ENA1959 D

Ordering
Orderingnumber
number: :ENA1959D
ENA1959D
LV47009P
Monolithic Linear IC
4-Channel BTL Power Amplifier
for Car Audio Systems
http://onsemi.com
Overview
The LV47009P is the IC for 4-channel BTL power amplifier that is developed for car audio system.
Pch DMOS in the upper side of the output stage and Nch DMOS in the lower side of the output stage are
complimentary. High power and high quality sound are realized by that.
This IC incorporate various functions (standby switch, muting function, and various protection circuit) necessary for
car audio system. Also, it has a self-diagnosis function.
Functions
 High output : PO max = 41W (typical) (VCC = 15.2V, f = 1kHz, RL = 4, Max power)
: PO max = 24W (typical) (VCC = 14.4V, f = 1kHz, THD = 10%, RL = 4)
: PO max = 17W (typical) (VCC = 14.4V, f = 1kHz, THD = 1%, RL = 4)
 Built-in muting function (pin 22)
 Built-in Standby switch (pin 4)
 Built-in Self-diagnosis function (pin 25) :
Signal output in case of output Clip detection, shorting to VCC, shorting to ground, and load shorting.
 Electric mirror noise decrease
 Built-in various protection circuit (shorting to ground, shorting to VCC, load shorting, over voltage and thermal shut
down)
 No external anti-oscillation part necessary.
Note 1 : Please do not mistake connection.
A wrong connection may produce destruction, deterioration and damage for the IC or equipment.
Note 2 : The protective circuit function is provided to temporarily avoid abnormal state such as incorrect output
connection. But, there is no guarantee that the IC is not destroyed by the accident.
The protective function do not operate of the operation guarantee range. If the outputs are connected incorrectly,
IC destruction may occur when used outside of the operation guarantee range.
Note 3 : External parts, such as the anti-oscillation part, may become necessary depending on the set condition. Check
their necessity for each set.
Semiconductor Components Industries, LLC, 2013
May, 2013
42512SY/41812SY/O2611SY 20110930-S00012/60811SY/52511SY No.A1959-1/11
LV47009P
Specifications
Absolute Maximum Ratings at Ta = 25C
Parameter
Supply voltage
Symbol
Conditions
Ratings
Unit
VCC max1
No signal, t = 1 minute
26
VCC max2
During operations
18
V
IO peak
Per channel
4.5/ch
A
Allowable power dissipation
Pd max
With an infinity heat sink
50
W
Operating temperature
Topr
-40 to +85
C
Storage temperature
Tstg
-40 to +150
C
Output current
Junction temperature
Tj
Thermal resistance between the junction
j-c
150
1
V
C
C/W
and case
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Recommended Operating Ranges at Ta = 25C
Parameter
Symbol
Load resistance
RL op
Operating supply voltage range
VCC op
Conditions
Ratings
A range not exceeding Pdmax
Unit
4

8 to 16
V
Electrical Characteristics at Ta = 25°C, VCC = 14.4V, RL = 4, f = 1kHz, Rg = 600
Ratings
Parameter
Symbol
Conditions
Unit
min
typ
Quiescent current
ICCO
RL = , Rg = 0
Standby current
Ist
Vst = 0V
Voltage gain
VG
VO = 0dBm
25
19
Voltage gain difference
VG
Output power
PO
THD = 10%
PO max1
Max Power
max
200
26
-1
400
mA
10
A
27
dB
+1
dB
24
W
37
W
PO max2
VCC = 15.2, Max Power
Output offset voltage
Vn offset
Rg = 0
41
Total harmonic distortion
THD
PO = 4W
Channel separation
CHsep
VO = 0dBm, Rg = 10k
55
65
dB
Ripple rejection ratio
SVRR
Rg = 0, fr = 100Hz, VCCR = 0dBm
45
65
dB
Output noise voltage
VNO
Rg = 0, B.P.F. = 20Hz to 20kHz
