resolution
(MPix)
Device
3
1. CFA Options – Bayer Color (C), Monochrome (M).
ON Semiconductor
Page 21
Interline Transfer CCD Image Sensors
With an integrated electronic shutter, Interline Transfer CCD image sensors provide real time imaging in applications where a mechanical
shutter or strobe illumination is either not required or desired. With progressive scan readouts, they are particularly well suited for
machine vision, microscopy, fluoroscopy, and other applications that demand the highest imaging performance. Most 5.5 mm and
7.4 mm devices share common pin-out and electrical connections, allowing a single camera design to support a full family of products.
Features
•Progressive scan with electronic
shutter and anti-blooming support
•High resolution
•High sensitivity
•Low image lag and smear
5.5 mm Interline Transfer CCD Image Sensors
Resolution
(MPix)
Pixel Count
KAI-0330
VGA
648 x 484
9
KAI-0340
VGA
640 x 480
7.4
KAI-0373
WVGA
768 x 484
11.6 x 13.6
11.1
2/3”
M
30
0.9
1280 x 720
5.5
8.1
1/2”
C/M/S
138
3
KAI-1003
1
1024 x 1024
12.8
18.5
4/3”
M
30
3
KAI-1010
1
1008 x 1018
9
12.9
1”
M
30
1
1000 x 1000
7.4
10.5
2/3”
C/M
50
3
Device
SENSING
KAI-011502
KAI-1020
KAI-01050
Pixel
(mm)
Diagonal
(mm)
Lens
CFA1
FPS Max
Evaluation
Kit
7.3
1/2”
C/M
120
3
5.9
1/3”
C/M
210
3
1
1024 x 1024
5.5
8
1/2”
C/M
120
3
KAI-2001
1.9
1600 x 1200
7.4
14.8
1”
C/M
30
3
KAI-2020
1.9
1600 x 1200
7.4
14.8
1”
C/M
30
3
KAI-020502
1.9
1600 x 1200
5.5
11.1
2/3”
C/M
68
3
KAI-02170
2
2.1
1920 x 1080
7.4
16.3
1”
C/M/S
60
3
KAI-021502
2.1
1920 x 1080
5.5
12.1
2/3”
C/M/S
64
3
KAI-04070
2
4.2
2048 x 2048
7.4
21.4
4/3”
C/M/S
28
3
KAI-040502
4.1
2336 x 1752
5.5
16.1
1”
C/M/S
32
3
2
KAI-08051
8.1
3296 x 2472
5.5
22.7
4/3”
C/M/S
16
3
KAI-08670
8.6
3600 x 2400
7.4
32.0
APS-H
C/M/S
12
3
KAI-11002
10.7
4008 x 2672
9
43.4
35 mm
C/M
5
3
KAI-16000
15.8
4872 x 3248
7.4
43.3
35 mm
C/M
3
KAI-160502
16
4896 x 3264
5.5
32.4
APS-H
C/M/S
8
3
2
15.7
4864 x 3232
7.4
43.2
35 mm
C/M/S
8
3
KAI-290502
28.8
6576 x 4384
5.5
43.5
35 mm
C/M/S
4
3
KAI-47051
46.8
8856 x 5280
5.5
56.7
645 1.1x
C/M/S
7
3
2
KAI-16070
1. CFA Options – Bayer Color (C), Monochrome (M), and Sparse CFA (S). 2. Pin and Electrically Compatible.
Page 22
Internet of Things Solutions
Interline Transfer EMCCD Image Sensors
Combining the high sensitivity of an electron-multiplied output register with the pixel uniformity and resolution scalability available from
Interline Transfer CCDs, KAE devices enable the capture of scenes with widely varying lighting conditions – from sunlight to starlight – in
a single image and from a single camera. This flexibility makes them ideal for light starved applications such as surveillance, scientific
imaging, medical imaging, and intelligent transportation systems.
US export controls currently apply to all shipments of KAE devices designated for
destinations outside of the US and Canada, requiring ON Semiconductor to obtain
an export license from the US Department of Commerce before image sensors or
evaluation kits can be exported.
Features
•86 dB dynamic range with 1 electron read noise
•Progressive scan readout
•High sensitivity, low noise architecture
•Excellent smear performance
KAE-02150
Resolution
(MPix)
Pixel Count
Pixel
(mm)
Diagonal
(mm)
Lens
CFA
FPS Max
Evaluation
Kit
2.1
1920 x 1080
5.5
12.1
2/3”
C/M
30
3
Linear CCD Image Sensors
Linear CCD image sensors combine high resolution with high dynamic range, making them ideal for use in applications such as flatbed
scanners, high-speed document scanners and copiers, machine vision cameras, and satellite imaging.
Features
•High dynamic range
•Pinned photodiodes for low lag and low dark current
•Channel independent electronic exposure control
•Single output per color, including multi-readout register
architectures
•High data rates
Device
KLI-2104
Linear CCD Image Sensors
Pixel Count
Pixel
(mm)
Diagonal
(mm)
CFA1
4196 x 1, 2098 x 3
7.0, 14.0
29.4
Luma+C
Evaluation Kit
KLI-2113
2098 x 3
14
29.4
C/M
3
KLI-4104
8160 x 1, 4080 x 3
5.0, 10.0
40.8
Luma+C/M
3
KLI-8023
8002 x 3
9
72
C/M
3
1. CFA Options – Bayer Color (C), Monochrome (M).
ON Semiconductor
Page 23
SENSING
Device
KAE-02150 Image Sensor
Image Sensor Evaluation Support
ON Semiconductor provides supporting hardware and software to qualified engineering teams to accelerate product development.
These kits contain everything necessary to build a working prototype with test functionality.
SENSING
Page 24
Internet of Things Solutions
Ambient Light & Proximity Sensors
Features
•Design flexibility/customization (i.e., EEPROM if
desired for trimming)
•0.0125 lux detection with customizable filtering
(i.e., Photopic Light Response)
•Dark current and temperature compensation
•Lowest power consumption per resolution bit
•I2C Interface (including High Speed Mode) and
no effect on bus during power down
hν
1k
VDD
16-Bit
ADC
Voltage
Supply
0.1 μF
SCL
I2C
Bus
SD
LV0104CS
LED
Drivers
MCU
CPU
LEDs
SCL
When the Sunlight is Strong,
Extending the Dynamic Range
by Lowering Gain
VCC
SW
0.1 μF
Control
Logic
SDA
SDA
Ambient
Light
1 μF
Sensor
VSS
SCL
VCC
Approximates
Human Eye
Response
1k
Amp
OUT
Gain Cont.
