BAS70 04LT1 D

BAS70-04LT1G,
SBAS70-04LT1G
Dual Series
Schottky Barrier Diode
These Schottky barrier diodes are designed for high speed switching
applications, circuit protection, and voltage clamping. Extremely low
forward voltage reduces conduction loss. Miniature surface mount
package is excellent for hand held and portable applications where
space is limited.
Features
• Extremely Fast Switching Speed
• Low Forward Voltage
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
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70 VOLTS SCHOTTKY
BARRIER DIODE
ANODE
1
CATHODE
2
3
CATHODE/ANODE
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
MAXIMUM RATINGS (TJ = 150°C unless otherwise noted)
Rating
Reverse Voltage
Non−Repetitive Peak Forward
Surge Current (t ≤ 1.0 s)
3
1
2
Symbol
Value
Unit
VR
70
V
IFSM
100
mA
MARKING DIAGRAM
Symbol
Max
Unit
CG M G
G
225
1.8
mW
mW/°C
TJ, Tstg
−55 to +150
°C
RqJA
508
(Note 1)
311
(Note 2)
°C/W
THERMAL CHARACTERISTICS
Characteristic
Forward Power Dissipation
@ TA = 25°C
Derate above 25°C
Operating Junction and Storage
Temperature Range
Thermal Resistance
Junction−to−Ambient
SOT−23
(TO−236AB)
CASE 318
PF
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 @ minimum pad.
2. FR−4 @ 1.0 x 1.0 in pad.
1
CG
M
G
= Specific Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Package
Shipping†
BAS70−04LT1G
SOT−23
(Pb−Free)
3000 / Tape &
Reel
SBAS70−04LT1G
SOT−23
(Pb−Free)
3000 / Tape &
Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
February, 2013 − Rev. 10
1
Publication Order Number:
BAS70−04LT1/D
BAS70−04LT1G, SBAS70−04LT1G
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Min
Max
Unit
Reverse Breakdown Voltage (IR = 10 μA)
V(BR)R
70
−
V
Total Capacitance (VR = 0 V, f = 1.0 MHz)
CT
−
2.0
pF
Reverse Leakage (VR = 50 V)
(VR = 70 V)
IR
−
−
0.1
10
μA
Forward Voltage (IF = 1.0 mA)
VF
−
410
mV
Forward Voltage (IF = 10 mA)
VF
−
750
mV
Forward Voltage (IF = 15 mA)
VF
−
1.0
V
Characteristic
IR , REVERSE CURRENT (μA)
100
10
1.0
150°C
125°C
0.1
0
0.1
TA = 150°C
10
125°C
1.0
85°C
0.1
0.01
-40°C
85°C
25°C
25°C
-55°C
0.2
0.3
0.4
0.001
0.6
0.5
0.7
0.8
0
1.0
0.9
5.0
VF, FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
10
25
30
35
15
20
VR, REVERSE VOLTAGE (VOLTS)
1.2
1.0
0.8
0.6
0.4
0.2
0
0
5.0
10
40
45
Figure 2. Reverse Current versus Reverse
Voltage
1.4
C T, CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
100
15
20
25
30
35
40
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Capacitance
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2
45
50
50
BAS70−04LT1G, SBAS70−04LT1G
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.
D
SEE VIEW C
3
HE
E
c
1
DIM
A
A1
b
c
D
E
e
L
L1
HE
2
e
b
0.25
q
A
L
A1
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.13
0.18
2.90
3.04
1.30
1.40
1.90
2.04
0.20
0.30
0.54
0.69
2.40
2.64
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
STYLE 8:
PIN 1. ANODE
2. NO CONNECTION
3. CATHODE
L1
VIEW C
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
SCALE 10:1
0.8
0.031
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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BAS70−04LT1/D
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