Input resistance
Ri
Mute attenuation
Matt
VO = 20dBm, mute : on
Standby pin control voltage
Vstby H
Amp : on
2.5
Vstby L
Amp : off
0.0
Mute pin control voltage
Vmute H
Mute : off
Vmute L
Mute : on
-150
W
+150
0.03
0.2
mV
%
80
200
Vrms
40
50
65
k
75
90
dB
VCC
V
0.5
V
1.0
V
Open
0.0
-
* 0dBm = 0.775Vrms
No.A1959-2/11
LV47009P
Package Dimensions
unit : mm (typ)
3236A
29.2
25.6
Maximum power dissipation, Pd max -- W
( 2.5)
4.5
(14.4)
14.5
(11.0)
21.7
18.6 max
(R1.7)
(5.0)
(12.3)
(8.5)
0.4
25
(1.0)
2.0
3.5
1
(2.6)
Pd max -- Ta
70
(22.8)
0.52
4.2
4.0
2.0
60
50
40
30
20
10
0
-40
-20
0
20
40
60
80
100
120
140
160
Ambient temperature, Ta -- °C
SANYO : HZIP25
Block Diagram
Tab
1
VCC3/4
20
IN 1
+
C1
VCC1/2
6
11
+
+
9
-
-
7
OUT 1-
RL
8
+
IN 2
12
DC
C6
OUT 1+
PWR GND1
Protective
circuit
C2
VCC
+ C7
C8
10
+
AC GND
C5
+
+
5
-
-
3
Ripple
Filter
OUT 2+
OUT 2-
RL
PWR GND2
2
25
16
CLIP
DIAG
R2
+
5V
R1
PRE GND
22
15
+
+
17
-
-
19
Low Level
Mute ON
C9
OUT 3+
OUT 3-
RL
PWR GND3
Protective
circuit
18
IN 4
+
C4
+
IN 3
+
C3
Mute
Mute
circuit
13
14
STBY
+5V
ST ON
4
Stand by
Switch
+
+
21
-
-
23
OUT 4+
OUT 4-
RL
PWR GND4
24
No.A1959-3/11
LV47009P
External Components
Part Name
Recommended Value
Purpose
Remarks
C1 to C5
0.47F
Cuts DC voltage
The larger the constant value, the lower the cut-off frequency
C6
22F
Reduces ripples
The larger the constant value, the longer the amplifier ON/OFF time
C7
2200F
Ripple filter
C8
0.1F
Improves oscillation stability
Reducing high-frequency noise
C9
1F
Reduces pop noise
The larger the constant value, the longer the mute ON/OFF time
R1
10k
Reduces pop noise
The larger the constant value, the longer the mute ON/OFF time
R2
4.7k
Pull-up resistor
The values of C1 to C5 must be the same
Reduces pop noise
Eliminating power supply ripples
* The components and constant values within the test circuit are used for confirmation of characteristics and are not guarantees that incorrect or trouble will not
occur in application equipment.
Description of Operation
1. Standby switch function (pin 4)
Threshold voltage of the pin 4 is set by about 2VBE.
The amplifier is turned on by the applied voltage of 2.5V or more. Also, the amplifier is turned off by the applied
voltage of 0.5V or less.
STBY
4
10kΩ
30kΩ
Fig1 Standby equivalent circuit
2. Muting function (pin 22)
The muted state is obtained by setting pin 22 to the ground potential, enabling audio muting.
The muting function is turned on by the applied voltage of 1V or less to the resistance of 22pin (Mute pin). And the
muting function is turn off tjis pin opens.
Also, the time constant of the muting function is determined by external capacitor and resistor constants.
It is concerned with a pop noise in amplifier ON/OFF and mute ON/OFF. After enough examination, please set it.
about
50μA
MUTE
OFF
ON
MUTE
22
200Ω
10kΩ
18kΩ
1μF
+
about
2.5V
Fig2 Mute equivalent circuit
No.A1959-4/11
LV47009P
3. ACGND pin (pin 16)
The capacitor of the pin 16 must use the same capacitance value as the input capacitor.
Also, connect to the same PREGND as the input capacitor.
4. Self-diagnostics function (pin 25)
This function can detect of the unusual state.
(1) Shorting to VCC/Shorting to ground : The pin 25 becomes the low level.
(2) Load shorting
: The pin 25 is alternated between the low level and the high level
according to the output signal.
(3) Output clip detection
: when the output voltage clip, the pin 25 becomes the low level.