I/O
CPU
ADC
Current-Voltage
Conversion
Simple
2-Wire I2C
Interface
LA0151CS
GND
GND
Device
Special Features
IO Typ @ E V = 100 Lux
(mA)
Output Interface
Vin Range
(V)
TA Range
(°C)
Package
LA0151CS
2-Stage Gain Switching
8 (high gain)
Analog, linear current
2.2 - 5.5
-30 to +85
ODCSP-4
LV0104CS
Integrated Sleep Mode
—
I2C, 16-bit ADC
2.3 - 3.6
-30 to +85
ODCSP-4
LV0111CF
Standby Function
21
Analog, logarithmic current
2.3 - 5.5
-30 to +85
ODCSP-4J
NOA1212
Dark Current Compensation
51 (high gain)
Analog, linear current
2.0 - 5.5
-40 to +85
CUDFN-6
NOA1213
Dark Current Compensation
—
Analog
2.0 - 5.5
-40 to +85
CUDFN-6
NOA1305
Dark Current Compensation
—
I2C, 16-bit ADC
2.4 - 3.6
-40 to +85
CUDFN-6
NOA3302
Proximity Sensor
—
I2C, 16-bit ADC
2.3 - 3.6
-40 to +80
CWDFN-8
ON Semiconductor
Page 25
SENSING
Voltage
Supply
Vin = 3.3 V
Capacitive Touch Sensors
Design-Friendly, Low-Cost Operation, High Reliability
•Adhesive free

•Reduce manufacturing cost and improve reliability by
eliminating existing adhesive process
•Long sensor trace




•Provide flexible PCB design
•Wide range operational temperature
•No extra components
•High noise immunity
•Available in high-temperature environment
•Reduce BOM
•Improve stability and reliability
SENSING
Door Phone
Light Switch
Control Panel
Page 26
Internet of Things Solutions
Capacitive Touch Sensors
LC717A00 & LC717A10 Overview
LC717A00 and LC717A10 are high performance,
cost-effective capacitance-to-digital converters,
with 8- or 16-channel capacitance-sensor inputs,
for use with touch switch applications, replacing
older mechanical switches. Use of patented sensing
technology and automatic calibration enables faster,
more precise response than existing self-capacitive
sensing products.
LC717A00 & LC717A10 Features
By eliminating the need for adhesives between the
overlay material and sensor, the devices deliver
better sensitivity and touch performance, and enable
operation using a gloved hand or in a wet environment.
The differential sensor implementation is less
susceptible to electro-magnetic interference (EMI),
making the devices better suited to demanding
applications.
SENSING
•Detection method: Differential mutual detection
•Detection resolution: 0.1 femtofarad
•Measurement interval:
•LC717A00: (8 channel) minimum 3.0 ms, 18 ms typical
•LC717A10: (16 channel) minimum 6.0 ms, 30 ms typical
•External components for measurement: None
•Supply voltage 2.6 to 5.5 V
•Current consumption:
•LC717A00: 320 mA with VDD = 2.8 V, 740 mA with VDD = 5.5 V
•LC717A10: 570 mA with VDD = 2.8 V, 1300 mA with VDD = 5.5 V
•Package:
•LC717A00AR and LC717A10AR = VCT-28
•LC717A00AJ and LC717A10AJ = SSOP-30
•Interface: I2C or SPI, pin selectable:
•Input control of gain and threshold levels
•Output switch position and 8 bit digital data per switch
Cin0
Cin1
Cin2
Pout0
Cref
Pout1
Cin0
Pout2
Cin1
Pout3
Cin2
Cin3
Cin4
A/D
CONVERTER
AMP
MUX
Pout4
Pout5
Pout6
Cin5
Pout7
Cin6
Cdrv
Cin7
SDA/SI
VDD
Cin4
VSS
Cin5
Cin6
Cin7
Cin8
A/D
CONVERTER
AMP
MUX
Cin9
Cin10
Cin11
Cdrv
CONTROL
LOGIC
Cin12
INTOUT
Cin13
CONTROL
LOGIC
nCS
SCL/SCK
Cin3
ERROR
Cin14
INTOUT
Cin15
nRST
nCS
nRST
SA/SO
POR
OSCILLATOR
LC717A00 Block Diagram
ON Semiconductor
POR
GAIN
I2C/SPI
VDD
VSS
Cref
CrefAdd
OSCILLATOR
SCL/SCK
I2C/SPI
MUX
SDA/SI
SA0/SO
SA1
LC717A10 Block Diagram
Page 27
Temperature Sensors
VDD 3.0 V To 5.5 V
CBYPASS
ADDRESS
(SET AS DESIRED)
5
A2
6
A1
1
7
A0
OS/ALERT
NCT375
3
4
SDA
2
SCL
SERIAL INTERFACE
NOTE: SDA, SCL AND OS/ALERT PINS
REQUIRE PULL-UP RESISTORS TO VDD
GND
Typical Application Diagram
Sensor Type
Data
Transmission
Standard
ICC Max
(mA)
NCT375
Local
SMBus
0.575
NCT203
Local
I2C
44 µA
NCT475
Local
SMBus
0.575
3
NCT75
Local
SMBus
0.575
NCT218
Remote
I2C
—
NCT210
Local & Remote
SMBus
0.37
NCT214
Local & Remote
SMBus
NCT72
Local & Remote
I2C
Device
SENSING
Page 28
VCC Max
(V)
Temperature
Error
(°C)
VCC Min
(V)
T Min
(°C)
T Max
(°C)
3
5.5
-55
125
±1
Micro8™
1.6
2.75
-40
125
±1.75
WDFN-8, WLCSP-8
5.5
-55
125
±1
WLCSP-6
3
5.5
-55
125
±1
DFN-8, Micro8, SOIC-8
1.6
2.75
—
—
—
WDFN-8, WLCSP-8
3
5.5
-65
125
±3
QSOP-16
0.35
3
3.6
-40
125
±1
WDFN-10
0.35
2.8
3.6
-40
125
±1
DFN-8, WDFN-8
Package
Internet of Things Solutions
JFETs for Infrared (IR) Sensing
JFET
1
D
2
Thermal
Energy
S
R
3
G
VGDO Min
(V)
IDSS Min
(mA)
IDSS Max
(mA)
|yfs| Typ
(mS)
Ciss Typ
(pF)
Crss Typ
(pF)
Package
TF412S
30
1.2
3
5
