MMBD2837LT1 D

MMBD2837LT1G,
MMBD2838LT1G,
SMMBD2837LT1G
Monolithic Dual Switching
Diodes
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Features
 AEC−Q101 Qualified and PPAP Capable
 S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
SOT−23 (TO−236AB)
CASE 318
STYLE 9
 These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS (EACH DIODE)
Rating
Peak Reverse Voltage
Symbol
Value
Unit
VRM
75
Vdc
D.C. Reverse Voltage
MMBD2837LT1G, SMMBD2837LT1G
MMBD2838LT1G
VR
Vdc
Peak Forward Current
IFM
450
300
mAdc
Average Rectified Current
IO
150
100
mAdc
30
50
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Total Device Dissipation FR− 5 Board
(Note 1) TA = 25C
Derate above 25C
PD
225
mW
1.8
mW/C
Thermal Resistance,
Junction−to−Ambient
Total Device Dissipation Alumina
Substrate, (Note 2) TA = 25C
Derate above 25C
Thermal Resistance,
Junction−to−Ambient
Junction and Storage Temperature
RqJA
PD
RqJA
TJ, Tstg
C/W
556
300
mW
2.4
mW/C
C/W
417
−55 to +150
C
1. FR−5 = 1.0 0.75 0.062 in.
2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina.
ANODE
1
3
CATHODE
2
ANODE
MARKING DIAGRAM
xxx M G
G
1
xxx
A5
= Specific Device Code
= MMBD2837LT1G,
SMMBD2837LT1G
MA6 = MMBD2838LT1G
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Package
Shipping†
MMBD2837LT1G
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
SMMBD2837LT1G
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
MMBD2838LT1G
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2011
November, 2011 − Rev. 7
1
Publication Order Number:
MMBD2837LT1/D
MMBD2837LT1G, MMBD2838LT1G, SMMBD2837LT1G
ELECTRICAL CHARACTERISTICS (EACH DIODE) (TA = 25C unless otherwise noted)
Symbol
Characteristic
Min
Max
Unit
OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I(BR) = 100 mAdc)
MMBD2837LT1G, SMMBD2837LT1G
MMBD2838LT1G
V(BR)
Reverse Voltage Leakage Current (Note 3.)
(VR = 30 Vdc)
MMBD2837LT1G, SMMBD2837LT1G
(VR = 50 Vdc)
MMBD2838LT1G
IR
Diode Capacitance (VR = 0 V, f = 1.0 MHz)
CT
Forward Voltage
(IF = 10 mAdc)
(IF = 50 mAdc)
(IF = 100 mAdc)
VF
Reverse Recovery Time (IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc) (Figure 1)
trr
Vdc
35
75
−
−
mAdc
−
0.1
−
0.1
−
4.0
−
−
−
1.0
1.0
1.2
−
4.0
pF
Vdc
ns
3. For each individual diode while the second diode is unbiased.
820W
+10 V
2.0 k
100 mH
tr
0.1 mF
IF
tp
t
IF
trr
10%
t
0.1 mF
90%
DUT
50 W OUTPUT
PULSE
GENERATOR
50 W INPUT
SAMPLING
OSCILLOSCOPE
iR(REC) = 1.0 mA
IR
VR
INPUT SIGNAL
OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)
Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp » trr
Figure 1. Recovery Time Equivalent Test Circuit
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2
MMBD2837LT1G, MMBD2838LT1G, SMMBD2837LT1G
CURVES APPLICABLE TO EACH CATHODE
I F, FORWARD CURRENT (mA)
100
TA = 85C
TA = -40C
10
TA = 25C
1.0
0.1
0.2
0.4
0.6
0.8
1.0
1.2
40
50
VF, FORWARD VOLTAGE (VOLTS)
Figure 2. Forward Voltage
10
I R , REVERSE CURRENT (m A)
TA = 150C
TA = 125C
1.0
TA = 85C
0.1
TA = 55C
0.01
TA = 25C
0.001
0
10
20
30
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Leakage Current
CD, DIODE CAPACITANCE (pF)
1.0
0.9
0.8
0.7
0.6
0
2
4
6
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Capacitance
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3
8
MMBD2837LT1G, MMBD2838LT1G, SMMBD2837LT1G
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AP
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
D
SEE VIEW C
3
HE
E
DIM
A
A1
b
c
D
E
e
L
L1
HE
q
c
1
2
e
b
0.25
q
A
L
A1
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
0
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.13
0.18
2.90
3.04
1.30
1.40
1.90
2.04
0.20
0.30
0.54
0.69
2.40
2.64
−−−
10 
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
0
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
−−−
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
10
STYLE 9:
PIN 1. ANODE
2. ANODE
3. CATHODE
L1
VIEW C
SOLDERING FOOTPRINT
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
SCALE 10:1
0.8
0.031
mm Ǔ
ǒinches
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
Sales Representative
MMBD2837LT1/D