* Note: The output offset abnormality is thought of as the leakage current of the input capacitor.
In addition, the pin 25 has become the NPN open collector output (active low).
The pin 25 must be left open when this function is not used.
Output
Voltage
Output Waveform
0V
time
Pin 25
Voltage
5V
R2
Clip
Detection
25
DIAG
time
Fig3 Self-diagnosis Function Diagram
No.A1959-5/11
LV47009P
5. Sound quality (low frequencies)
By varying the value of input capacitor, low-frequency characteristic can be improved.
However, it is concerned the shock noise. Please confirm in each set when the capacitance value varies.
6. Pop noise
For pop noise prevention, it is recommended to use the muting function at the same time.
 Please turn on the muting function simultaneously with power supply on when the amplifier is turned on. Next, turn
off the muting function after the output DC potential stabilization.
 When the amplifier is turn off, turn off the power supply after turning on the muting function.
7. Oscillation stability
Pay due attention on the following points because parasitic oscillation may occur due to effects of the capacity load,
board layout, etc.
Board layout
 Provide the VCC capacitor of 0.1F in the position nearest to IC.
 PREGND must be independently wired and connected to the GND point that is as stable as possible, such as the
minus pin of the 2200F VCC capacitor.
In case of occurrence of parasitic oscillation, any one of following parts may be added as a countermeasure.
Note that the optimum capacitance must be checked for each set in the mounted state.
 Series connection of CR (0.1F and 2.2) between BTL outputs
 Series connection of CR(0.1F and 2.2) between each output pin and GND.
No.A1959-6/11
LV47009P
ICCO -- VCC
VN -- VCC
14
12
Output midpoint voltage, VN -- V
Quiescent current, ICCO -- mA
250
200
150
100
50
0
6
8
10
12
14
16
10
8
6
4
all channel is similar
2
0
6
18
8
Supply voltage, VCC -- V
PO -- VCC
50
Output power, PO -- W
30
20
all channel is similar
16
18
PO -- f
all channel is similar
15
10
5
0
10
0
8
10
12
14
16
18
2 3
5 7 100
2 3
Supply voltage, VCC -- V
Total harmonic distortion, THD -- %
1
7
5
3
2
CH2
CH4
CH3
3
2
0.01
0.1
CH1
2
3
5 7 1
2
3
5 7 10
2
3
5 7 100
Total harmonic distortion, THD -- %
2
1
7
5
3
2
CH2
CH1
CH4
2
0.01
0.1
2
3
5 7 1
2
3
5 7 10
Output power, PO -- W
5 7100k
3
2
0.1
7
5
CH2
CH4
CH1
3
2
CH3
2
3
5 7
2
1
3
5 7 10
2
3
5 7 100
Output power, PO -- W
3
3
2 3
1
7
5
0.01
0.1
THD -- PO
0.1
7
5
5 7 10k
3
2
Output power, PO -- W
10
7
5
2 3
THD -- PO
10
7
5
3
2
0.1
7
5
5 7 1k
Frequency, f -- Hz
THD -- PO
10
7
5
Total harmonic distortion, THD -- %
14
20
10
Total harmonic distortion, THD -- %
12
25
40
Output power, PO -- W
10
Supply voltage, VCC -- V
CH3
2
3
5 7 100
THD -- f
10
7
5
3
2
1
7
5
3
2
0.1
7
5
CH3
CH2
3
2
0.01
10
CH1
CH4
2 3
5 7 100
2 3
5 7 1k
2 3
5 7 10k
2 3
5 7100k
Frequency, f -- Hz
No.A1959-7/11
LV47009P
Respomse -- f
Response -- dB
0
all channel is similar
--1
--2
--3
10
2 3
5 7 100
2 3
5 7 1k
2 3
VNO -- Rg
200
Output noise voltage, VNO -- V
1
5 7 10k
2 3
150
100
all channel is similar
50
0
10
5 7100k
2 3
5 7 100
2 3
5 7 1k
2 3
5 7 10k
2 3
5 7100k
Frequency, f -- Hz
CH.Sep -- f
80
CH2
CH
60
1
CH
CH
4
1
CH
2
40
20
2 3
5 7 100
2 3
5 7 1k
2 3
5 7 10k
CH3
CH
2
CH
CH
4
2
CH
1
CH3
Channel separation -- dB
Channel separation -- dB
CH1
0
10
CH.Sep -- f
80
2 3
60
40
20
0
10
5 7100k
2 3
5 7 100
CH.Sep -- f
80
60
Channel separation -- dB
Channel separation -- dB
3
CH
2
CH3 C
H1
CH3 CH
4
40
20
2 3
5 7 100
2 3
5 7 1k
2 3
5 7 10k
2 3
60
Ripple rejection ratio, SVRR -- dB
Ripple rejection ratio, SVRR -- dB
5 7100k
20
2 3
5 7 100
40
20
0
14
Supply voltage, VCC -- V
2 3
5 7 1k
2 3
5 7 10k
2 3
5 7100k
5 7 10k
2 3
5 7100k
SVRR -- fR
80
all channel is similar
12
2 3
Frequency, f -- Hz
60
10
5 7 10k
40
0
10
5 7100k
SVRR -- VCC
8
2 3
CH4 CH3
CH
4
CH
CH
4
2
CH
1
Frequency, f -- Hz
80
5 7 1k