4
1.1
SOT-883
TF414
40
0.05
0.13
0.11
0.7
0.3
SOT-883
2SK545
40
0.055
0.095
0.13
1.7
0.7
CP (SOT-23)
2SK3666
30
0.6
3
6.5
4
1.1
CP (SOT-23)
Device
ON Semiconductor
SENSING
Infrared Sensor for White Goods, Security, and Lighting
Page 29
Battery-Free Wireless Sensors
Introducing the World’s First Battery-Free, µC-Free Sensor Tag
Breakthrough Sensor Technology Implemented on RFID
Smart
Passive
Sensors
Single chip; µC free;
adaptable RF front end
No batteries;
energy harvesting
Temperature, Pressure,
Moisture, Proximity
Features
SENSING
•Battery-free and wireless

Ideal for locations with limited access
•underground, within walls, intrusive to body, within boxes, toxic or dangerous locations
•Ultra-thin

Ideal for space-constrained applications
•Within doorways, within RFID tags, peel and stick, bandages
•Low cost to scale

Effective where multiple sensors are required
•Disposable products, multiple data points, increasing needs over time
Device
Page 30
Benefits
Sensing Functions
Sensor Reading Sensitivity
Surface Placement
SPS1M001
Moisture + Proximity
Low Sensitivity
Metal
SPS1M002
Moisture + Proximity
Low Sensitivity
Non-Metal
SPS1M003
Moisture + Proximity
High Sensitivity
Non-Metal
SPS1T001
Temperature + Proximity
0 to +50°C (±0.3°C) or -40 to +85°C (±1°C)
Non-Metal
Internet of Things Solutions
Full Bridge Rectifier for Wireless Charging
Features – NMLU1210
•Full Bridge Rectification block - up of 3.2 A of operation
•Low RDS(ON) minimizes conduction losses
•Low profile UDFN-8 package (4 x 4 x 0.55 mm)
MOSFET
SCHOTTKY
Device
VLL
(V)
ID
(A)
RDS(ON) Max @ VGS = 10 V
(W)
VR
(V)
VF
(A)
IF
(A)
Package(s)
NMLU1210
20
3.2
0.017
20
0.45
3.2
UDFN-8
Vout
C1
C2
A1
A2
D1
AC
Input
S1 G1
L1_2
D2
DC
Output
G2 S2
GND2
GND1
GND1
AC-DC
Drivers
+
Controller
+
V/I Sensing
Transmitter
ON Semiconductor
GND2
NMLU1210
AC-DC
DC-DC
Step Down
and Control
POWER MANAGEMENT
L1_1
Vout
Receiver
Page 31
LC709203F High Accuracy Fuel Gauge LSI
Fuel Gauge for 1 Cell Li+ with Low Power and with No Sense Register
Conventional Display
Features
•Accuracy of remaining capacity ±2.8% (0 ~ +50°C)
•Active mode current of 15 μA
•Hibernate mode current of 2 μA
•Standby mode current (RAM retention) of 0.1 µA
•No need for sense register for current detection
With
LC709203F
Standby Time
120 h
Call Time
75 min
Correct
Operating Time
Detailed Display of
Remaining Capacity
100
80
80
70
70
60
60
50
50
40
40
30
30
POWER MANAGEMENT
Load: 50 mA
Battery: DB-L50 Typ 1900 mAh
20
Room Temp
Battery: DB-L50 Typ 1900 mAh
10
10
0
100
500 mA
750 mA
1000 mA
1250 mA
1500 mA
Ideal
90
Disp (%)
Disp (%)
100
0°C
Room Temp
50°C
Ideal
90
20
77%
90
80
70
60
50
40
30
20
10
0
0
100
90
80
70
60
50
40
30
Real (%)
Real (%)
Ideal vs. Display (by Temperature)
Ideal vs. Display (by Load)
20
10
0
Discharge Characteristics
Page 32
Internet of Things Solutions
LDO Regulators
Iout
(mA)
Dropout Typ
@ 3.3 V
(mV)
Iq
(mA)
P SRR
@ 120 Hz
(dB)
Vin Max
(V)
Vout
(V)
Package(s)
NCP785A
10
-
12
80
450
3.3, 5.0, 12, 15
SOT-89-3
NCP508
50
180
145
70
13
1.5, 1.8, 2.5, 2.8, 3.0, 3.3
SC-70-5, WDFN-6
NCP715
50
350
4.7
52
24
1.2, 1.5, 1.8, 2.5, 3.0, 3.3, 5.0
SC-70-5, XDFN6
NCP716
80
350
4.7
52
24
1.2, 1.5, 1.8, 2.5, 3.0, 3.3, 5.0
SC-70-5, XDFN6
NCP120
150
30
80
72
6
0.8, 1.05, 1.1, 1.15, 1.2, 1.5, 1.8, 2.1
XDFN-6
NCP571
150
450
40
-
12
0.8, 0.9, 1.0, 1.2
TSOP-5, DFN-6
NCP170
150
240
0.5
40
5.5
1.2, 1.5, 1.8, 2.5, 2.8, 3.0, 3.3
SOT-563, uDFN-4
NCP700B
200
118
70
82
5.5
1.8, 2.8, 3.0, 3.3
WDFN-6, TSOP-5
NCP702
200
140
10
68
6
1.8, 2.8, 3.0, 3.3
XDFN-6, TSOP-5
NCP752
200
130
12
68
6
1.8, 2.8, 3.0, 3.3
SOT-23-5, XDFN-6
NCP160
250
120
20
100
6
1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 3.5, 4.5, 5.0, 5.14
XDFN-4, WLCSP-4
NCP703
300
180
12
68
6
1.8, 2.8, 3.0, 3.3
XDFN-6, TSOP-5
NCP130
300
60
80
75
6
0.8, 1.05, 1.1, 1.15, 1.2, 1.5, 1.8, 2.1
XDFN-6
Device
450
120
20
100
6
1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 3.5, 4.5, 5.0, 5.14
XDFN-4, WLCSP-4
NCP3335A
500
250
190
75
18
Adj., 1.5, 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 5.0
Micro8, DFN-10
NCP3334
500
250
190
75
18
Adj.
SOIC-8
NCP705
500
250
12
70
6
0.8, 1.8, 2.8, 3.0, 3.3
SOT-223-6, WDFN-6
NCP5500
500
230
300
75
18
Adj., 1.5, 5.0
DPAK-5, SOIC-8
NCP133
500
140
80
72
6
Adj, 0.9, 1.0, 1.05, 1.1, 1.15, 1.2, 1.25, 1.3, 1.8
XDFN-6
NCP59748
1.5
60
-
70
6
Adj.
DFN-10, QFN-20
NCP59744
3
100
-
70
6
Adj.
