BAS40 06LT1 D

BAS40-06LT1G,
SBAS40-06LT1G
Common Anode Schottky
Barrier Diodes
These Schottky barrier diodes are designed for high speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand held and portable
applications where space is limited.
Features





http://onsemi.com
40 VOLTS
SCHOTTKY BARRIER DIODE
Extremely Fast Switching Speed
Low Forward Voltage
AEC Qualified and PPAP Capable
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
Reverse Voltage
Symbol
Value
Unit
VR
40
V
L2 M G
G
THERMAL CHARACTERISTICS
Max
Unit
225
1.8
mW
mW/C
L2 = Specific Device Code
M = Date Code*
G = Pb−Free Package
TJ, Tstg
−55 to +150
C
(Note: Microdot may be in either location)
Forward Continuous Current
IFM
120
mA
Single Forward Current
tv1s
t v 10 ms
IFSM
Thermal Resistance (Note 1)
Junction−to−Ambient (Note 2)
RqJA
Forward Power Dissipation
@ TA = 25C
Derate above 25C
Operating Junction and Storage
Temperature Range
Symbol
2
CATHODE
MARKING DIAGRAM
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Characteristic
CATHODE
1
ANODE
3
MAXIMUM RATINGS
Rating
SOT−23 (TO−236)
CASE 318
STYLE 12
PF
mA
200
600
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Package
Shipping†
BAS40−06LT1G
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
SBAS40−06LT1G
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
Device
508
311
C/W
1. FR−4 @ minimum pad.
2. FR−4 @ 1.0 x 1.0 in pad.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2011
November, 2011 − Rev. 8
1
Publication Order Number:
BAS40−06LT1/D
BAS40−06LT1G, SBAS40−06LT1G
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Symbol
Characteristic
Reverse Breakdown Voltage
(IR = 10 mA)
CT
Reverse Leakage
(VR = 25 V)
IR
Forward Voltage
(IF = 1.0 mAdc)
VF
Forward Voltage
(IF = 10 mAdc)
VF
Forward Voltage
(IF = 40 mAdc)
VF
IR , REVERSE CURRENT (A)
100
10
150C
125C
85C
25C
-40C
0
0.1
0.2
40
−
−
5.0
−
1.0
−
380
−
500
−
1.0
0.3
-55C
0.4
V
pF
mAdc
mVdc
mVdc
Vdc
125C
10
85C
1.0
0.1
25C
0.001
0.5
0.6
0.7
0.8
0
5.0
VF, FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
10
15
VR, REVERSE VOLTAGE (VOLTS)
3.0
2.5
2.0
1.5
1.0
0.5
0
5.0
10
20
Figure 2. Reverse Current versus Reverse
Voltage
3.5
0
Unit
TA = 150C
0.01
C T, CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
100
0.1
Max
V(BR)R
Total Capacitance
(VR = 1.0 V, f = 1.0 MHz)
1.0
Min
15
20
25
30
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Capacitance
http://onsemi.com
2
35
40
25
BAS40−06LT1G, SBAS40−06LT1G
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AP
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
D
SEE VIEW C
3
HE
E
DIM
A
A1
b
c
D
E
e
L
L1
HE
q
c
1
2
e
b
0.25
q
A
L
A1
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
0
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.13
0.18
2.90
3.04
1.30
1.40
1.90
2.04
0.20
0.30
0.54
0.69
2.40
2.64
−−−
10 
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
0
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
−−−
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
10 
STYLE 12:
PIN 1. CATHODE
2. CATHODE
3. ANODE
L1
VIEW C
SOLDERING FOOTPRINT
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
SCALE 10:1
0.8
0.031
mm Ǔ
ǒinches
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
3
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loca
Sales Representative
BAS40−06LT1/D
Similar pages