1SS400T1 D

1SS400T1G,
NSV1SS400T1G
High-Speed
Switching Diode
Features
•
•
•
•
•
•
High−Speed Switching Applications
Lead Finish: 100% Matte Sn (Tin)
Qualified Maximum Reflow Temperature: 260°C
Extremely Small SOD−523 Package
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
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1
CATHODE
1
SOD−523
CASE 502
PLASTIC
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Max
Reverse Voltage
VR
100
V
Forward Current
IF
200
mAdc
IFM(surge)
500
mAdc
Symbol
Max
Unit
200
1.57
mW
mW/°C
Peak Forward Surge Current
Unit
MARKING DIAGRAM
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation
FR−5 Board (Note 1) @TA = 25°C
Derate above 25°C
RJA
635
°C/W
Junction and Storage Temperature Range
TJ, Tstg
−55 to
+150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−4 @ Minimum Pad.
ELECTRICAL CHARACTERISTICS
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Reverse Voltage Leakage Current
(VR = 80 Vdc)
IR
Diode Capacitance
(VR = 0 V, f = 1.0 MHz)
CD
Forward Voltage
(IF = 100 mAdc)
VF
Reverse Recovery Time
(IF = IR = 10 mAdc)
trr
© Semiconductor Components Industries, LLC, 2014
June, 2014 − Rev. 8
AMG
G
1
PD
Thermal Resistance, Junction-to-Ambient
Characteristic
2
ANODE
−
0.1
Adc
−
3.0
pF
−
1.2
Vdc
−
4.0
ns
1
A = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending upon
manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping†
1SS400T1G
SOD−523
(Pb−Free)
3000 / Tape & Reel
1SS400T5G
SOD−523
(Pb−Free)
8000 / Tape & Reel
NSV1SS400T1G
SOD−523
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
1SS400T1/D
1SS400T1G, NSV1SS400T1G
820 +10 V
2.0 k
IF
100 H
tr
0.1 F
tp
IF
t
trr
10%
t
0.1 F
90%
DUT
50 INPUT
SAMPLING
OSCILLOSCOPE
50 OUTPUT
PULSE
GENERATOR
iR(REC) = 1.0 mA
IR
VR
OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)
INPUT SIGNAL
Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp » trr
Figure 1. Recovery Time Equivalent Test Circuit
100
10
I R , REVERSE CURRENT ( A)
TA = 85°C
TA = -40°C
10
TA = 25°C
1.0
TA = 125°C
1.0
TA = 85°C
0.1
TA = 55°C
0.01
TA = 25°C
0.1
0.2
0.4
0.6
0.8
1.0
0.001
1.2
10
0
20
30
VF, FORWARD VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Forward Voltage
Figure 3. Leakage Current
0.68
C D , DIODE CAPACITANCE (pF)
I F, FORWARD CURRENT (mA)
TA = 150°C
0.64
0.60
0.56
0.52
0
2.0
4.0
6.0
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Capacitance
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2
8.0
40
50
1SS400T1G, NSV1SS400T1G
PACKAGE DIMENSIONS
SOD−523
CASE 502
ISSUE E
−X−
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
−Y−
E
2X
b
0.08
1
M
2
X Y
DIM
A
b
c
D
E
HE
L
L2
TOP VIEW
A
c
HE
MILLIMETERS
MIN
NOM
MAX
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
1.10
1.20
1.30
0.70
0.80
0.90
1.50
1.60
1.70
0.30 REF
0.15
0.20
0.25
RECOMMENDED
SOLDERING FOOTPRINT*
SIDE VIEW
2X
L
2X
1.80
0.48
2X
0.40
2X
PACKAGE
OUTLINE
L2
BOTTOM VIEW
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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PUBLICATION ORDERING INFORMATION
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3
ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
Sales Representative
1SS400T1/D
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