QFN-20
POWER MANAGEMENT
NCP161
ON Semiconductor
Page 33
Power Supply/Management, Voltage Regulation
N
L
POWER SUPPLY/MANAGEMENT
DC-DC
Converters
High Voltage
AC-DC
Switching
Regulator
Device
NCP1010~15
NCP1070~77
NCP1027/28
AC-DC NCP1124/26/29
NCP1050~5
NCP3170
NCP3063/4
DC-DC
Function
LDO Voltage
Regulators
Features
Package
•Dynamic self-supply, no need of an auxiliary winding
•Current-mode fixed frequency (options of 65 kHz, 100 kHz, 130 kHz)
•700 V, 5.8 W FET current-mode fixed frequency (65 kHz, 100 kHz)
•650 V, 9/6/2 W rugged FET current-mode fixed frequency (65 kHz, 100 kHz)
•Oscillator frequency (options of 44 kHz, 100 kHz, 136 kHz) dithering with
High Voltage Gated Oscillator Monolithic
controlled slew rate driver for reduced EMI
Switching Regulator
•Startup circuit eliminates the need for transformer auxiliary bias winding
•Output voltage adjustable to 0.8 V
3 A Switching Regulator
•500 kHz or 1 MHz switching frequency
1.5 A Switching Regulator or utilize as controller •Capable of 40 V input
for up to 5 A
•Up to 250 kHz switching frequency
Self-Supply High Voltage Monolithic Switching
Regulator for Low Power Offline Power Supplies
High Voltage Monolithic Switching Regulator for
Medium Power Offline Power Supplies
LM2594/5/6
0.5 A/1.0 A/3 A Switching Regulators
NCP3020/11
PWM Controller
NCP1034
PWM Controller
•Capable of 40 V input
•Fixed 150 kHz switching frequency
•4.7-28 V input voltage range
• EN/PG/SYNC features
• Fixed 300/400/600 kHz switching frequency
•Capable of up to 100 V input
•Adjustable switching frequency (50-500 kHz)
PDIP-7,
SOT-223
PDIP-7
SOT-223
SOIC-8
SOIC-8
TO-220,
DPAK,
SOIC-8,
PDIP-8
SOIC-8,
TSSOP-14
SOIC-16
POWER MANAGEMENT
Page 34
Internet of Things Solutions
Power MOSFETs for Circuit Breakers and Metering Power Supplies
Features
≤AC 240 V
AC 380 V to 480 V
BFL4004
BFL4026
BFL4001
2SK3745LS
2SK4177
2SK3746
2SK3747
2SK3748
NDFPD1N150C
NDFP03N150C
NDTL03N150C
NDUL03N150C
NDUL09N150C
WPH4003
DC Output 1
DC Output 2
Feedback
Circuit
Low Saturation Voltage BJT for
Over Current Sensing Circuit
2SC6144SG: 50 V/10 A TO-220F-3FS
2SC5707: 50 V/8 A TP, TP-FA
VDDS
(V)
ID
(A)
800
900
900
1500
1500
1500
1500
1500
1500
1500
1500
1500
1500
1700
6.5
5
6.5
2
2
2
2
4
0.1
2.5
2.5
2.5
9
3
RDS(ON) (Ω) @ 10 V
Typ
Max
Ciss
(pF)
Qg
(nC)
G-S Protection
Diode
Package
1.9
2.8
2.1
10
10
10
10
5
100
8
8
8
2.2
8.2
2.5
3.6
2.7
13
13
13
13
7
150
10.5
10.5
10.5
3
10.5
710
650
850
380
380
380
380
790
80
650
650
650
2400
850
36
33
44
37.5
—
—
—
80
4.2
34
34
34
130
48
—
—
—
Built in
Built in
Built in
Built in
Built in
—
—
—
—
—
—
TO-220F
TO-220F
TO-220F
TO-220F
TO-263 (D2PAK)
TO-3P
TO-3PF
TO-3PF
TO-220F
TO-220F
TO-3P
TO-3PF
TO-3PF
TO-3PF
POWER MANAGEMENT
AC 590 V to 690 V
Device
Output 1
Output 2
Driver
•High reliability
•Low power dissipation
•Avalanche ruggedness
•High-speed switching
Power Source
Voltage
Transformer/
Primary Side
Clamper Circuit
Rectifier
Bridge
AC Input
Voltage
ON Semiconductor
Page 35
Motor Drive for Small Motor Control
MOTOR CONTROL
Stepper Motor Driver for Paper Feed – DC 3~12 V
LV8716QA, LV8711T, LV8712T, LV8713T,
LB1935FA, LB1940T, LV8548MC, LV8549MC
DC Motor Driver for Paper Cut – DC 3~12 V
LB1938FA, LV8400V, LV8417CS
Hand Terminal (POS) Printer
Stepper Motor Driver for Zoom/Focus – DC 5 V
LV8044LP, LV8414CS, LV8411GR, LV8413GP,
LV8080LP, LV8716QA
Stepper Motor Driver for Panning/Tilt - DC 12 V
LV8714TA, LV8711T, LV8712T, LV8713T,
LV8402GP, LV8548MC
Security Camera
Device
LV8413GP
LV8080LP
LV8411GR
LV8414CS
LV8044LP
LB1935FA
LB1938FA
LB1940T
LV8417CS
LV8716QA
LV8400V
LV8402GP
LV8711T
LV8712T
LV8713T
LV8714TA
LV8548MC
LV8549MC
Page 36
Type
VM Max
(V)
VCC Max
(V)
IO Max
(A)
Step Resolution
Control Type
Current Sense
Package(s)
Stepper / 2 x Brush DC
Stepper
2 x Stepper / 4 x Brush DC
2 x Stepper
6 x H-Bridge
Stepper
Brush DC
Stepper
Brush DC
Stepper / 2 x Brush DC
Brush DC
Stepper / 2 x Brush DC
Stepper / 2 x Brush DC
Stepper
Stepper
2 x Stepper / 4 x Brush DC
Stepper / 2 x Brush DC
Stepper
6
6.5
6
6
6
8
10.5
10.5
12.6
12.6
16
16
18
18
18
18
20
20
6
6.5
6
6
6
—
—
—
6
—
6
6
6
6
6
—
—
—
0.4
0.4
0.4
0.4
0.4
0.4
0.8
0.4
1
1
1.2
1.4
0.8
0.8
0.8
1.5
1
1
1/2
1/2
1/2
1/64
1/16
Full Step
—
1/2
—
1/2
—
1/2
1/2
1/8
1/32
Free
1/2
Full Step
Parallel
Parallel
Parallel
Clock
Clock/Prallel
Parallel
Parallel
Parallel
Parallel
Parallel
Parallel
Parallel
Parallel
Clock
Clock
Parallel
Parallel
Parallel
None
External Resistor
None
External Resistor
External Resistor
None
None
None
None
External Resistor
None
None
External Resistor
External Resistor
External Resistor
External Resistor
None
None
VCT-16
VCT-16
VCT-24
WLP-32K
VQLP-40
Micro10
Micro8
TSSOP-20
WLP-9
QFN-16
SSOP-16