CH.Sep -- f
80
CH
0
10
2 3
Frequency, f -- Hz
Frequency, f -- Hz
16
18
60
all channel is similar
40
20
0
10
2 3
5 7 100
2 3
5 7 1k
2 3
Ripple frequency, f R -- Hz
No.A1959-8/11
LV47009P
Pd -- PO
Power dissipation, Pd -- W
50
40
30
6V
20
V
V
10
0
0.1
CC
=1
.4V
4
CC
=1
200
150
100
50
0
2
3
5 7
2
1
3
5 7 10
2
3
5 7 100
Output power, PO -- W
0
1.0
2.0
3.0
4.0
5.0
Standby control voltage, Vst -- V
Mute ATT -- V Mute
100
Mute attenuation, Mute ATT -- dB
ICCO -- Vst
250
Quiescent current, ICCO -- mA
60
80
60
all channel is similar
40
20
0
0
1.0
2.0
3.0
4.0
5.0
Mute control voltage, V Mute -- V
PS No.A1959-9/11
LV47009P
HZIP25 Heat sink attachment
Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to
the outer environment and dissipating that heat.
a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be
applied to the heat sink or tabs.
b.
Heat sink attachment
· Use flat-head screws to attach heat sinks.
· Use also washer to protect the package.
· Use tightening torques in the ranges 39-59Ncm(4-6kgcm) .
· If tapping screws are used, do not use screws with a diameter larger
than the holes in the semiconductor device itself.
· Do not make gap, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Take care a position of via hole .
· Do not allow dirt, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Verify that there are no press burrs or screw-hole burrs on the heat sink.
· Warping in heat sinks and printed circuit boards must be no more than
0.05 mm between screw holes, for either concave or convex warping.
· Twisting must be limited to under 0.05 mm.
· Heat sink and semiconductor device are mounted in parallel.
Take care of electric or compressed air drivers
· The speed of these torque wrenches should never exceed 700 rpm,
and should typically be about 400 rpm.
Binding head
machine screw
Countersunk head
mashine screw
Heat sink
gap
Via hole
c.
Silicone grease
· Spread the silicone grease evenly when mounting heat sinks.
· Our company recommends YG-6260 (Momentive Performance Materials Japan LLC)
d.
Mount
· First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board.
· When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening
up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin
doesn't hang.
e.
When mounting the semiconductor device to the heat sink using jigs, etc.,
· Take care not to allow the device to ride onto the jig or positioning dowel.
· Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device.
f.
Heat sink screw holes
· Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used.
· When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used.
A hole diameter about 15% larger than the diameter of the screw is desirable.
· When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about
15% smaller than the diameter of the screw is desirable.
g.
There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not
recommended because of possible displacement due to fluctuation of the spring force with time or vibration.
PS No.A1959-10/11
LV47009P
ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number
of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at
www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no
warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the
application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual
performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical
experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use
as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in
which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for
any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors
harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or
death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the
part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PS No.A1959-11/11
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