BAS40 06LT1 D

BAS40-06LT1G,
SBAS40-06LT1G
Common Anode Schottky
Barrier Diodes
These Schottky barrier diodes are designed for high speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand held and portable
applications where space is limited.
Features

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40 VOLTS
SCHOTTKY BARRIER DIODE
Extremely Fast Switching Speed
Low Forward Voltage
AEC Qualified and PPAP Capable
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
Reverse Voltage
Symbol
Value
Unit
VR
40
V
L2 M G
G
THERMAL CHARACTERISTICS
Max
Unit
225
1.8
mW
mW/C
L2 = Specific Device Code
M = Date Code*
G = Pb−Free Package
TJ, Tstg
−55 to +150
C
(Note: Microdot may be in either location)
Forward Continuous Current
IFM
120
mA
Single Forward Current
tv1s
t v 10 ms
IFSM
Thermal Resistance (Note 1)
Junction−to−Ambient (Note 2)
RqJA
Forward Power Dissipation
@ TA = 25C
Derate above 25C
Operating Junction and Storage
Temperature Range
Symbol
2
CATHODE
MARKING DIAGRAM
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Characteristic
CATHODE
1
ANODE
3
MAXIMUM RATINGS
Rating
SOT−23 (TO−236)
CASE 318
STYLE 12
PF
mA
200
600
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Package
Shipping†
BAS40−06LT1G
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
SBAS40−06LT1G
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
Device
508
311
C/W
1. FR−4 @ minimum pad.
2. FR−4 @ 1.0 x 1.0 in pad.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2011
November, 2011 − Rev. 8
1
Publication Order Number:
BAS40−06LT1/D
BAS40−06LT1G, SBAS40−06LT1G
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Symbol
Characteristic
Reverse Breakdown Voltage
(IR = 10 mA)
CT
Reverse Leakage
(VR = 25 V)
IR
Forward Voltage
(IF = 1.0 mAdc)
VF
Forward Voltage
(IF = 10 mAdc)
VF
Forward Voltage
(IF = 40 mAdc)
VF
IR , REVERSE CURRENT (A)
100
10
150C
125C
85C
25C
-40C
0
0.1
0.2
40
−
−
5.0
−
1.0
−
380
−
500
−
1.0
0.3
-55C
0.4
V
pF
mAdc
mVdc
mVdc
Vdc
125C
10
85C
1.0
0.1
25C
0.001
0.5
0.6
0.7
0.8
0
5.0
VF, FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
10
15
VR, REVERSE VOLTAGE (VOLTS)
3.0
2.5
2.0
1.5
1.0
0.5
0
5.0
10
20
Figure 2. Reverse Current versus Reverse
Voltage
3.5
0
Unit
TA = 150C
0.01
C T, CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
100
0.1
Max
V(BR)R
Total Capacitance
(VR = 1.0 V, f = 1.0 MHz)
1.0
Min
15
20
25
30
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Capacitance
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2
35
40
25
BAS40−06LT1G, SBAS40−06LT1G
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AP
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
D
SEE VIEW C
3
HE
E
DIM
A
A1
b
c
D
E
e
L
L1
HE
q
c
1
2
e
b
0.25
q
A
L
A1
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
0
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.13
0.18
2.90
3.04
1.30
1.40
1.90
2.04
0.20
0.30
0.54
0.69
2.40
2.64
−−−
10 
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
0
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
−−−
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
10 
STYLE 12:
PIN 1. CATHODE
2. CATHODE
3. ANODE
L1
VIEW C
SOLDERING FOOTPRINT
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
SCALE 10:1
0.8
0.031
mm Ǔ
ǒinches
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BAS40−06LT1/D