VCT-24
TSSOP-24
TSSOP-24
TSSOP-24
TQFP-48EP
SOIC-10
SOIC-10
Internet of Things Solutions
MOSFET
Driver
MOSFET Features
MOSFET
Driver
High Side
Driver
•Low RDS(on) improves efficiency by reducing
conduction loss
•Low Gate Charge reduces dynamic power loss
•Extensive voltage lineup
MOTOR CONTROL
MOSFETs and MOSFET Drivers for Motor Control
High Side
Driver
M
Low Side
Driver
Low Side
Driver
Power MOSFETs
Device
ATP208
ATP401
2SK4066
NDBA170N06A
NDBA100N10B
NDBA180N10B
CPH3461
PCP1405
SFT1452
NDDP010N25AZ
FW297
FW4604
ECH8690
FW389
ATP108
ATP304
BBS3002
SMP3003
BMS3004
Channel
VDS
(V)
ID
(A)
RDS(on)
(mW)
Qg
(nC)
Package
N
N
N
N
N
N
N
N
N
N
N+N
P+N
P+N
P+N
P
P
P
P
P
40
60
60
60
100
100
250
250
250
250
60
30
60
100
-40
-60
-60
-75
-75
90
100
100
170
100
180
0.35
0.6
3
10
4.5
-4.5/6
-3.5/4.7
-2/2
-70
-100
-100
-100
-68
6
3.7
4.7
3.3
6.9
2.8
6500
6500
2400
420
58
65/39
94/55
300/225
10.4
6.5
5.8
8
8.5
83
300
220
280
35
95
2.1
2.1
4.2
16
14
7.5/9.1
15/18
21/10
79.5
250
280
280
300
ATPAK
ATPAK
D2PAK, I2PAK
D2PAK
D2PAK
D2PAK
CPH-3
PCP-1 (SOT-89)
DPAK, IPAK
DPAK, IPAK
SOIC-8
SOIC-8
ECH-8
SOIC-8
ATPAK
ATPAK
D2PAK, I2PAK
D2PAK, I2PAK
TO-220F-3FG
Number of
Drivers
Vin Max
(V)
Drive Source/Sink Typ
(mA)
Package
1
1
2
2
2
2
2
2
2
625
625
625
25
25
25
25
25
25
200/400
200/400
200/400
1000/1000
1000/1000
1000/1000
800/1000
800/1000
800/1000
SOIC-8
VEC-8
SOIC-8
SOIC-8
SOIC-8
SOIC-8
VEC-8
VEC-8
VEC-8
MOSFET Drivers
Device
TND523SS
TND524VS
TND525SS
TND314S
TND315S
TND316S
TND321VD
TND322VD
TND323VD
Description
Single Input High Voltage High Side MOSFET Driver
Single Input High Voltage High Side MOSFET Driver
Dual Input High Voltage High and Low Side MOSFET Driver
Dual Low Side Driver(Dual Inverter)
Dual Low Side Driver(Dual Buffer)
Dual Low Side Driver(Inverter and Buffer)
Dual Low Side Driver(Dual Inverter)
Dual Low Side Driver(Dual Buffer)
Dual Low Side Driver(Inverter and Buffer)
ON Semiconductor
Page 37
USB 2.0
One High Speed Pair, V CC , Low Capacitance ESD Protection
Key Requirement
I/O 1 I/O 2 I/O 3 I/O 4
•Cap < 5 pF
•0.35 - 3.0 pF
•Multi-part solutions available
•Industry leading low clamping voltage
PROTECTION
Device
NUP2114UPX
NUP2114UCM
NUP4114UPX
NUP4114UCL
NUP4114H
TVS4201MR6
ESD7L5.0
ESD8351MUT
ESD8351P2T
ESD9L5.0
VBUS
D+
DGnd
USB
Host
Controller
Features
NUP2114
=
Data Lines
Capacitance
(pF)
Package
Size
(mm)
1 Pair (D+/-) + Vbus
1 Pair (D+/-) + Vbus
2 Pair (D+/-) + Vbus
2 Pair (D+/-) + Vbus
2 Pair (D+/-) + Vbus
2 Pair (D+/-) + Vbus
2
1
1
1
0.8
0.8
0.5
0.5
0.5
3
0.5
0.37
0.37
0.5
SOT-553
TSOP-6
SOT-563
SC-88
TSOP-6
TSOP-6
SOT-723
X3DFN-2
SOD-923
SOD-923
1.2 x 1.6
3.0 x 2.75
1.6 x 1.6
2.0 x 2.1
3.0 x 2.75
3.0 x 2.75
1.2 x 1.2
0.6 x 0.3
1.0 x 0.6
1.0 x 0.6
VBUS
D+
DGnd
USB
Host
Controller
NUP4114
VBUS
D+
DGnd
One High Speed Pair, V CC , Common Mode Filter + ESD Protection
Key Requirement
•Cap < 5 pF
•Common Mode Filtering
Micro USB
Connector
Features
•0.5 - 0.8 pF
•Integrated EMI suppression with ESD protection
•Industry leading low clamping voltage
GND
ID
EMI2121
D+
D-
Device
EMI2121
Pairs
Capacitance
@ 2.5 V (pF)
1
0.9
CM Attenuation DM Bandwidth
@ 800 MHz (–dB) F3dB (GHz)
Package
–25
2.5
WQFN
VBUS
Size
(mm)
Top layer
Other layer
2.2 x 2.0 x 0.75
0
-5
-10
dB
-15
-20
-25
-30
USB 2.0 @ 480 Mb/s
Page 38
-35
1.E+06
Suppresses Common Mode Noise
Deeper than Competing Passive Solution
Common
Mode
Differential
Mode
1.E+07
1.E+08
1.E+09
Frequency
Internet of Things Solutions
Ethernet: 10/100BASE-T, 1000BASE-TX, and Gigabit
Four Pairs, Low Capacitance Surge and ESD Protection
The 1000BASE-T or Gigabit Ethernet interface operating at higher bitrates is susceptible to ESD strikes, cable-discharge events and
lightning-induced transients. Our products help meet IEC 61000-4-5, GR-1089-CORE and other Standards.
Features
Typical Application
TPOPA
1000BASE-T
ETHERNET TRANSCEIVER
TPONA
C5
ALC03
C3
TPONC
BLC03
8
TPOPC
C6
C+
VDD
C7
CLC03
C4
TPOND
8
1
TPOPD
D+
VDD
C8
DLC03
Line Side : LC03-6 (optional)
Transformer Side: TVS8818
Protection against metallic (transverse) strikes
1
2
TVS8818
5
Voltage (V), Current (A)
4
30
RJ-45 Connector
3
6
Flow Through
Routing
7
25
8/20 μs
Surge Current
15
ON Semiconductor
Voltage
10
5
0
-10
8
Competitor
Voltage
20
0
10
20
30
Time (μs)
40
50
60
Line-to-Line Surge
Transient Voltage Suppressors
Device
LC03-6
TVS4201
TVS8814
TVS8818
NUP4114H
SRDA3.3
SRDA05
VDC Max
(V)
6.7
5.0
3.0
3.0
5.0
3.3
5.0
Line
Transient
Max
(V)
7.0
6.0
3.2
3.2
5.0
5.0
7.0
Surge IPP,
8/20 ms
(A)
100
25
35
35
12*
25
23
Typical
Line-Line
Capacitance
(pF)
8.0
1.5
1.5
1.5
0.4
4.0
5.0
ESD
Contact
Rating
(kV)
±30
±30
±30
±30
±13
±8
±8
Package
SOIC-8
TSOP-6
UDFN-8
UDFN-10
TSOP-6
SOIC-8
SOIC-8
* On Pin 5.
