MMSD914T1 D

MMSD914, SMMSD914
Switching Diode
Features
•
•
•
•
•
SOD−123 Surface Mount Package
High Breakdown Voltage
Fast Speed Switching Time
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
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SOD−123
CASE 425
PLASTIC
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Continuous Reverse Voltage
VR
100
Vdc
Peak Forward Current
IF
200
mAdc
IFM(surge)
500
mAdc
1.0
2.0
A
A
Peak Forward Surge Current
Non−repetitive Peak
Forward Surge Current
Pulse Width =1 second
Pulse Width =1 micro second
THERMAL CHARACTERISTICS
Total Device Dissipation FR−5 Board
(Note 1)
TA = 25°C
Derate above 25°C
Thermal Resistance,
Junction−to−Ambient
Junction and Storage Temperature Range
2
ANODE
MARKING DIAGRAM
IFSM
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Characteristic
1
CATHODE
Symbol
Max
Unit
PD
425
mW
1
5D
M
G
5D M G
G
2
= Specific Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
3.4
RqJA
TJ, Tstg
mW/°C
Device
Package
Shipping†
°C/W
MMSD914T1G
SOD−123
(Pb−Free)
3,000 / Tape & Reel
SMMSD914T1G
SOD−123
(Pb−Free)
3,000 / Tape & Reel
MMSD914T3G
SOD−123 10,000 / Tape & Reel
(Pb−Free)
SMMSD914T3G
SOD−123 10,000 / Tape & Reel
(Pb−Free)
290
−55 to
+150
°C
1. FR−5 = 1.0oz Cu, 1.0inz pad
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2012
November, 2012 − Rev. 11
1
Publication Order Number:
MMSD914T1/D
MMSD914, SMMSD914
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
V(BR)
100
−
Vdc
−
−
25
5.0
nAdc
mAdc
OFF CHARACTERISTICS
Reverse Breakdown Voltage (IBR = 100 mAdc)
Reverse Voltage Leakage Current
(VR = 20 Vdc)
(VR = 75 Vdc)
IR
Forward Voltage (IF = 10 mAdc)
VF
−
1000
mVdc
Diode Capacitance (VR = 0 Vdc, f = 1.0 MHz)
CD
−
4.0
pF
Reverse Recovery Time (IF = IR = 10 mAdc) (Figure 1)
trr
−
4.0
ns
820 W
+10 V
2k
100 mH
0.1 mF
tr
IF
0.1 mF
tp
t
IF
trr
10%
t
DUT
50 W OUTPUT
PULSE
GENERATOR
50 W INPUT
SAMPLING
OSCILLOSCOPE
90%
IR
VR
INPUT SIGNAL
Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp » trr
Figure 1. Recovery Time Equivalent Test Circuit
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2
iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)
MMSD914, SMMSD914
100
10
I R, REVERSE CURRENT (A)
μ
10
TA = 85°C
TA = -40°C
1.0
TA = 25°C
TA = 125°C
1.0
TA = 85°C
0.1
TA = 55°C
0.01
TA = 25°C
0.1
0.2
0.4
0.6
0.8
1.0
0.001
1.2
0
10
20
30
VF, FORWARD VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Forward Voltage
Figure 3. Leakage Current
0.68
CD , DIODE CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
TA = 150°C
0.64
0.60
0.56
0.52
0
2
4
6
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Capacitance
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3
8
40
50
MMSD914, SMMSD914
PACKAGE DIMENSIONS
SOD−123
CASE 425−04
ISSUE G
D
ÂÂÂÂ
ÂÂÂÂ
ÂÂÂÂ
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
A1
1
HE
DIM
A
A1
b
c
D
E
HE
L
q
E
2
q
MILLIMETERS
NOM
MAX
1.17
1.35
0.05
0.10
0.61
0.71
--0.15
1.60
1.80
2.69
2.84
3.68
3.86
------10 °
MIN
0.037
0.000
0.020
--0.055
0.100
0.140
0.010
0°
INCHES
NOM
0.046
0.002
0.024
--0.063
0.106
0.145
-----
MAX
0.053
0.004
0.028
0.006
0.071
0.112
0.152
--10 °
STYLE 1:
PIN 1. CATHODE
2. ANODE
L
b
MIN
0.94
0.00
0.51
--1.40
2.54
3.56
0.25
0°
C
SOLDERING FOOTPRINT*
ÉÉ
ÉÉ
ÉÉ
ÉÉ
0.91
0.036
2.36
0.093
4.19
0.165
ÉÉ
ÉÉ
ÉÉ
ÉÉ
SCALE 10:1
1.22
0.048
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MMSD914T1/D