ON Semiconductor
Page 39
PROTECTION
TVS8818
B+
VDD
RJ45
TPONB
TRANSFORMER
C2
8
TPOPB
1
•Compatible with Gb Ethernet and beyond
•Enhanced protection for downstream electronics
•Accommodates operating transients above 3.3 V
•Small form-factor allows integration into connectors
A+
VDD
1
Benefits
C1
8
1
•Line-to-line capacitance < 3 pF
•Vclamp (25 A surge) < 11 V
•IEC 61000-4-2 rating > 30 kV
•No latching danger
•Surge rating maintained to 125°C
General and LCD MCUs
MCU Features
•Pins:
•ROM:
•RAM:
•ADC:
10 – 100
4 – 768 KBytes
256 – 48,640 Bytes
3 – 16 channels
ROM
RAM
(kByte) (Byte)
PROCESSING
Device
Type
LC87FBG08A
8-bit General
8
256
LC87FBK08A
8-bit General
8
LC87FBL08A
8-bit General
8
LC87FBH08A
8-bit General
8
LC87F2R04A
8-bit General
LC87BK08A*
8-bit General
LC87F2416A
8-bit General
LC87F2J32A
8-bit General
LC87F2W48A
8-bit General
LC87F2C64A
8-bit General
LC87FC096A
8-bit General
96
LC87F2608A
8-bit General
8
LC87F0808A
8-bit General
8
LC87F0N04A
8-bit General
4.5
LC87F0G08A
8-bit General
8
LC87F0A08A
8-bit General
8
256
LC87F5VP6A
8-bit General
256
LC88F58B0A
16-bit General
128
LC88FC3H0A
16-bit General
LC88FC3J0A
16-bit General
LC88FC3K0A
16-bit General
LC87F7932B
8-bit LCD
LC87F7J32A
•Operation Voltage: 1.8 – 5.5 (V)
•Stand-by IDD: 0.02 µA
•RTC (Clock) IDD: 0.45 µA
(with low power model)
μA
I/Os
PWMs
UARTs
ADC
LVD
POR
Features
Package
21
2
1
12/8-bit x 9ch
✔
✔
High accuracy internal OSC (±2.0%); all operation is minimum 1.8 V
SSOP-24, VCT-24
256
21
2
—
12/8-bit x 8ch
✔
✔
High accuracy internal OSC (±3.0%); Support Mask Type
SSOP-24
256
26
2
—
12/8-bit x 11ch
✔
✔
High accuracy internal OSC (±3.0%)
QFP-36
256
26
2
1
12/8-bit x 11ch
✔
✔
High accuracy internal OSC (±3.0%)
QFP-36
4
128
21
—
—
12/8-bit x 8ch
✔
✔
Small scale 8bit MCU; Remote Control Receiver Circuit
SSOP-24
8
256
21
2
—
12/8-bit x 8ch
✔
✔
Mask ROM edition of LC87FBK08A
SSOP-24
16
512
26
2
1
12/8-bit x 10ch
—
—
—
QFP-36
32
1024
41
2
1
12/8-bit x 14ch
✔
✔
—
SQFP-48, QIP-48
50
1536
40
2
1
12/8-bit x 14ch
✔
—
—
SQFP-48
64
2048
73
4
2
12/8-bit x 16ch
✔
✔
RTC; low power consumption
QFP-80
4096
55
6
2
12/8-bit x 11ch
✔
✔
12-bit PWM x 6
QIP-64E
512
7
1
—
12/8-bit x 3ch
✔
✔
High speed 12-bit PWM; Analog Comparator
MFP-10SK
256
30
6
1
10/8-bit x 10ch
✔
✔
MCPWM; High speed ADC (10-bit); Analog Comparator/Amplifier x 2
QFP-36
128
12
4
—
10/8-bit x 6ch
✔
✔
MCPWM; High speed ADC (10-bit); Analog Comparator x 2
SSOP-16
256
18
3
—
12/8-bit x 7ch
—
—
MCPWM, OP-AMP, Analog comparator
SSOP-24
30
2
—
12/8-bit x 8ch
✔
✔
OP-AMP, Analog comparator, Constant current output port
QFP-36
10240
89
4
2
8-bit x 15ch
—
—
Large scale memory
QIP-100E
6144
54
2
2
12/8-bit x 11ch
—
✔
Motor control signal generator
SQFP-64
512
49152
90
4
3
12/8-bit x 8ch
✔
✔
2 x SMIC, SLIIC; RTC; CRC calculation circuit
TQFP-100
640
49152
90
4
3
12/8-bit x 8ch
✔
✔
2 x SMIC, SLIIC; RTC; CRC calculation circuit
TQFP-100
768
49152
90
4
3
12/8-bit x 16ch
✔
✔
2 x SMIC, SLIIC; RTC; CRC calculation circuit
TQFP-100
32
2048
49
2
1
12/8-bit x 7ch
—
✔
32 x 4 segment driver; RTC; low power consumption
SQFP-64
8-bit LCD
32
1024
51
2
1
12/8-bit x 12ch
✔
✔
24 x 4 segment driver; support 5 V/3 V for LCD-panel
TQFP-64
LC87F76C8A
8-bit LCD
128
4096
71
2
1
12/8-bit x 12ch
—
—
32 x 4 segment driver
QFP-80
LC87F7DC8A
8-bit LCD
128
4096
91
2
2
12/8-bit x 15ch
—
—
54 x 4 segment driver; many segment drivers
QIP-100E
LC87F7NC8A
8-bit LCD
128
4096
91
2
2
12/8-bit x 15ch
—
—
54 x 4 segment driver; large scale memory
QIP-100E
LC87F7NJ2A
8-bit LCD
192
8192
91
2
2
12/8-bit x 15ch
—
—
54 x 4 segment driver; large scale memory
QIP-100E
LC87F7NP6A
8-bit LCD
256
8192
91
2
2
12/8-bit x 15ch
—
—
54 x 4 segment driver; large scale memory
QIP-100E
* Mask ROM Device; Contact ON Semiconductor for additional information.
Page 40
Internet of Things Solutions
MCUs for USB
MCU Features
•USB 2.0 full-speed / low speed functions
•USB device function / USB host function
Device
Type
LC87F1A32A
8-bit USB
LC87F1M16A
8-bit USB
LC87F1K64A
8-bit USB
LC87F17C8A
8-bit USB
LC87F1HC8A
LC87F1JJ2A
LC87F1JJ4A
LC87F1JJ8A
8-bit USB
8-bit USB
8-bit USB
8-bit USB
ROM
RAM
(kByte) (Byte)
•Integrated voltage regulator
•USB D+ line pull-up function
I/Os
PWMs
UARTs
ADC
LVD
POR
Features
Package
2048
39
2
1
12/8-bit x 12ch
—
—
IR reciever
SQFP-48
16
1024
38
2
1
12/8-bit x 20ch
✔
✔
UART & SCUART; high current driver
SQFP-48
64
8192
39
2
1
12-bit x 12ch
✔
✔
USB I/F x 2; USB Host; Audio I/F
SQFP-48
128
8192
39
2
1
12/8-bit x 12ch
SQFP-48
16384
16384
20480
24576
39
39
39
39
2
2
2
2
1
1
1
1
8-bit x 12ch
8-bit x 12ch
8-bit x 12ch
8-bit x 12ch
4
—
—
—
—
USB 2.0 full speed host/device controller x2; audio IF
128
192
192
192
4
—
—
—
—
USB Host; Audio I/F
USB Host; Audio I/F
USB Host; Audio I/F
USB Host; Audio I/F
SQFP-48
SQFP-48
SQFP-48
SQFP-48
32
MCU Starter Kit for Software Development
Trial kit includes Main Board, Sub Board, and Development Environment CD. With Main Board as a base, it is possible to connect
different Sub Boards with different pin numbers.
•8 bit Easy Micon Development Tool
Sub Board Line Up: 16-pin, 24-pin, 36-pin, 48-pin
•16 bit Xstromy16 Development Tool
Sub Board Line Up: 48-pin, 64-pin, 100-pin
PROCESSING
LEDs
Switch
Connects to PC via
Standard USB Cable
MCU On-Chip Debugger System
•Software development with 1 wire communication
•Reduction of development time with Real Time Display
function, Break function, and Trace function
Debugger
(1 Wire)
Real Time Display Function
Displays program running
situation in real time
ON Semiconductor
Page 41
Mixed-Signal Custom Solutions
Value Proposition
• Experienced resources and assets to bring customers’ design objectives successfully to market
• Ability to integrate customers’ IP into single-chip solution, thereby protecting the IP
• Flexible cost models to reduce customers’ total cost
High Voltage (40 to 80 V)
Low Voltage (<3.3 V)
Low or
High
Voltage
Power/
Battery
Management
Wired
Communications
Analog
Signals
Filtering
Example:
PROCESSING
Sensor:
• Magnetic Flux
• Temperature
• Light
• Sound
• Pressure
• Acceleration
• Angular Rate
Amplification
Analog/
Digital
Conversion
• RF
Wireless
Radio
Signal
Processing
Actuator
• Coil Driver
• Class-D Amp
• DAC
• Display Driver
Supporting
Logic
Memory
• EEPROM
• OTP
• SRAM
• ROM
IP & Fab Processes
• ≥55 nm, analog-focused CMOS/BCDMOS process technologies
utilizing internal fabs and external foundry partners
• Low, medium, high voltages — ≤1 V to 90 V
• Low current optimization — active & standby
• Low noise design — “count the electrons”
• High temperature — ≤200°C (profile, for selected technologies)
• Integrated low power wireless
• Non-Volatile Memory (EEPROM, OTP), RAM & ROM
• Embedded digital IP
• Robust ESD protection
• Extensive building block ‘starting points’ consisting of amplifiers,
references, DACs, ADCs, linear & switching regulators, power
management, etc.
Page 42
Low or
High
Voltage
• Microcontroller
• DSP
Sensor Interface
ASIC
Design Engineering
• CAN, LIN
• I2C-bus
• USB
• KNX
• M-BUS
Example:
Mechanical or
Electrical System:
• Stepper Motors
• Transducers
• MOSFETs & BJTs
• Relays
• Speakers
• Lamps
• LCD/LED Displays
Category
• Approximately 200 expert mixed-signal
designers with extensive SoC and SiP
experience
• Robust custom development process
• Dedicated project managers track & report
development progress
• Flexible customer development engagement
— from full turnkey to subcontractor
production services
• Design expertise in:
» Sensor interface
» Wireless systems
» Medical imaging
» Energy management
» Building & home control
Mixed Signal Intellectual Property (IP)
Serial Interfaces
USB 3.0/2.0/1.1, HDMI, MIPI, I2C, SPI, CAN, UART
Microprocessors
ARM, RCore DSP, R8051, AMBA/AHB/APB Peripherals
Memory
SRAM, DPRAM, ROM, EEPROM, OTP, FLASH
Clocking
Oscillators, PLLs, DLLs
Communication
Wireless (Proprietary & Standards), Wired (KNX, PLC
and others)
Encryption
ECC, AES, 3-DES, DES, RSA
Data Converters
DAC, ADC (8 - 20 bits, 1 KSPS – 120 MSPS)
Wireless IP
PGA, LNA, PLLs, Correlators, DSP
Power Management
Efficient Switching Regulators, LDOs, Charge Pumps,
Thermal Protection
References
Precision Bandgaps, Current References, Temperature
Sensors
Analog and High Voltage
Interfaces
High-Voltage Drivers, Display and LCD Drivers, Class D
Amplifiers
Signal Conditioning
PGA, Instrumentation Amps, Digital and Analog Filters
Internet of Things Solutions
Integrated Passive Devices (IPD)
•Combines multiple resistors, capacitors and inductors onto a film substrate; typical applications include RF baluns, filters, and
matching networks
•Reduces PCB footprint and component height versus discrete implementations, while also improving performance (reduced parasitics)
•Simplifies logistics, inventory managememt and pick-and-place assembly by elimination of multiple discrete passive SKUs
•Based on 110 nm silicon process with high performance and tight process control
Available Components
•Copper inductors, minimum spacing 3 µm,
minimum line width 5 µm, current handling
>50 mA/µm, achieves Q-factors up to 45
Integration of multiple R, L, and C
into single IPD
•MIM capacitors, 0.62 nF/mm2 , typical
tolerance ±5%
•TiN resistors, 9 Ω/sq
Sub-Micron Tolerances — Trace Spacing/Width Down to 3/5 mm
Inductor Within IPD (SEM Photo)
Picked & Diced Wafer Edge
ON Semiconductor
Page 43
COMPONENTS
•Wafers manufactured on high precision equipment,
designed for 110 nm transistor fabrication
•Very tight performance tolerances and low variation
across wafers
•±4.3% tolerance 1K MIM caps
•±3.9% tolerance 2K MIM caps
•< 1% variance between caps on common IPD
EEPROMs for Configuration and Calibration
Features
EasyPRO™ is a user-friendly, portable
programming tool for ON Semiconductor
serial EEPROMs (I2C, SPI, Microwire)
•Broad density range: 1 kb to 2 Mb
•Wide operating Vcc range: 1.8/1.7 V to 5.5 V
•High endurance: 1 million program/erase cycles
•Wide temperature range: industrial and extended
•Error-code correction
•Lockable ID page
EEPROMs
Data
Transmission
Standard
I2C
SPI
COMPONENTS
Microwire
Device
Density
Organization*
VCC Min
(V)
VCC Max
(V)
fCLK Max
(MHz)
Package(s)
CAT24M01
CAT24C512
CAT24C256
CAT24C128
CAT24C64
LE2464CXA
CAT24C32
CAT24C16
LE24162LBXA
LE24163LBXA
LE2416RLBXA
CAT24C08
CAT24C04
LE24L042CS-B
CAT24C02
CAT25M02
CAT25M01
CAT25512
CAT25256
CAT25128
CAT25640
CAT25320
CAT25160
CAT25080
CAT25040
CAT25020
CAT25010
CAT93C86
CAT93C86B
CAT93C76
CAT93C76B
CAT93C66
CAT93C56
CAT93C46
CAT93C46B
CAT93C46B
1 Mb
512 kb
256 kb
128 kb
64 kb
64 kb
32 kb
16 kb
16 kb
16 kb
16 kb
8 kb
4 kb
4 kb
2 kb
2 Mb
1 Mb
512 kb
256 kb
128 kb
64 kb
32 kb
16 kb
8 kb
4 kb
2 kb
1 kb
16 kb
16 kb
8 kb
8 kb
4 kb
2 kb
1 kb
1 kb
1 kb
128k x 8
64k x 8
32k x 8
16k x 8
8k x 8
8k x 8
4k x 8
2k x 8
2k x 8
2k x 8
2k x 8
1k x 8
512 x 8
512 x 8
256 x 8
256k x 8
128k x 8
64k x 8
32k x 8
16k x 8
8k x 8
4k x 8
2k x 8
1k x 8
512 x 8
256 x 8
128 x 8
2k x 8 & 1k x 16
2k x 8 & 1k x 16
1k x 8 & 512 x 16
1k x 8 & 512 x 16
512 x 8 & 256 x 16
256 x 8 & 128 x 16
128 x 8 & 64 x 16
128 x 8 & 64 x 16
128 x 8 / 64 x 16
1.8
1.8
1.8
1.8
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8 / 1.65
1.8
1.8 / 1.65
1.8
1.8
1.8
1.8 / 1.65
1.8 / 1.65
5.5
5.5
5.5
5.5
5.5
3.6
5.5
5.5
3.6
3.6
3.6
5.5
5.5
3.6
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
1
1
1
1
1
0.4
1
0.4
0.4
0.4
0.4
0.4
0.4
0.4
0.4
10
10
20
20
20
20
20
20
20
20
20
20
3
4
3
4
2
2
2
4
4
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8, WLCSP-4
WLCSP-6
SOIC-8, TSSOP-8, UDFN-8, WLCSP-4, WLCSP-5
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
WLCSP-6
WLCSP-5
WLCSP-6
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
WLCSP-4
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
SOIC-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
* Organization for Microwire devices is selectable.
Page 44
Internet of Things Solutions
Serial NOR Flash
Features
•Faster data rewrite (Sector Erase/Page Program)
•Lower power consumption with efficient rewrite operation
•20-year data retention with no data deterioration
•Consistent Sector Erase operation time (tSE) over device lifetime
•Industry’s fastest WRITE performance minimizes system risk
during field firmware upgrades
VCC
VCC
VCC
CS
HOLD
SCK
CS
SCK
Wireless
SoC
Serial
Flash
W
P
GND
SI
SI
SO
SO
LED
Driver
Density
Power Supply
(V)
Sector Erase Time
(ms)
Page Program Time
(ms)
Read/Write Current
(mA)
Package
LE25S20
2 Mb
1.65 - 1.95
80
3
6 Read; 15 Write
SOIC-8, VSOIC-8
LE25U20A
2 Mb
2.3 - 3.6
80
4
6 Read; 15 Write
SOIC-8, VSOIC-8, WDFN-8
LE25U40C
4 Mb
2.3 - 3.6
80
4
6 Read; 15 Write
SOIC-8, VSON-8, VDFN-8
LE25S40
4 Mb
1.65 - 1.95
80
6
6 Read; 15 Write
SOIC-8, VSOIC-8, VDFN-8, VSON-8
LE25W81
8 Mb
2.45 - 3.6
100
0.3
6 Read; 15 Write
VSON-8, VDFN-8
LE25S81A
8 Mb
1.65 - 1.95
15
0.3
5 Read; 4.5 Erase
SOIC-8, VSOIC-8
LE25S161
16 Mb
1.65 - 1.95
15
0.4
4.5 Read; 4.5 Erase
SOIC-8, VSOIC-8, UDFN-8, WLCSP-8
Device
ON Semiconductor
Page 45
COMPONENTS
Smart LED Block Diagram
Logic Translators
Dual supply voltage logic translators connect ICs and
PCBs together that operate at different supply voltages.
PCB #1
PCB #2
Translator
Features
Translator
μC #1
•Industry’s first devices with independent power
supplies (VL < VCC, VL = VCC, or VL > VCC)
•High 100 pF capacitive drive capability
•Overvoltage tolerant enable and I/O pins
•Non-preferential power-up sequencing
•Power-off protection
μC #2
PCB-to-PCB
Translation
On-board
translations
• SPI
• I2C
• SMBus
Translator
EEPROM
Autosense Bidirectional
Translator
(Push-Pull Output)
Unidirectional Translator
P
One−Shot
VL
Autosense Bidirectional
Translator
(Open-Drain Output)
Bidirectional
Translator
(with Direction Pin)
VCC
R1
VL
VCC
VCCA
1k
VCCA
Block Diagram
N
One−Shot
VCCB
A
B
I/O VL
PU1
I/O VCC
P
One−Shot
OE
R2
RPullup
10 k
One−Shot
Block
Gate
Bias
One−Shot
Block
EN
I/O VL
VCCB
DIR
PU2
RPullup
10 k
A
EN
N
B
I/O VCC
1k
N
One−Shot
COMPONENTS
Attributes
• High Data Rate
• Low Power Consumption
• High Data Rate
• Low Power Consumption
• High Data Rate
• Low Power Consumption
• Flexible PCB Design
• High Data Rate
• Low Power Consumption
• Flexible PCB Design
Trade-Offs
• Fixed Input & Output Pins
• Modest Output Current
• Modest Bandwidth
• Directional Control Pin Required
•SPI
•GPIO
•SPI
•GPIO
•I2C, SMBus, PMBus
•GPIO
• SDIO Cards
• 1-Wire Bus
•GPIO
• NLSX3012 (2-Bit, UDFN-8)
• NLSX3014 (4-Bit, UQFN-12)
• NLSX3013 (8-Bit, CSP-20)
• NLSX3018 (8-Bit, UDFN-20)
• NLSX4014 (4-Bit, UQFN-12)
• NLSX5011 (1-Bit, UULGA-6, UDFN-6)
• NLSX5012 (2-Bit, UDFN-8)
• NLSX5014 (4-Bit, UDFN-12)
• NLSX3373 (2-Bit, UDFN-8)
• NLSX3378 (4-Bit, CSP-12)
• NLSX4373 (2-Bit, UDFN-8)
• NLSX4378 (4-Bit, CSP-12)
• NLSV1T45 (1-Bit, ULLGA-6)
• NLSV2T245 (2-Bit, UQFN-10)
• NLSV2T3236 (2-Bit, UQFN-10)
• NLA16T245 (16-Bit, TSSOP-48)
Applications
• NLSV1T34 (1-Bit, ULLGA-6)
• NLSV1T240/244 (1-Bit, UDFN-6)
• NLSV2T240/244 (2-Bit, UDFN-8)
Sample Device
• NLSV4T240/244 (4-Bit, UDFN-12)
(I/O Channels,
• NLSV4T3234 (4-Bit, CSP-11)
Package)
• NLSV8T240/244 (8-Bit, UDFN-20)
Page 46
Internet of Things Solutions
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